JPH0360749B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a chip-shaped electronic component storage band, and in particular to an improved electronic component storage band to realize a supply form suitable for automatic mounting on a circuit board, etc. It is related to.

[Conventional technology]

Conventionally, chip-shaped electronic components 1 (hereinafter referred to as "components") are placed along the longitudinal direction of a carrier tape 2, as shown in FIGS. 1a and 2b and FIG. They are stored in storage recesses 2a provided at intervals, stored in a storage band 4 whose storage recesses 2a are sealed with top tape 3, and when mounted on a circuit board (not shown), the storage band 4 is The top tape 3 was peeled off, and the top surface of the component 1 was suctioned by a vacuum suction mechanism and transferred to a predetermined position on the circuit board.

[Problem to be solved by the invention]

However, the shape of the storage recess 2a in which the component 1 is stored is relatively close to the shape of the component 1, so that the suction position does not shift and the component does not tilt. At times, even a slight load that causes the component 1 to come into contact with the side wall of the storage recess 2a causes suction errors, misalignment, etc., and reduces the mounting rate.

Also, place the component 1 at a predetermined position on the circuit board on the mounting side.
As a means for temporarily fixing the material, an automatic mounter was required to have a dispenser function to pre-apply a certain amount of adhesive resin. Therefore, since it has a dispenser function that operates in the same way as the mechanism that vacuum-chucks and transfers the component 1 to a predetermined position on the circuit board, not only does the equipment cost increase, but also the viscosity, amount, and application of this resin There were drawbacks that required careful handling and management of conditions, etc.

[Means to solve the problem]

SUMMARY OF THE INVENTION An object of the present invention is to provide a chip-shaped electronic component storage band that solves the above-mentioned conventional drawbacks.

According to the present invention, storage recesses for storing chip-like electronic components having adhesive tape attached to the bottom surface of the chip-like electronic components are formed independently and equally spaced in the tape-like body, and the interior of the storage recesses is formed independently at equal intervals. A chip-shaped electronic component storage band is obtained, which is characterized in that a resin having mold releasability is coated on the wall surface.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to a chip-shaped solid electrolytic capacitor using FIGS. 3 and 4. FIG.

Figure 3 shows a chip-shaped electronic component (hereinafter abbreviated as "component") such as a chip-shaped solid electrolytic capacitor according to this embodiment.
1, with the lead terminal 5 bent downward along both sides of the component 1, and the surface of the component 1 in a semi-hardened state with thermosetting property in a band shape with a distance from the tip of the lead terminal 5 approximately at the center of the bottom surface. An adhesive tape 6 having adhesive properties is attached to the surface.

FIG. 4 shows the parts 1 in the state described above in FIG.
The carrier tape 2 is shown stored in the storage recess 2a. The inner wall surface of the storage recess 2a is coated with a resin layer 7 having good mold releasability, such as silicone resin, in advance by known means.
The component 1 is stored in this storage recess 2a with the bottom side with the adhesive tape 6 pasted facing down, and the top tape 3 is placed on the open side of the carrier tape 2, so that the contact surface between the two is
That is, the parts 1 are sequentially stored in the storage recesses 2a of the storage band 4 by pasting them together only in the longitudinal direction of the opening edges by means such as heat sealing. A storage band containing such parts is stored by winding it around a reel or the like. In this state, it is set in an automatic mounter, and while peeling off the top tape 3, the parts are suctioned one by one using a suction nozzle or the like and mounted on the circuit board at a predetermined position. At this time, since the inner wall of the storage recess 2a of the storage band 4 is coated with a resin layer 7 having good mold releasability, the inner wall of the storage recess 2a becomes slippery, so that the storage band and the parts described above are The frictional resistance and adhesion force are reduced.

[Effects of the Invention] As described above, the present invention prevents suction errors, misalignment, etc. even when the electronic component is picked up from a tape having a recess for storing the electronic component even with a slight load that causes the component to come into contact with the side wall of the recess. As a way to solve both problems at once, such as lowering the mounting rate and increasing equipment costs due to dispensers used for temporary fixing when mounting components, adhesive tape is attached to the bottom of electronic components. , and the inner wall surface of the storage recess is coated with a resin that has mold releasability.This eliminates the load caused by catching parts when picking them up, and ensures that they are placed in the specified position on the mounting board. The automatic mounter can be simplified, and the operating rate can be increased.

[Brief explanation of drawings]

1a and 1b are plan and side views showing a conventional tape-shaped storage band for storing chip-shaped electronic components, FIG. 2 is a cross-sectional view taken along line A-A in FIG. 1a, and FIG. Side view of a chip-shaped electronic component by
The figure is a sectional view showing a state in which the chip-shaped electronic component shown in FIG. 3 is housed in the housing recess of the housing band. DESCRIPTION OF SYMBOLS 1... (chip-shaped electronic) component, 2... Carrier tape, 2a... Storage recess, 3... Top tape, 4... Storage band, 5... Lead terminal, 6... Adhesive tape, 7... Mold release Resin layer with good properties.

Claims (1)

[Claims] 1. Storage recesses for accommodating chip-like electronic components with adhesive tape attached to the bottom surface of the chip-like electronic components are formed independently and equally spaced in the tape-like body, and the inner wall surface of the storage recesses is provided with mold releasability. A chip-shaped electronic component storage band characterized by being coated with a resin having the following properties.