JPH0357945U - - Google Patents

Info

Publication number
JPH0357945U
JPH0357945U JP11858889U JP11858889U JPH0357945U JP H0357945 U JPH0357945 U JP H0357945U JP 11858889 U JP11858889 U JP 11858889U JP 11858889 U JP11858889 U JP 11858889U JP H0357945 U JPH0357945 U JP H0357945U
Authority
JP
Japan
Prior art keywords
molten steel
vacuum chamber
degassing device
vacuum
linear motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11858889U
Other languages
English (en)
Other versions
JPH0810202Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP11858889U priority Critical patent/JPH0810202Y2/ja
Application filed filed Critical
Priority to EP90119255A priority patent/EP0422558B1/en
Priority to DE69033718T priority patent/DE69033718T2/de
Priority to DE69034139T priority patent/DE69034139T2/de
Priority to KR1019900015989A priority patent/KR0173782B1/ko
Priority to EP00104809A priority patent/EP1020914B1/en
Priority to US07/594,596 priority patent/US5130498A/en
Publication of JPH0357945U publication Critical patent/JPH0357945U/ja
Application granted granted Critical
Publication of JPH0810202Y2 publication Critical patent/JPH0810202Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】
第１図ａは、本考案のＲＨ脱ガス装置の縦断面
を示す図、第１図ｂは、第１図ａのＡ―Ａ断面図
、第２図は、不活性ガスを吹き込む従来のＲＨ装
置の縦断面図、第３図は、上昇管にリニアモータ
を設置した従来のＲＨ装置の縦断面図、第４図は
、本考案のＲＨ装置及び従来のＲＨ装置を使用し
た場合の脱ガス処理時間と真空度との関係を示す
図、第５図は、本考案のＲＨ装置と従来のＲＨ装
置を使用した場合の脱炭処理時間と溶鋼中Ｃとの
関係を示す図、である。 １はＲＨ装置、２は真空槽、２ａは排気口、３
は上昇管、４は下降管、５は取鍋、６は溶鋼、７
は不活性ガス、８はリニアモータ。

Claims (1)

    【実用新案登録請求の範囲】
  1. ＲＨ真空脱ガス装置の真空槽下部外周に、真空
    槽内溶鋼に上昇管方向から下降管に向かう溶鋼流
    を生じさせる、リニアモータを設置した溶鋼の真
    空脱ガス装置。
JP11858889U 1989-10-09 1989-10-09 半導体装置用軽量基板 Expired - Lifetime JPH0810202Y2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP11858889U JPH0810202Y2 (ja) 1989-10-09 1989-10-09 半導体装置用軽量基板
DE69033718T DE69033718T2 (de) 1989-10-09 1990-10-08 Keramisches Substrat angewendet zum Herstellen einer elektrischen oder elektronischen Schaltung
DE69034139T DE69034139T2 (de) 1989-10-09 1990-10-08 Keramiksubstrat zur Herstellung elektrischer oder elektronischer Schaltungen
KR1019900015989A KR0173782B1 (ko) 1989-10-09 1990-10-08 전기 또는 전자회로의 성형에 사용되는 세라믹기판
EP90119255A EP0422558B1 (en) 1989-10-09 1990-10-08 Ceramic substrate used for fabricating electric or electronic circuit
EP00104809A EP1020914B1 (en) 1989-10-09 1990-10-08 Ceramic substrate used for fabricating electric or electronic circuit
US07/594,596 US5130498A (en) 1989-10-09 1990-10-09 Ceramic substrate used for fabricating electric or electronic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11858889U JPH0810202Y2 (ja) 1989-10-09 1989-10-09 半導体装置用軽量基板

Publications (2)

Publication Number Publication Date
JPH0357945U true JPH0357945U (ja) 1991-06-05
JPH0810202Y2 JPH0810202Y2 (ja) 1996-03-27

Family

ID=14740302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11858889U Expired - Lifetime JPH0810202Y2 (ja) 1989-10-09 1989-10-09 半導体装置用軽量基板

Country Status (1)

Country Link
JP (1) JPH0810202Y2 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1187198A2 (en) 2000-09-04 2002-03-13 Dowa Mining Co., Ltd. Metal-ceramic circuit board and manufacturing method thereof
JP2012146930A (ja) * 2011-01-14 2012-08-02 Mitsubishi Materials Corp パワーモジュール用基板の製造方法及びろう材箔の接合装置
JP2012169318A (ja) * 2011-02-10 2012-09-06 Showa Denko Kk 絶縁回路基板、ならびにパワーモジュール用ベースおよびその製造方法
JP2016034039A (ja) * 2011-04-11 2016-03-10 日立金属株式会社 セラミックス回路基板集合体及びセラミックス回路基板の製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037231A (ja) * 2001-07-23 2003-02-07 Ibiden Co Ltd モジュール用基板
JP2003060137A (ja) * 2001-08-08 2003-02-28 Ibiden Co Ltd モジュール用基板
JP4737885B2 (ja) * 2001-08-08 2011-08-03 イビデン株式会社 モジュール用基板
JP5452345B2 (ja) * 2010-04-28 2014-03-26 昭和電工株式会社 絶縁回路基板およびその製造方法、パワーモジュール用ベースおよびその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1187198A2 (en) 2000-09-04 2002-03-13 Dowa Mining Co., Ltd. Metal-ceramic circuit board and manufacturing method thereof
EP2214202A2 (en) 2000-09-04 2010-08-04 Dowa Metaltech Co., Ltd. Metal-ceramic circuit board
JP2012146930A (ja) * 2011-01-14 2012-08-02 Mitsubishi Materials Corp パワーモジュール用基板の製造方法及びろう材箔の接合装置
JP2012169318A (ja) * 2011-02-10 2012-09-06 Showa Denko Kk 絶縁回路基板、ならびにパワーモジュール用ベースおよびその製造方法
JP2016034039A (ja) * 2011-04-11 2016-03-10 日立金属株式会社 セラミックス回路基板集合体及びセラミックス回路基板の製造方法

Also Published As

Publication number Publication date
JPH0810202Y2 (ja) 1996-03-27

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term