JPH0356294B2 - - Google Patents
Info
- Publication number
- JPH0356294B2 JPH0356294B2 JP61028184A JP2818486A JPH0356294B2 JP H0356294 B2 JPH0356294 B2 JP H0356294B2 JP 61028184 A JP61028184 A JP 61028184A JP 2818486 A JP2818486 A JP 2818486A JP H0356294 B2 JPH0356294 B2 JP H0356294B2
- Authority
- JP
- Japan
- Prior art keywords
- less
- alloy
- strength
- mixture
- conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910045601 alloy Inorganic materials 0.000 claims description 25
- 239000000956 alloy Substances 0.000 claims description 25
- 239000000203 mixture Substances 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 9
- 238000005482 strain hardening Methods 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- 229910052758 niobium Inorganic materials 0.000 claims description 7
- 229910052715 tantalum Inorganic materials 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 15
- 229910000679 solder Inorganic materials 0.000 description 14
- 238000007747 plating Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000007423 decrease Effects 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910017532 Cu-Be Inorganic materials 0.000 description 2
- 229910017813 Cu—Cr Inorganic materials 0.000 description 2
- 229910017827 Cu—Fe Inorganic materials 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2818486A JPS62185847A (ja) | 1986-02-12 | 1986-02-12 | 熱・電気高伝導用高力銅合金とその製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2818486A JPS62185847A (ja) | 1986-02-12 | 1986-02-12 | 熱・電気高伝導用高力銅合金とその製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62185847A JPS62185847A (ja) | 1987-08-14 |
| JPH0356294B2 true JPH0356294B2 (ko) | 1991-08-27 |
Family
ID=12241616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2818486A Granted JPS62185847A (ja) | 1986-02-12 | 1986-02-12 | 熱・電気高伝導用高力銅合金とその製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62185847A (ko) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5833920A (en) * | 1996-02-20 | 1998-11-10 | Mitsubishi Denki Kabushiki Kaisha | Copper alloy for electronic parts, lead-frame, semiconductor device and connector |
| KR100644510B1 (ko) * | 2005-03-17 | 2006-11-10 | 한국기계연구원 | 열간 가공성과 연화성을 개선시킨 고강도 리드프레임재용구리(Ｃｕ)-니켈(Ｎｉ)-망간(Ｍｎ)-실리콘(Ｓｉ)-주석(Ｓｎ)-미쉬메탈(Ｍｓ)계 합금과 그 제조방법 |
| US20100326573A1 (en) * | 2008-01-30 | 2010-12-30 | Kuniteru Mihara | Copper alloy material for electric/electronic component and method for manufacturing the same |
| WO2011019042A1 (ja) * | 2009-08-10 | 2011-02-17 | 古河電気工業株式会社 | 電気電子部品用銅合金材料 |
| WO2011068126A1 (ja) * | 2009-12-02 | 2011-06-09 | 古河電気工業株式会社 | 銅合金板材およびその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5570494A (en) * | 1978-11-18 | 1980-05-27 | Futoshi Matsumura | Wire rod for copper welding excelling in electric conductivity, thermal conductivity and welding performance |
| JPS6274037A (ja) * | 1985-09-26 | 1987-04-04 | Furukawa Electric Co Ltd:The | 高力高導電性銅合金 |
-
1986
- 1986-02-12 JP JP2818486A patent/JPS62185847A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5570494A (en) * | 1978-11-18 | 1980-05-27 | Futoshi Matsumura | Wire rod for copper welding excelling in electric conductivity, thermal conductivity and welding performance |
| JPS6274037A (ja) * | 1985-09-26 | 1987-04-04 | Furukawa Electric Co Ltd:The | 高力高導電性銅合金 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62185847A (ja) | 1987-08-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |