JPH0356207U - - Google Patents
Info
- Publication number
- JPH0356207U JPH0356207U JP11681189U JP11681189U JPH0356207U JP H0356207 U JPH0356207 U JP H0356207U JP 11681189 U JP11681189 U JP 11681189U JP 11681189 U JP11681189 U JP 11681189U JP H0356207 U JPH0356207 U JP H0356207U
- Authority
- JP
- Japan
- Prior art keywords
- microwave
- circuit
- high frequency
- pattern
- ground pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Waveguides (AREA)
Description
第１図はこの考案の一実施例を示す高周波回路
接続構造の平面図、第２図は第１図の断面図、第
３図は従来の高周波回路接続構造を示す平面図、
第４図は第３図の断面図である。
図において、２…第１のマイクロ波ＩＣ回路の
マイクロ波ＩＣ基板、８…ＲＦモジユール、１２
…表裏接続用グランドパターン、１３…グランド
用端子である。なお、図中、同一符号は同一、又
は相当部分を示す。
FIG. 1 is a plan view of a high frequency circuit connection structure showing an embodiment of this invention, FIG. 2 is a sectional view of FIG. 1, and FIG. 3 is a plan view showing a conventional high frequency circuit connection structure.
FIG. 4 is a sectional view of FIG. 3. In the figure, 2... microwave IC board of the first microwave IC circuit, 8... RF module, 12
. . . Ground pattern for front and back connection, 13 . . . Ground terminal. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
成された第１のマイクロ波ＩＣ回路と上記第１の
マイクロ波ＩＣ回路と同様構成の第２のマイクロ
波ＩＣ回路を収納したＲＦモジユールを実装した
高周波回路において、第１のマイクロ波ＩＣ回路
のマイクロ波ＩＣ基板の表面と裏面をパターンに
より接続した表裏接続用グランドパターンと上記
表裏接続用グランドパターンに取付けるバネ状弾
性体からなるグランド端子を設け、グランド端子
をＲＦモジユールに接触させたことを特徴とする
高周波回路接続構造。 In a high frequency circuit mounting an RF module housing a first microwave IC circuit constituted by a microwave IC substrate and a metal carrier and a second microwave IC circuit having the same configuration as the first microwave IC circuit. , a ground pattern for connecting the front and back surfaces of the microwave IC board of the first microwave IC circuit is connected to the back surface by a pattern, and a ground terminal made of a spring-like elastic body attached to the ground pattern for connecting the front and back sides. A high frequency circuit connection structure characterized by being in contact with an RF module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11681189U JPH0356207U (en) | 1989-10-04 | 1989-10-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11681189U JPH0356207U (en) | 1989-10-04 | 1989-10-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0356207U true JPH0356207U (en) | 1991-05-30 |
Family
ID=31665074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11681189U Pending JPH0356207U (en) | 1989-10-04 | 1989-10-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356207U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007028940A (en) * | 2005-07-25 | 2007-02-08 | Morinaga & Co Ltd | Cake mold for baking cake dough and assembly set for the same |
-
1989
- 1989-10-04 JP JP11681189U patent/JPH0356207U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007028940A (en) * | 2005-07-25 | 2007-02-08 | Morinaga & Co Ltd | Cake mold for baking cake dough and assembly set for the same |