JPH02114935U - - Google Patents
Info
- Publication number
- JPH02114935U JPH02114935U JP2437989U JP2437989U JPH02114935U JP H02114935 U JPH02114935 U JP H02114935U JP 2437989 U JP2437989 U JP 2437989U JP 2437989 U JP2437989 U JP 2437989U JP H02114935 U JPH02114935 U JP H02114935U
- Authority
- JP
- Japan
- Prior art keywords
- microwave
- pattern
- ground pattern
- board
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図はこの考案の一実施例に示すマイクロ波
ＩＣ回路の平面図、第２図は第１図のＸ−Ｘ′断
面図、第３図、第４図は従来のマイクロ波ＩＣ回
路を示す図であり、図において、１はセラミツク
基板、２は信号用金パターン、３は金属キヤリア
、４はキヤリア固定用ネジ、５は信号ライン接続
用金リボン、６はシヤーシ、７は裏面グランドパ
ターン、８は表裏接続用パターン、９はグランド
用端子である。なお、図中同一符号は、同一或い
は相当部分を示す。
Fig. 1 is a plan view of a microwave IC circuit according to an embodiment of this invention, Fig. 2 is a sectional view taken along line X-X' in Fig. 1, and Figs. 3 and 4 are views of a conventional microwave IC circuit. In the figure, 1 is a ceramic substrate, 2 is a signal gold pattern, 3 is a metal carrier, 4 is a carrier fixing screw, 5 is a gold ribbon for signal line connection, 6 is a chassis, and 7 is a back ground pattern. , 8 is a front and back connection pattern, and 9 is a ground terminal. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
成されたマイクロ波ＩＣ回路において、マイクロ
波ＩＣ基板表面と裏面をパターンにより接続した
表裏接続用グランドパターンと上記表裏接続用グ
ランドパターンに取り付けられたバネ状の弾性体
からなるグランド端子を設けたことを特徴とする
マイクロ波ＩＣ回路。 In a microwave IC circuit constituted by a microwave IC board and a metal carrier, a ground pattern for connecting the front and back surfaces of the microwave IC board and a ground pattern for connecting the front and back sides by a pattern, and a spring-like elasticity attached to the ground pattern for connecting the front and back sides. A microwave IC circuit characterized by having a ground terminal consisting of a body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2437989U JPH02114935U (en) | 1989-03-03 | 1989-03-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2437989U JPH02114935U (en) | 1989-03-03 | 1989-03-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02114935U true JPH02114935U (en) | 1990-09-14 |
Family
ID=31244179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2437989U Pending JPH02114935U (en) | 1989-03-03 | 1989-03-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02114935U (en) |
-
1989
- 1989-03-03 JP JP2437989U patent/JPH02114935U/ja active Pending
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