JPH0354847A - Substrate for electronic component mounting - Google Patents
Substrate for electronic component mountingInfo
- Publication number
- JPH0354847A JPH0354847A JP1189817A JP18981789A JPH0354847A JP H0354847 A JPH0354847 A JP H0354847A JP 1189817 A JP1189817 A JP 1189817A JP 18981789 A JP18981789 A JP 18981789A JP H0354847 A JPH0354847 A JP H0354847A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- hole
- holes
- pins
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract description 6
- 239000004020 conductor Substances 0.000 claims abstract description 82
- 238000003780 insertion Methods 0.000 abstract description 11
- 230000037431 insertion Effects 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野]
本発明は,いわゆるビングリノドアレイと呼ばれる導体
ピンを有する電子部品搭載用基板.特にそのスルーホー
ルの形状に関する。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a board for mounting electronic components having conductor pins called a so-called Bingrinode array. Especially regarding the shape of the through hole.
第8図及び第9図に示すごとく5 ピングリッドアレイ
と呼ばれる電子部品搭載用)ji仮9は,その基板90
に形威された導体回路93と.当該基仮90が実装され
る他の大型基板側に形威されている導体回路(図示略)
とを,複数の導体ビン8によって電気的に接続するもの
である。As shown in Fig. 8 and Fig. 9, the board 90 (for mounting electronic components called pin grid array) is
A conductor circuit 93 shaped like . A conductor circuit (not shown) formed on the side of another large board on which the base 90 is mounted.
are electrically connected by a plurality of conductor bins 8.
上記導体ピン8は,これが固定または植設される基板9
0が小さいこともあって,非常に小さいものである。The conductor pin 8 is attached to the substrate 9 on which it is fixed or implanted.
It is extremely small, partly because 0 is small.
該導体ピン8は,第8図及び第9図に示すごとく,頭部
81と.脚部83と.両者の間に設けた1つのツバ部8
2とを有する。As shown in FIGS. 8 and 9, the conductor pin 8 has a head 81 and . The legs 83 and . One collar portion 8 provided between the two
2.
また.導体ピン8には.第8図,第9図に符号80で示
すごとく,上記ツバ部82の下方にもう1つの下方ツバ
部85を有するスタンドオフピンと称されるものがある
。また.前記したツバ部82のみを有する導体ピン8は
.スタンダードピンと称されるものである。Also. For conductor pin 8. As shown by reference numeral 80 in FIGS. 8 and 9, there is a so-called standoff pin which has another lower collar portion 85 below the collar portion 82. Also. The conductor pin 8 having only the collar portion 82 described above is. This is called a standard pin.
本発明は,両種類のビンに共通する技術であるから.以
下にはスタンダードビンを代表として示す。This is because the present invention is a technology common to both types of bottles. The standard bottle is shown below as a representative.
しかして,基板90のスルーホール9lには,上記導体
ピン8の頭部8lが挿入され,両者間の電気的接続が行
われる。なお.同図において,符号96はソルダーレジ
スト膜,95は電子部品.94はボンディングワイヤー
.9l1はスルーホール91のランドである.
(解決しようとする課題〕
ところで,基板90のスルーホール9lに,導体ピン8
の頭部8lを挿入する際には,第10図に示すごとく,
スルーホール91に頭部81を押圧する。そして,この
押圧挿入は多数の導体ピン8を,ピン立て装置を用いて
半ば強制的に行う.即ち,多数の導体ビン8を予めピン
立てパレット(図示略)に立てておき.導体ビン8の上
方より基ヰ反90を,導体ピン8とスノレーホーノレ9
1の位置を合わせて押圧する.これにより,導体ピン8
の頭部81が,スルーホール9l内に圧入され,嵌合す
る.
そのため スルーホール91の中心線Sと導体ビン8の
中心線Pが一致しているときには円滑な挿入が行われる
。Thus, the head 8l of the conductor pin 8 is inserted into the through hole 9l of the substrate 90, and an electrical connection is established between the two. In addition. In the figure, numeral 96 is a solder resist film, and 95 is an electronic component. 94 is bonding wire. 9l1 is the land of through hole 91. (Problem to be solved) By the way, the conductor pin 8 is inserted into the through hole 9l of the board 90.
When inserting the head 8l, as shown in Figure 10,
The head 81 is pressed into the through hole 91. This press-insertion is semi-forcibly performed using a pin stand device for a large number of conductor pins 8. That is, a large number of conductor bins 8 are set up in advance on a pin stand pallet (not shown). The base wire 90 is connected to the conductor pin 8 and the snow hole hole 9 from above the conductor pin 8.
Align position 1 and press. As a result, conductor pin 8
The head 81 of is press-fitted into the through hole 9l and fitted. Therefore, when the center line S of the through hole 91 and the center line P of the conductor bottle 8 coincide, smooth insertion is performed.
しかし.同図に示すごとく.両者の中心線SとPとが一
致していない場合には,導体ビン8の頭部81によって
スルーホール9lの開口端910が無理に押圧されるこ
ととなる。そのため,かかる押圧によってスルーホール
にクラノクが生ずることがある。また,かかる無理な押
圧が行われると 内部歪が生しているため,挿入時には
クランクが生していなくても,冷熱サイクルテストの際
にクランクが発生する.
また,上記クランクが,スルーホールに連結された導体
回路に及ぶときには.導体回路が切断され電子部品搭載
用基板全体が不良品となってしまう。but. As shown in the figure. If the center lines S and P do not match, the head 81 of the conductor bottle 8 will forcefully press the open end 910 of the through hole 9l. Therefore, such pressure may cause cracks in the through hole. In addition, if such excessive pressure is applied, internal distortion occurs, so even if there is no cranking at the time of insertion, cranking will occur during the thermal cycle test. Also, when the above crank extends to the conductor circuit connected to the through hole. The conductor circuit is cut and the entire electronic component mounting board becomes a defective product.
本発明はかかる従来の問題点に鑑み,スルーホールへ導
体ビンを円滑に挿入できる電子部品搭載用基板を提供し
ようとするものである。SUMMARY OF THE INVENTION In view of these conventional problems, the present invention seeks to provide a board for mounting electronic components on which a conductor bottle can be smoothly inserted into a through hole.
本発明は,導体ビンを挿入すべきスルーホールを有する
電子部品搭載用基板において,該スルーホールは導体ピ
ンを挿入する側に外方に向かって拡開するテーパ状開口
部を有していることを特徴とする電子部品搭載用基板に
ある。The present invention provides an electronic component mounting board having a through hole into which a conductor pin is inserted, wherein the through hole has a tapered opening that widens outward on the side into which the conductor pin is inserted. A board for mounting electronic components is characterized by:
本発明において注目すべきことは,スルーホールにおけ
る導体ビン挿入側の開口部がテーパ状開口部を有してい
ることである。What should be noted in the present invention is that the opening on the conductor bottle insertion side of the through hole has a tapered opening.
上記テーパ状開口部は.直線状(第2図)であっても.
孤状(第7図)であっても良い。また直線状の場合には
,第2図に示すごとく,スルーホールの中心線とテーパ
状開口部の内壁とにより作られる開口角度αが20〜7
0度であることが好ましい.20度未満では.導体ピン
頭部の挿入が円滑でない。一方,70度を越えると開口
端が大きな径となりすぎ,ランドと導体ビンのツバ部と
の接触面積が充分取れない。また,テーバ状開口部から
スルーホールの直線状内壁へ導体ピンが円滑に挿入され
難い。The above tapered opening is. Even if it is straight (Fig. 2).
It may also be arc-shaped (Fig. 7). In addition, in the case of a straight hole, as shown in Figure 2, the opening angle α created by the center line of the through hole and the inner wall of the tapered opening is 20 to 7.
Preferably it is 0 degrees. Below 20 degrees. The conductor pin head is not inserted smoothly. On the other hand, if the angle exceeds 70 degrees, the diameter of the opening end becomes too large, and a sufficient contact area between the land and the collar of the conductor bottle cannot be secured. Furthermore, it is difficult to smoothly insert the conductor pin from the tapered opening into the linear inner wall of the through hole.
上記スルーホールに挿入する導体ビンは,通常は,第6
図に示すごとく従来と同様に平板状のツバ部を有するも
のを用いる.一方.導体ビンは第1図,第3図に示すご
とく.ツバ部がテーパー状を有するものを用いることが
好ましい。即ち,この導体ビンは.ツバ部がスルーホー
ルのテーバ状開口部に接触するテーバ部分を有するもの
である。The conductor bin inserted into the above-mentioned through hole is usually the sixth
As shown in the figure, a type with a flat collar is used as in the conventional case. on the other hand. The conductor bins are as shown in Figures 1 and 3. It is preferable to use one having a tapered brim. In other words, this conductor bin is. The collar portion has a tapered portion that comes into contact with the tapered opening of the through hole.
第1請求項の発明において,電子部品搭載用基板のスル
ーホールは.導体ビンの挿入側に向かってテーパ状開口
部を有しているため,スルーホールに導体ピンの頭部を
挿入する際,該頭部は円滑にスルーホール内に導かれ,
挿入される。In the invention of claim 1, the through hole of the electronic component mounting board is. Since the conductor pin has a tapered opening toward the insertion side, when inserting the head of the conductor pin into the through hole, the head is smoothly guided into the through hole.
inserted.
そのため.多数のスルーホールに多数の導体ピンを,ビ
ン立て装置によって半ば強制的に挿入しても,導体ピン
は円滑にスルーホール内に挿入される。また.挿入時に
前記第10図に示すごとく,スルーホールの中心線と導
体ビンの中心線とが一致していない場合でも,導体ピン
の頭部はテーパ状開口部の壁面に接触しつつスルーホー
ル内に案内され,スルーホール内に挿入される。Therefore. Even if a large number of conductor pins are semi-forcibly inserted into a large number of through-holes using a bottle holder, the conductor pins are smoothly inserted into the through-holes. Also. As shown in Fig. 10 above, even if the center line of the through hole and the center line of the conductor bottle do not coincide with each other during insertion, the head of the conductor pin will be in contact with the wall of the tapered opening and inserted into the through hole. guided and inserted into the through hole.
したがって,導体ピンの頭部は.スルーホール内に円滑
に挿入され,スルーホールの開口端や内壁,更には導体
回路にクランクを生ずることがない。それ故,スルーホ
ールに導体ビンを円滑に挿入することができる電子部品
搭載用基板を提供することができる。Therefore, the head of the conductor pin is. It is inserted smoothly into the through hole and does not cause cranking to the open end or inner wall of the through hole, or even to the conductor circuit. Therefore, it is possible to provide an electronic component mounting board in which a conductor bottle can be smoothly inserted into a through hole.
また.第2請求項の発明においては.導体ピンが上記テ
ーバ状ツバ部を有し,該ツバ部のテーバ部がスルーホー
ルのテーパ状開口部と接触している。そのため.導体ビ
ンがスルーホール内に円滑に挿入されると共に,導体ビ
ンが基板に対して強固に固定される。また,第1請求項
の発明と同様の効果を得ることができる。Also. In the invention of the second claim. The conductor pin has the tapered flange, and the tapered portion of the flange is in contact with the tapered opening of the through hole. Therefore. The conductor bin is smoothly inserted into the through hole, and the conductor bin is firmly fixed to the board. Moreover, the same effect as the invention of the first claim can be obtained.
第1実施例
本発明の実施例にかかる電子部品搭載用基板につき,第
1図〜第5図を用いて説明する。First Embodiment An electronic component mounting board according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5.
本例の電子部品搭載用基板は,第1図に示すごとく,ス
ルーホールlに導体ピン2を挿入してなり,上記スルー
ホール1は導体ピン2を挿入する側に外方に向かって拡
開するテーパ状開口部IIを有し,また導体ビン2は該
テーバ状開口部11に接触するテーバ状のツバ部22を
有する.その他は.前記従来技術と同様である.
上記スルーホール1は,基板9oを貫通した孔で,その
孔内にメノキ膜を施してなるものである。As shown in Fig. 1, the electronic component mounting board of this example has a conductor pin 2 inserted into a through hole 1, and the through hole 1 expands outward toward the side where the conductor pin 2 is inserted. The conductor bottle 2 has a tapered opening II, and the conductor bottle 2 has a tapered collar 22 that contacts the tapered opening 11. Others. This is the same as the prior art described above. The through hole 1 is a hole that penetrates the substrate 9o, and is formed by applying an agate film inside the hole.
このスルーホールlは,上方開口部にはランド13を有
する.そして,下方開口部がテーパ状開口部11を形威
している.該テーパ状開口部11においては,第2図に
示すごとく,スルーホールlの中心線Sとテーパ状開口
部1lとがなす開口角度αが35度である。また,スル
ーホールlの直径Xは約0.55+m,テーバ状開口部
の開口端の直径Yは約1.2#である。This through hole l has a land 13 at its upper opening. The lower opening forms a tapered opening 11. In the tapered opening 11, as shown in FIG. 2, the opening angle α between the center line S of the through hole 1 and the tapered opening 1l is 35 degrees. Further, the diameter X of the through hole l is approximately 0.55+m, and the diameter Y of the opening end of the tapered opening is approximately 1.2#.
一方,導体ピン2ぱ.第3図に示すごとく,頭部2lと
脚部23と,両者の間に設けたテーパ状のツバ部22を
有する。該ツバ部22は,上方に直線状のテーバ部22
1を有し.下端面は平面である。しかして,テーパ部2
21と導体ビンの中心線Pとのなすテーパ角度βは,前
記スルーホールの開口角度αと同しである。On the other hand, conductor pin 2. As shown in FIG. 3, it has a head portion 2l, a leg portion 23, and a tapered collar portion 22 provided between the two. The collar portion 22 has a straight tapered portion 22 extending upwardly.
1. The lower end surface is a flat surface. However, the taper part 2
The taper angle β between the conductor pin 21 and the center line P of the conductor bottle is the same as the opening angle α of the through hole.
また.導体ピン2の頭部は.第4図に示すごとく,楕円
状を呈し.その長径部の直径はスルー承一ル1の内径よ
り若干大きい。なお.頭部の形状は、第5図に示すごと
く十文字状頭部210であっても,また円形状であって
も良い。Also. The head of conductor pin 2 is. As shown in Figure 4, it has an elliptical shape. The diameter of its long diameter portion is slightly larger than the inner diameter of the through fitting 1. In addition. The shape of the head may be a cross-shaped head 210 as shown in FIG. 5, or may be circular.
次に.作用効果につき説明する。next. The action and effect will be explained.
まず,導体ピン2をスルーホールlに挿入するに当たっ
ては,従来と同様に,ピン立て装置におけるピン立てパ
レソトに,多数の導体ピン2を整列させて立てる。次い
で,このように整列させた導体ビン2の頭部2lの上方
に.該頭部2lとスルーホール1の位置とを位置合わせ
して基板9oを配置する。その後,基板90を下降させ
て導体ピン2に押圧し,頭部21をスルーホールl内に
挿入する。First, when inserting the conductor pins 2 into the through-holes 1, a large number of conductor pins 2 are aligned and set on a pin stand in a pin stand as in the conventional case. Next, above the heads 2l of the conductor bins 2 arranged in this way. The substrate 9o is placed with the head 2l and the through hole 1 aligned. Thereafter, the board 90 is lowered and pressed against the conductor pin 2, and the head 21 is inserted into the through hole l.
しかして.上記挿入においては.導体ビン2の頭部21
はまずスルーホール1のテーパ状開口部ll内に入り,
次いでスルーホール1内に挿入される.このとき.スル
ーホール1の中心線Sと導体ビン2の中心線Pとが一致
していないとき(前記第10図参照)には,導体ピン2
の頭部はテーパ状開口部I1の下而に接触し,更に該テ
ーパ状開口部l1に沿ってスルーホール1の方向に案内
され.スルーホール1内に挿入される.それ故,導体ピ
ンは円滑にスルーホール内に挿入される.したがって,
スルーホールの開向端や内壁,更には導体回路にクラン
クを生ずることがない。また.挿入時にスルーホール内
壁に内部歪を生ずることもない。However. In the above insertion. Head 21 of conductor bottle 2
first enters the tapered opening ll of the through hole 1,
Next, it is inserted into through hole 1. At this time. When the center line S of the through hole 1 and the center line P of the conductor pin 2 do not match (see Fig. 10 above), the conductor pin 2
The head of the head contacts the lower part of the tapered opening I1 and is further guided in the direction of the through hole 1 along the tapered opening I1. Insert into through hole 1. Therefore, the conductor pin can be inserted smoothly into the through hole. therefore,
No cranking occurs on the open end of the through hole, on the inner wall, or even on the conductor circuit. Also. No internal strain occurs on the inner wall of the through hole during insertion.
第2実施例
本例は,第6図に示すごとく,導体ビン3のツバ部32
が上下面とも平面であるものである。また.導体ピン3
は,頭部31と脚部33とを有する。この導体ピン3は
,前記従来技術のものと同様である。また.電子部品搭
載用基板のスルーホール1は.第I実施例と同様に,テ
ーパ状開口部1lを有する。その他は,第1実施例と同
様であ本例においても.第1実施例と同様の効果を得る
ことができる。なお,導体ビン3は,ツバ部32の上面
がテーバ状でないため,第1実施例に比して,導体ピン
3とスルーホール1との嵌合状態が若干緩い。しかし.
テーパ状開口部Itとツバ部32との空間部は,その後
の工程で半田接合され,強固な結合が得られる。Second Embodiment In this example, as shown in FIG.
Both the top and bottom surfaces are flat. Also. Conductor pin 3
has a head 31 and legs 33. This conductor pin 3 is similar to that of the prior art described above. Also. Through hole 1 of the board for mounting electronic components is. Like the first embodiment, it has a tapered opening 1l. The rest is the same as in the first embodiment, and also in this embodiment. The same effects as in the first embodiment can be obtained. Note that in the conductor pin 3, since the upper surface of the collar portion 32 is not tapered, the fit between the conductor pin 3 and the through hole 1 is slightly looser than in the first embodiment. but.
The space between the tapered opening It and the flange portion 32 is soldered together in a subsequent process to obtain a strong connection.
第3実施例
本例は,第7図に示すごとく.スルーホールlにおける
導体ピン挿入側に.弧状のテーパ状開口部15を設けた
ものである。その他は第1実施例と同様である.
本例によれば.導体ピン挿入時には.導体ピンの頭部が
弧状のテーパ状開口部15の曲面に沿ってスルーホール
1内に挿入されていく。それ故,第1実施例に比して,
一層挿入が円滑である。Third Embodiment This example is shown in Fig. 7. On the conductor pin insertion side of through hole l. An arcuate tapered opening 15 is provided. The rest is the same as the first embodiment. According to this example. When inserting conductor pins. The head of the conductor pin is inserted into the through hole 1 along the curved surface of the arc-shaped tapered opening 15. Therefore, compared to the first embodiment,
Insertion is even smoother.
また,本例においても,導体ピンは.上記テーバ状開口
部l5に接触する曲面状のテーバ状ツバ部を有すること
.或いは平板状のツバ部(第6図参照)を有することい
ずれであっても良い。Also, in this example, the conductor pin is . It has a curved tapered flange that contacts the tapered opening l5. Alternatively, it may have a flat plate-shaped flange (see FIG. 6).
また,これまでの説明においては,導体ビンはいわゆる
スタンダートビンについて述べてきたが前記のごとくス
タンドオフピンにも適用しうることは勿論である。Furthermore, in the explanation so far, the conductor bin has been described as a so-called standard bin, but it goes without saying that it can also be applied to standoff pins as described above.
第l図〜第5図は第1実施例の電子部品搭載用基板を示
し.第1図はその断面図.第2図はスルーホール部分の
拡大断面図,第3図は導体ピンの側面図,第4図及び第
5図は導体ビンの平面図第6図は第2実施例の電子部品
搭載用基{反の要部断面図,第7図は第3実施例の電子
部品搭載用基板の要部断面図.第8図〜第10図は従来
の電子部品搭載用基板を示し,第8図はその裏面斜視レ
1第9図はその断面図,第10図は導体ピン挿入時の説
明図である。
1・・・スルーホール
1l 15・・・テーパ状開口p
2.3・・・導体ピン
21.31・・・頭部
22・・・テーパ状ツバ部
願人
イビデン株式会
理人Figures 1 to 5 show the electronic component mounting board of the first embodiment. Figure 1 is a cross-sectional view. Figure 2 is an enlarged sectional view of the through-hole part, Figure 3 is a side view of the conductor pin, Figures 4 and 5 are plan views of the conductor bin, and Figure 6 is the electronic component mounting base of the second embodiment. Figure 7 is a sectional view of the main part of the electronic component mounting board of the third embodiment. 8 to 10 show a conventional board for mounting electronic components, FIG. 8 is a perspective view of the rear surface 1, FIG. 9 is a sectional view thereof, and FIG. 10 is an explanatory view when a conductor pin is inserted. 1...Through hole 1l 15...Tapered opening p 2.3...Conductor pin 21.31...Head 22...Tapered collar Applicant Ibiden Co., Ltd. Director
Claims (2)
部品搭載用基板において,該スルーホールは導体ピンを
挿入する側に外方に向かって拡開するテーパ状開口部を
有していることを特徴とする電子部品搭載用基板。(1) In an electronic component mounting board having a through hole into which a conductor pin is inserted, the through hole has a tapered opening that widens outward on the side into which the conductor pin is inserted. Features: Board for mounting electronic components.
搭載用基板において,上記スルーホールは導体ピンを挿
入する側に外方に向かって拡開するテーパ状開口部を有
し,また導体ピンは該テーパ状開口部に接触するテーパ
状のツバ部を有することを特徴とする電子部品搭載用基
板。(2) In a board for mounting electronic components in which a conductor pin is inserted into a through hole, the through hole has a tapered opening that widens outward on the side where the conductor pin is inserted, and the through hole has a tapered opening that expands outward on the side where the conductor pin is inserted. An electronic component mounting board characterized by having a tapered flange that contacts the tapered opening.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1189817A JPH0354847A (en) | 1989-07-21 | 1989-07-21 | Substrate for electronic component mounting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1189817A JPH0354847A (en) | 1989-07-21 | 1989-07-21 | Substrate for electronic component mounting |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0354847A true JPH0354847A (en) | 1991-03-08 |
Family
ID=16247707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1189817A Pending JPH0354847A (en) | 1989-07-21 | 1989-07-21 | Substrate for electronic component mounting |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0354847A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001284420A (en) * | 2000-02-14 | 2001-10-12 | Advantest Corp | Contact structure and its manufacturing method |
-
1989
- 1989-07-21 JP JP1189817A patent/JPH0354847A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001284420A (en) * | 2000-02-14 | 2001-10-12 | Advantest Corp | Contact structure and its manufacturing method |
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