CA1200862A - Terminal pin carrier and fabrication method - Google Patents
Terminal pin carrier and fabrication methodInfo
- Publication number
- CA1200862A CA1200862A CA000434045A CA434045A CA1200862A CA 1200862 A CA1200862 A CA 1200862A CA 000434045 A CA000434045 A CA 000434045A CA 434045 A CA434045 A CA 434045A CA 1200862 A CA1200862 A CA 1200862A
- Authority
- CA
- Canada
- Prior art keywords
- card
- terminal
- pins
- circuit board
- terminal pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
A terminal pin carrier comprising a card of low-cost expendable material of sufficient rigidity and thickness to secure a plurality of terminal pins therein in accurately aligned relative disposition corresponding to an intended socket contact pattern. After installation of the terminal pins as a group into an associated circuit board and soldering of the pins to the board, the card can be manually peeled from the terminal pins to leave an array of socket contacts into which an integrated circuit or other electronic component can be plugged.
Description
FIELD OF TEIE INVENTION
This invention relates to carriers for electrical terminal pins and a method
This invention relates to carriers for electrical terminal pins and a method
2 Of handling such terminal pins for installation onto an associated circllit board ~ BACKGROUND OF THE INVENTION
. .
. .
3 ; Electronic components such as integrated circuits have electrical leads
4 which are mounted to a circuit board by means of a socket mounted on the circuit t 5 board and which includes a plurality of socket contacts each receiving a respective 6 lead of the electronic component, each socket contact having an associated pin 7 portion electrically coMected to the associated circuit such as by soldering or wire 8 ; wrapping. Many integrated circuits and electronic components employ the well 9 i known dual in-line terminal configuration in which two parallel arrays of leads extend from the longer sides of a rectangular package. The socket contact arrangement corresponds to the terminal arrangement of the component which is 1~ 1 to be installed thereirL The component socket is relatively expensive and for many 13 l~, electronic circuits cc)nstitutes a significant portion of the manufacturing cost of 14 the circuit.
Techniques have been employed by which an array of socket contacts are 16 installed directly in a circuit board for receipt of an associated componen~ The 17 socket contacts in a desired contsct configuration are initially supported by a 18 carrier structure which maintains the array of contacts in a desired arrangement 19 and permits handling and installation of the entire array onto a circuit board. Such a carrier eliminates the need for handling and installation of individual socket contacts, which would be extremely inefficient and commercially impractical for 2 circuit manufacturing purposes. The carrier structures employed heretofore 3 provide the intended ease of handling of the socket contact array, but at a 4 relatively high materials and fabrication cost.
One known carrier is fabricated of aluminum and includes a plurality of legs 6 formed much like a lead frame from an aluminum strip in a desired lead configuration, typics1ly a dual in-line configuration, with the legs being inserted 8 into respective socket contacts of the terminals. In use, the terminsl pins 9 supported by the csrrier legs are installed in a circuit board and soldered into position thereon, after which the carrier is removed to leave the socket contacts in position for installation of an sssociated component. The carrier is fabricated by 12 punching, cutting, and forming of aluminum strip, which is expensive and which 13 requires a multiple step process of some complexity. Moreover, great care must be 14 exercised in inserting the aluminum legs of the carrier into the socket contacts of 15 ll the terminsl pins to avoid damsging the gold plating and contact surf~ces of such 16 terminals. Great care must slso be employed in removing the csrrier from the 17 socket contacts to avoid damage to the contscts.
SIJMMARY OF THE INVENTIO~
, 18 ; In accordance with this invention a terminsl pin csrrier is provided which is 19 of substantially less cost than prior carriers, and which is essily fabricated with simple apparatus in an efficient high speed manner. The carrier comprises a card 21 of low cost material of a predetermined size and configuration and supporting an 22 array of terminal pins in respective holes which have been previously provided in 23 the card. The card is sufficiently rigid under normal handling during fabricstion of the carrier and during installation of the pins on a circuit board to remain 2 subshntially planar and retain the pins in accurate aligned disposition. The card is 3 pliant in response to a force sufficient to peel the card from the terminal pins 4 after the pins have been secured to a circuit board. The pins are accurately maintained in relative disposition by the card such that they are readily installed as 6 a group into openings provided in a circuit board for retention thereon by soldering 7 or other suitable technique. After solderin~ of the terminal pins to-the circuit 8 board, the card is peeled away from the socket contact portions of the pins to g leave those contacts in the intended socket arrangement for receipt of an associated electronic component. The card is of an inexpensive material such as ll cardboard which is sufficiently rigid to retain the spatial orientation of the 12 terminals and which will not burn or otherwise be destroyed at the soldering 13 temperature to which the attached terminal pins are exposed.
14 To fabricate the novel carrier, cards are cut to size and are punched or otherwise formed with a plurality of holes in a pattern corresponding to the 16 , ! intended socket configuration. Terminal pins are pressed into the respective holes, t 17 with the socket heads being retained by the card. The carriers are usually18 , packaged in groups typically on a foam sheet into which the pin ends are pressed to 19 facilitate handling and transport of the carriers.
DESCRIPTION OF THE DRAWINGS
The invention will be more fully understood from the follswing detailed 21 description taken in conjunction with the accompanying drawings, in which:22 Fig. 1 is a sectional elevation view of the terminal pin carrier in accordance 23 with the invention;
Fig. 2 is a top view of the pin carrier of Fig. 1;
2 Fig. 3 is a sectional elevation view of a terminal pin of a type employed in 3 the invention;
4 Fig. 4 is a cutaway pictorial view of the pin carrier in position for insertion into a circuit board;
6 Fig. S is a pictorial view, partly in section, of the pin carrier installed in a 7 circuit board; -8 Fig. 6 is a cutaway pictorial view showing the carrier card being peeled 9 from the installed terminal pins; and Figs. 7 through 10 are elevation views, partly in section, of apparatus for 11 fabrication of the pin carrier.
DErAILED DESCRIPTION OF THE INVENTION
12 ii A terminal pin carrier in accordance with the invention is illustrated in 13 Figs. 1 and 2 and includes a card 10 of rectangular configuration and having 14 ,~ disposed along the respective longer edges a parallel array of terminal pins 12 in well known dual in-line configuration. Each terminal pin 12 includes an enlarged16 SOcKet contact head portion 14, a smaller body portion 16, and a still smaller pin 17 ~ portion 18, with a socket opening 20 being provided within the head and shank 18 portions of the terminaL The contact structure of the terminal pin is typically as 19 shown in Fig. 3. The delicate interior contact structure is not subjected to any engagement by the novel carrier. The head portion of each pin is retained within a 21 respective opening 22 provided through the card 10. The card 10 is of an22 inexpensive material having sufficient rigidity, thickness, and mechanical strength 23 to remain substantially planar and to positively retain the terminal pins 12 in l;~D~
accurate aligned parallel disposition, such that the array of pins can be readily 2 plugged into a corresponding array of holes provided in a circuit board. The card 3 material should also withstand the temperature to which is is subjected during 4 soldering of the pin to a circuit board, so that its mechanical integrity is not impaired. In response to P force sufficient to remove the card from the terminal6 pins, the card is pliant or bendable to permit peeling of the card from the pins once 7 they sre secured to a circuit board. The pin array is mounted as a group in a 8 circuit board 24, as illustrated in Figs. 4 and 5, by way of a corresponding array of 9 holes 26 in the board 24. After such installation, the pins are soldered to associated conductive paths 28 on the bottom of the circuit board, such as by wave 11 soldering, to secure the terminal pins mechanically to the circuit board and to 12 provide proper electrical connection between each terminal pin and its associated 13 conductive path. After soldering of the terminal pins in position on the circuit 14 board, the carrier card 10 is peeled from the head portion 14 of the pins 12 as illustrated in Fig. 6, to leave the head and body portions in an accurately aligned 16 socket contact array for acceptance of an integrated circuit or other electronic 17 component to be plugged therein. The head and body portions of the pins 12 are 18 open to surrounding air for cooling.
19 The card 10 in preferred embodiment is of cardboard having a thickness !¦ suffi~!ient to capture the head portion 14 of the termina] pins 12 for retention of 21 11, the pins in intended alignment. For the illustrated terminal pin configuration, the 22 l~ card is typically 45 mils thick. Alternatively, the card can be of plastic or other 23 ,I material having the necessary rigidity to retain the array of pins, and pliancy to be 24 1l peeled from the pins once they are secured to the circuit board.
1l The pin carrier is fabricated, in a typical fabrication sequence, in the 26 ¦ manner illustrated in Figs. 7 through 10. The cards 10 are initially cut to an 27 ¦ intended configuration and size and are conveyed through respective work stations 53~
at which respective steps of the fabrication process are conducted. In the 2 illustrated embodirnent, the cards are fed along a guideway, at successive locations 3 of which the work stations are disposed to perform the steps of the manufacturing 4 process. The cards are typically moved along the guideway in incremental units equal to the length of a card, and the work stations are disposed at multiples of the 6 card length, as a result of which the cards are sdvanced one at a time to each 7 station for the corresponding operation to be performed. Fabrication proceeds as 8 follows. The cards are conveyed to the station illustrated in Fig. 7 at which the g array of holes 22 is punched in the card on the respective opposed edges thereof by a tool 30. The holes are slightly smaller in diameter than the diameter of the head 11 portions of pins 12 to provide a tight fit when the pins are secured in the card. The 12 cards with the punched holes are then conveyed to the next station as illustrated in '13 Fig. 8 at which the terminal pins 12, being fed within channels 32, are loosely 14 inserted into respective holes 22. At the next station, depicted in Fig. 9, the pins 12 are seated, by tool 34, within the card, with the head portion 14 of each pin 16 being positively retained by the respective mounting hole of the card. At a 17 subseguent station as shown in Fig. 10, the terminal pins 12 as mounted on the 18 carrier card 10 are tested for mechanical alignment snd electricPl operability via 19 ~ electrodes 36, and the pin carriers which pass the acceptance tests are then 20 ' inserted into a foam board or otherwise suitably packaged for ease of shipment and 21 handling.
22 The pin carrier fabricated in accordance with the invention is relatively 23 inexpensive while providing accurate retention of the terminal pins for installation 24 into a circuit board. In addition, the novel pin carrier is readily fabricated in an efficient and cost effective manner without danger of damage to the delicate 26 terminal pins. The carrier is thus of significant commercial advantage since the 27 carrier is an expendable item which is used only in assembling a terminal pin array 28 onto a circuit board and is thereafter peeled away and discarded.
3~
It will be appreciated that the invention is applicable to other terminal 2 configurations than the dual in-line configuration illustrated, and can be advan-3 tageously employed for many different terminal arrangements in which a plurality 4 of terminals must be accurately maintained in aligned position for installation as a group into an associated circuit board. The steps employed in fabrication of the6 carrier can also be varied from the particular sequence of steps described above in 7 accordance with the particular types of terminals employed and the apparatus 8 utilized in assembling such terminals to the carrier card. Accordingly, the 9 invention is not to be limited by what has been particularly shown and described 1 D except as indicated in the appended claims.
.,
Techniques have been employed by which an array of socket contacts are 16 installed directly in a circuit board for receipt of an associated componen~ The 17 socket contacts in a desired contsct configuration are initially supported by a 18 carrier structure which maintains the array of contacts in a desired arrangement 19 and permits handling and installation of the entire array onto a circuit board. Such a carrier eliminates the need for handling and installation of individual socket contacts, which would be extremely inefficient and commercially impractical for 2 circuit manufacturing purposes. The carrier structures employed heretofore 3 provide the intended ease of handling of the socket contact array, but at a 4 relatively high materials and fabrication cost.
One known carrier is fabricated of aluminum and includes a plurality of legs 6 formed much like a lead frame from an aluminum strip in a desired lead configuration, typics1ly a dual in-line configuration, with the legs being inserted 8 into respective socket contacts of the terminals. In use, the terminsl pins 9 supported by the csrrier legs are installed in a circuit board and soldered into position thereon, after which the carrier is removed to leave the socket contacts in position for installation of an sssociated component. The carrier is fabricated by 12 punching, cutting, and forming of aluminum strip, which is expensive and which 13 requires a multiple step process of some complexity. Moreover, great care must be 14 exercised in inserting the aluminum legs of the carrier into the socket contacts of 15 ll the terminsl pins to avoid damsging the gold plating and contact surf~ces of such 16 terminals. Great care must slso be employed in removing the csrrier from the 17 socket contacts to avoid damage to the contscts.
SIJMMARY OF THE INVENTIO~
, 18 ; In accordance with this invention a terminsl pin csrrier is provided which is 19 of substantially less cost than prior carriers, and which is essily fabricated with simple apparatus in an efficient high speed manner. The carrier comprises a card 21 of low cost material of a predetermined size and configuration and supporting an 22 array of terminal pins in respective holes which have been previously provided in 23 the card. The card is sufficiently rigid under normal handling during fabricstion of the carrier and during installation of the pins on a circuit board to remain 2 subshntially planar and retain the pins in accurate aligned disposition. The card is 3 pliant in response to a force sufficient to peel the card from the terminal pins 4 after the pins have been secured to a circuit board. The pins are accurately maintained in relative disposition by the card such that they are readily installed as 6 a group into openings provided in a circuit board for retention thereon by soldering 7 or other suitable technique. After solderin~ of the terminal pins to-the circuit 8 board, the card is peeled away from the socket contact portions of the pins to g leave those contacts in the intended socket arrangement for receipt of an associated electronic component. The card is of an inexpensive material such as ll cardboard which is sufficiently rigid to retain the spatial orientation of the 12 terminals and which will not burn or otherwise be destroyed at the soldering 13 temperature to which the attached terminal pins are exposed.
14 To fabricate the novel carrier, cards are cut to size and are punched or otherwise formed with a plurality of holes in a pattern corresponding to the 16 , ! intended socket configuration. Terminal pins are pressed into the respective holes, t 17 with the socket heads being retained by the card. The carriers are usually18 , packaged in groups typically on a foam sheet into which the pin ends are pressed to 19 facilitate handling and transport of the carriers.
DESCRIPTION OF THE DRAWINGS
The invention will be more fully understood from the follswing detailed 21 description taken in conjunction with the accompanying drawings, in which:22 Fig. 1 is a sectional elevation view of the terminal pin carrier in accordance 23 with the invention;
Fig. 2 is a top view of the pin carrier of Fig. 1;
2 Fig. 3 is a sectional elevation view of a terminal pin of a type employed in 3 the invention;
4 Fig. 4 is a cutaway pictorial view of the pin carrier in position for insertion into a circuit board;
6 Fig. S is a pictorial view, partly in section, of the pin carrier installed in a 7 circuit board; -8 Fig. 6 is a cutaway pictorial view showing the carrier card being peeled 9 from the installed terminal pins; and Figs. 7 through 10 are elevation views, partly in section, of apparatus for 11 fabrication of the pin carrier.
DErAILED DESCRIPTION OF THE INVENTION
12 ii A terminal pin carrier in accordance with the invention is illustrated in 13 Figs. 1 and 2 and includes a card 10 of rectangular configuration and having 14 ,~ disposed along the respective longer edges a parallel array of terminal pins 12 in well known dual in-line configuration. Each terminal pin 12 includes an enlarged16 SOcKet contact head portion 14, a smaller body portion 16, and a still smaller pin 17 ~ portion 18, with a socket opening 20 being provided within the head and shank 18 portions of the terminaL The contact structure of the terminal pin is typically as 19 shown in Fig. 3. The delicate interior contact structure is not subjected to any engagement by the novel carrier. The head portion of each pin is retained within a 21 respective opening 22 provided through the card 10. The card 10 is of an22 inexpensive material having sufficient rigidity, thickness, and mechanical strength 23 to remain substantially planar and to positively retain the terminal pins 12 in l;~D~
accurate aligned parallel disposition, such that the array of pins can be readily 2 plugged into a corresponding array of holes provided in a circuit board. The card 3 material should also withstand the temperature to which is is subjected during 4 soldering of the pin to a circuit board, so that its mechanical integrity is not impaired. In response to P force sufficient to remove the card from the terminal6 pins, the card is pliant or bendable to permit peeling of the card from the pins once 7 they sre secured to a circuit board. The pin array is mounted as a group in a 8 circuit board 24, as illustrated in Figs. 4 and 5, by way of a corresponding array of 9 holes 26 in the board 24. After such installation, the pins are soldered to associated conductive paths 28 on the bottom of the circuit board, such as by wave 11 soldering, to secure the terminal pins mechanically to the circuit board and to 12 provide proper electrical connection between each terminal pin and its associated 13 conductive path. After soldering of the terminal pins in position on the circuit 14 board, the carrier card 10 is peeled from the head portion 14 of the pins 12 as illustrated in Fig. 6, to leave the head and body portions in an accurately aligned 16 socket contact array for acceptance of an integrated circuit or other electronic 17 component to be plugged therein. The head and body portions of the pins 12 are 18 open to surrounding air for cooling.
19 The card 10 in preferred embodiment is of cardboard having a thickness !¦ suffi~!ient to capture the head portion 14 of the termina] pins 12 for retention of 21 11, the pins in intended alignment. For the illustrated terminal pin configuration, the 22 l~ card is typically 45 mils thick. Alternatively, the card can be of plastic or other 23 ,I material having the necessary rigidity to retain the array of pins, and pliancy to be 24 1l peeled from the pins once they are secured to the circuit board.
1l The pin carrier is fabricated, in a typical fabrication sequence, in the 26 ¦ manner illustrated in Figs. 7 through 10. The cards 10 are initially cut to an 27 ¦ intended configuration and size and are conveyed through respective work stations 53~
at which respective steps of the fabrication process are conducted. In the 2 illustrated embodirnent, the cards are fed along a guideway, at successive locations 3 of which the work stations are disposed to perform the steps of the manufacturing 4 process. The cards are typically moved along the guideway in incremental units equal to the length of a card, and the work stations are disposed at multiples of the 6 card length, as a result of which the cards are sdvanced one at a time to each 7 station for the corresponding operation to be performed. Fabrication proceeds as 8 follows. The cards are conveyed to the station illustrated in Fig. 7 at which the g array of holes 22 is punched in the card on the respective opposed edges thereof by a tool 30. The holes are slightly smaller in diameter than the diameter of the head 11 portions of pins 12 to provide a tight fit when the pins are secured in the card. The 12 cards with the punched holes are then conveyed to the next station as illustrated in '13 Fig. 8 at which the terminal pins 12, being fed within channels 32, are loosely 14 inserted into respective holes 22. At the next station, depicted in Fig. 9, the pins 12 are seated, by tool 34, within the card, with the head portion 14 of each pin 16 being positively retained by the respective mounting hole of the card. At a 17 subseguent station as shown in Fig. 10, the terminal pins 12 as mounted on the 18 carrier card 10 are tested for mechanical alignment snd electricPl operability via 19 ~ electrodes 36, and the pin carriers which pass the acceptance tests are then 20 ' inserted into a foam board or otherwise suitably packaged for ease of shipment and 21 handling.
22 The pin carrier fabricated in accordance with the invention is relatively 23 inexpensive while providing accurate retention of the terminal pins for installation 24 into a circuit board. In addition, the novel pin carrier is readily fabricated in an efficient and cost effective manner without danger of damage to the delicate 26 terminal pins. The carrier is thus of significant commercial advantage since the 27 carrier is an expendable item which is used only in assembling a terminal pin array 28 onto a circuit board and is thereafter peeled away and discarded.
3~
It will be appreciated that the invention is applicable to other terminal 2 configurations than the dual in-line configuration illustrated, and can be advan-3 tageously employed for many different terminal arrangements in which a plurality 4 of terminals must be accurately maintained in aligned position for installation as a group into an associated circuit board. The steps employed in fabrication of the6 carrier can also be varied from the particular sequence of steps described above in 7 accordance with the particular types of terminals employed and the apparatus 8 utilized in assembling such terminals to the carrier card. Accordingly, the 9 invention is not to be limited by what has been particularly shown and described 1 D except as indicated in the appended claims.
.,
Claims (12)
1. A terminal pin carrier comprising:
a card(10) of rigid material containing a plurality of holes(22) therethrough in a pattern corresponding to an intended socket contact pattern;
a plurality of terminal pins(12) having a socket contact portion(14) secured within a respective one of the holes through the card, and an outwardly extending pin portion(18) adapted for insertion into an opening(26) of a circuit board;(24) the card being peelable from the socket contact portions of the terminal pins after the soldering of the pin portions to a circuit board.
a card(10) of rigid material containing a plurality of holes(22) therethrough in a pattern corresponding to an intended socket contact pattern;
a plurality of terminal pins(12) having a socket contact portion(14) secured within a respective one of the holes through the card, and an outwardly extending pin portion(18) adapted for insertion into an opening(26) of a circuit board;(24) the card being peelable from the socket contact portions of the terminal pins after the soldering of the pin portions to a circuit board.
2. The terminal pin carrier of claim 1 wherein said card is of cardboard material.
3. For use in handling a plurality of terminal pins(12) adapted for mounting to a circuit board(24) and having socket contacts(14) into which an electronic component can be plugged, a terminal pin carrier comprising:
a card(10) of material containing a plurality of holes(22) therethrough in a pattern corresponding to an intended terminal pin configuration;
a plurality of terminal pins(12) each having a socket contact portion(14) secured within respective ones of the holes through the card, and an outwardly extending pin portion(18) adapted for insertion into a respective opening of a circuit board;
the card being operative to accurately maintain the relative disposition of the terminal pins for insertion of the pins as a group into respective openings in a circuit board, and after soldering of the pin portions to the circuit board being peelable from the socket contact portions.
a card(10) of material containing a plurality of holes(22) therethrough in a pattern corresponding to an intended terminal pin configuration;
a plurality of terminal pins(12) each having a socket contact portion(14) secured within respective ones of the holes through the card, and an outwardly extending pin portion(18) adapted for insertion into a respective opening of a circuit board;
the card being operative to accurately maintain the relative disposition of the terminal pins for insertion of the pins as a group into respective openings in a circuit board, and after soldering of the pin portions to the circuit board being peelable from the socket contact portions.
4. The terminal pin carrier of claim 3 wherein the terminal pins each include an enlarged head portion,(14) a smaller shank portion(16) and a still smaller pin portion,(18) and a socket opening(20) within the head and shank portions;
and wherein the card is of a thickness approximating the height of the enlarged head portions of the terminal pins.
and wherein the card is of a thickness approximating the height of the enlarged head portions of the terminal pins.
5. The terminal pin carrier of claim 3 wherein the card is sufficiently rigid to retain the terminal pins in accurate aligned disposition and, in response to an applied manual force, is bendable to be peeled from the terminal pins soldered to the circuit board.
6. The terminal pin carrier of claim 5 wherein the card can withstand the temperature resulting from soldering the terminal pins to the circuit board.
7. The terminal pin carrier of claim 3 wherein the card is of rectangular configuration containing a parallel array of holes therethrough in a dual in-line configuration along the respective longer edges of the card;
and wherein the terminal pins are retained in the card in the dual in-line configuration for installation as a group to a circuit board.
and wherein the terminal pins are retained in the card in the dual in-line configuration for installation as a group to a circuit board.
8. The terminal pin carrier of claim 7 wherein the card is of cardboard material.
9. A method of fabricating a terminal pin carrier for securing an array of terminal pins(12) in accurate aligned relative disposition for insertion as a group into a circuit board,(24) the method comprising the steps of:
9. A method of fabricating a terminal pin carrier for securing an array of terminal pins(12) in accurate aligned relative disposition for insertion as a group into a circuit board,(24) the method comprising the steps of:
Claim 9 (continued) providing a plurality of cards(10) each of predetermined configuration and of sufficient rigidity to retain terminal pins(12) wherein;
providing holes(22) through each of said cards in an array corresponding to an intended socket contact configuration; and inserting a plurality of terminal pins into the corresponding plurality of holes, the socket contact portion of each pin being retained within a respective hole through the card.
providing holes(22) through each of said cards in an array corresponding to an intended socket contact configuration; and inserting a plurality of terminal pins into the corresponding plurality of holes, the socket contact portion of each pin being retained within a respective hole through the card.
10. The method of claim 9 wherein the step of terminal pin inserting includes:
inserting the terminal pins loosely in the corresponding plurality of holes;
and seating the head portions of the terminal pins into respective holes in the card to secure the pins to the card in accurate relative disposition.
inserting the terminal pins loosely in the corresponding plurality of holes;
and seating the head portions of the terminal pins into respective holes in the card to secure the pins to the card in accurate relative disposition.
11. The method of claim 9 wherein the step of inserting the plurality of terminal pins includes inserting the pins as a group into the holes of said card
12. The method of claim 9 further including the insertion of said terminal pins as a group into corresponding holes(26) a circuit board(24) and, after soldering of the pins to the circuit board, peeling the card from the pins to leave an array of socket contacts into which an electronic component can be plugged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000434045A CA1200862A (en) | 1983-08-08 | 1983-08-08 | Terminal pin carrier and fabrication method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000434045A CA1200862A (en) | 1983-08-08 | 1983-08-08 | Terminal pin carrier and fabrication method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1200862A true CA1200862A (en) | 1986-02-18 |
Family
ID=4125814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000434045A Expired CA1200862A (en) | 1983-08-08 | 1983-08-08 | Terminal pin carrier and fabrication method |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1200862A (en) |
-
1983
- 1983-08-08 CA CA000434045A patent/CA1200862A/en not_active Expired
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