JPH0353763B2 - - Google Patents
Info
- Publication number
- JPH0353763B2 JPH0353763B2 JP5165985A JP5165985A JPH0353763B2 JP H0353763 B2 JPH0353763 B2 JP H0353763B2 JP 5165985 A JP5165985 A JP 5165985A JP 5165985 A JP5165985 A JP 5165985A JP H0353763 B2 JPH0353763 B2 JP H0353763B2
- Authority
- JP
- Japan
- Prior art keywords
- limiting element
- current limiting
- current
- molding
- terminal member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000465 moulding Methods 0.000 claims description 28
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 6
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 5
- 150000002910 rare earth metals Chemical class 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- LELOWRISYMNNSU-UHFFFAOYSA-N hydrogen cyanide Chemical compound N#C LELOWRISYMNNSU-UHFFFAOYSA-N 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 238000010626 work up procedure Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5165985A JPS61208803A (ja) | 1985-03-13 | 1985-03-13 | 限流素子構成体の成形方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5165985A JPS61208803A (ja) | 1985-03-13 | 1985-03-13 | 限流素子構成体の成形方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61208803A JPS61208803A (ja) | 1986-09-17 |
| JPH0353763B2 true JPH0353763B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-08-16 |
Family
ID=12893002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5165985A Granted JPS61208803A (ja) | 1985-03-13 | 1985-03-13 | 限流素子構成体の成形方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61208803A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4605329B2 (ja) * | 2001-02-01 | 2011-01-05 | Ｔｄｋ株式会社 | セラミックコンデンサ |
-
1985
- 1985-03-13 JP JP5165985A patent/JPS61208803A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61208803A (ja) | 1986-09-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104365185B (zh) | 包括导电的基板的、特别是用于功率电子模块的印刷电路板 | |
| US6840432B1 (en) | Solder application technique | |
| JP3990169B2 (ja) | 合金型温度ヒュ−ズ | |
| JP3841257B2 (ja) | 合金型温度ヒュ−ズ | |
| JP2819408B2 (ja) | 合金型温度ヒユーズ | |
| JP3995058B2 (ja) | 合金型温度ヒュ−ズ | |
| JPH0353763B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| KR20010067272A (ko) | 와이어를 포함하는 전자 부품 | |
| JPH02105513A (ja) | ヒューズ付きチップ状固体電解コンデンサ | |
| JPH0719075Y2 (ja) | 基板型温度ヒューズ | |
| JPH0353762B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JP2001259885A (ja) | はんだ合金および金属化プラスチックフィルムコンデンサ端面電極 | |
| JP3389853B2 (ja) | 電子部品および半田バンプの形成方法 | |
| JP2003249412A (ja) | 電子部品の電極と導体端末との接合構造、電子部品、及び接合方法 | |
| JP3403993B2 (ja) | フラックス付きヒュ−ズ | |
| JP2003203621A (ja) | 蓄電装置の端子接合構造 | |
| WO2014174927A1 (ja) | 放電防止構造体 | |
| JP3157915B2 (ja) | 回路保護用素子 | |
| JP2960504B2 (ja) | ロータリートランス | |
| JPH0897008A (ja) | バリスタの製造法 | |
| JP3267740B2 (ja) | 基板型温度ヒュ−ズ | |
| JP3659477B2 (ja) | 電池用端子 | |
| JPS60255964A (ja) | 溶融溶射機用溶射材 | |
| JPS60165745A (ja) | 樹脂封止型半導体装置 | |
| JPH07109745B2 (ja) | 合金型温度ヒューズの復帰方法 |