JPH0353481Y2 - - Google Patents
Info
- Publication number
- JPH0353481Y2 JPH0353481Y2 JP6873086U JP6873086U JPH0353481Y2 JP H0353481 Y2 JPH0353481 Y2 JP H0353481Y2 JP 6873086 U JP6873086 U JP 6873086U JP 6873086 U JP6873086 U JP 6873086U JP H0353481 Y2 JPH0353481 Y2 JP H0353481Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- chip
- protector sheet
- conductive
- protector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000001012 protector Effects 0.000 claims description 25
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6873086U JPH0353481Y2 (sh) | 1986-05-09 | 1986-05-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6873086U JPH0353481Y2 (sh) | 1986-05-09 | 1986-05-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62180926U JPS62180926U (sh) | 1987-11-17 |
JPH0353481Y2 true JPH0353481Y2 (sh) | 1991-11-22 |
Family
ID=30908814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6873086U Expired JPH0353481Y2 (sh) | 1986-05-09 | 1986-05-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0353481Y2 (sh) |
-
1986
- 1986-05-09 JP JP6873086U patent/JPH0353481Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS62180926U (sh) | 1987-11-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2000082636A (ja) | セラミック電子部品 | |
JPH11251176A (ja) | セラミック電子部品 | |
EP0196229A2 (en) | A capacitor for surface mounting | |
US5739743A (en) | Asymmetric resistor terminal | |
JPH0353481Y2 (sh) | ||
JP3767704B2 (ja) | チップ型電子部品 | |
JPS6211481B2 (sh) | ||
JPH0546258Y2 (sh) | ||
JPS5843762Y2 (ja) | チップ形正特性サ−ミスタ | |
JPH0312446B2 (sh) | ||
JPH046197Y2 (sh) | ||
JP3177516B2 (ja) | チップ形電解コンデンサ | |
JPH0447949Y2 (sh) | ||
JPH0236265Y2 (sh) | ||
JPH046198Y2 (sh) | ||
JPH0236266Y2 (sh) | ||
JP2556410Y2 (ja) | 集合電子部品 | |
JPS6344984Y2 (sh) | ||
JPH11102836A (ja) | 電子部品 | |
JPH0414919Y2 (sh) | ||
JP2551599Y2 (ja) | フレキシブル配線板 | |
JPH0410709Y2 (sh) | ||
JPH0314292A (ja) | 高密度実装モジュールの製造方法 | |
JPH0410641Y2 (sh) | ||
JP3903544B2 (ja) | チップ形コンデンサ |