JPH035272B2 - - Google Patents
Info
- Publication number
- JPH035272B2 JPH035272B2 JP27072486A JP27072486A JPH035272B2 JP H035272 B2 JPH035272 B2 JP H035272B2 JP 27072486 A JP27072486 A JP 27072486A JP 27072486 A JP27072486 A JP 27072486A JP H035272 B2 JPH035272 B2 JP H035272B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- vapor phase
- conveyor
- speed
- preheaters
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012808 vapor phase Substances 0.000 claims description 27
- 238000005476 soldering Methods 0.000 claims description 17
- 229920006395 saturated elastomer Polymers 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 6
- 238000009834 vaporization Methods 0.000 claims description 5
- 230000008016 vaporization Effects 0.000 claims description 5
- 238000001816 cooling Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27072486A JPS63123567A (ja) | 1986-11-13 | 1986-11-13 | 気相式はんだ付け方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27072486A JPS63123567A (ja) | 1986-11-13 | 1986-11-13 | 気相式はんだ付け方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63123567A JPS63123567A (ja) | 1988-05-27 |
JPH035272B2 true JPH035272B2 (enrdf_load_stackoverflow) | 1991-01-25 |
Family
ID=17490076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27072486A Granted JPS63123567A (ja) | 1986-11-13 | 1986-11-13 | 気相式はんだ付け方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63123567A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02112871A (ja) * | 1988-10-24 | 1990-04-25 | Mitsubishi Electric Corp | 気相式はんだ付け装置 |
-
1986
- 1986-11-13 JP JP27072486A patent/JPS63123567A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63123567A (ja) | 1988-05-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0340275A1 (en) | Vapour phase process and apparatus | |
EP0000284A1 (en) | Process and apparatus for reflowing solder of solder plated substrates and substrates formed thereby | |
US4512508A (en) | Method and apparatus for the machine soldering of workpieces | |
US20070039999A1 (en) | Soldering apparatus and soldering method | |
JPH035272B2 (enrdf_load_stackoverflow) | ||
US4766677A (en) | Method and apparatus for vapor phase soldering | |
US4256512A (en) | Flexible circuit reflow soldering machine | |
EP1345481A1 (en) | Reflow soldering apparatus and reflow soldering method | |
JPS6384767A (ja) | リフロ−炉 | |
JPH09246712A (ja) | リフロー半田付け方法とその装置 | |
JP2722690B2 (ja) | 自動半田付け装置 | |
JPH0214855Y2 (enrdf_load_stackoverflow) | ||
JP3420296B2 (ja) | はんだ付け装置におけるワーク検出方法 | |
JPS62148084A (ja) | ベ−パ−リフロ−式はんだ付装置 | |
JPS63154261A (ja) | 気相半田付け装置 | |
JPH01205594A (ja) | リフロー半田付け方法 | |
JP2582796B2 (ja) | 気相式はんだ付け装置 | |
JP2723402B2 (ja) | ベーパーリフローはんだ付け装置 | |
JPH059190B2 (enrdf_load_stackoverflow) | ||
JPS62203669A (ja) | チップ部品を搭載するプリント基板用リフロー装置 | |
JP2751979B2 (ja) | ベーパーリフローはんだ付け装置 | |
JP2634449B2 (ja) | 気相式はんだ付け装置 | |
JPS59174272A (ja) | リフロ−炉 | |
JP2003083684A (ja) | 被加熱物搬送機構 | |
JPH1098262A (ja) | リフロー装置 |