JPH0351962Y2 - - Google Patents
Info
- Publication number
- JPH0351962Y2 JPH0351962Y2 JP5639786U JP5639786U JPH0351962Y2 JP H0351962 Y2 JPH0351962 Y2 JP H0351962Y2 JP 5639786 U JP5639786 U JP 5639786U JP 5639786 U JP5639786 U JP 5639786U JP H0351962 Y2 JPH0351962 Y2 JP H0351962Y2
- Authority
- JP
- Japan
- Prior art keywords
- board mounting
- capacitor
- lead
- lead wire
- locking groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 46
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 24
- 229910052782 aluminium Inorganic materials 0.000 claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000000605 extraction Methods 0.000 claims 1
- 239000006071 cream Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000003792 electrolyte Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5639786U JPH0351962Y2 (US07534539-20090519-C00280.png) | 1986-04-14 | 1986-04-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5639786U JPH0351962Y2 (US07534539-20090519-C00280.png) | 1986-04-14 | 1986-04-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62168632U JPS62168632U (US07534539-20090519-C00280.png) | 1987-10-26 |
| JPH0351962Y2 true JPH0351962Y2 (US07534539-20090519-C00280.png) | 1991-11-08 |
Family
ID=30885176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5639786U Expired JPH0351962Y2 (US07534539-20090519-C00280.png) | 1986-04-14 | 1986-04-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351962Y2 (US07534539-20090519-C00280.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4345646B2 (ja) * | 2004-11-15 | 2009-10-14 | パナソニック株式会社 | チップ型アルミ電解コンデンサ |
-
1986
- 1986-04-14 JP JP5639786U patent/JPH0351962Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62168632U (US07534539-20090519-C00280.png) | 1987-10-26 |
