JPH0351889U - - Google Patents
Info
- Publication number
- JPH0351889U JPH0351889U JP11229689U JP11229689U JPH0351889U JP H0351889 U JPH0351889 U JP H0351889U JP 11229689 U JP11229689 U JP 11229689U JP 11229689 U JP11229689 U JP 11229689U JP H0351889 U JPH0351889 U JP H0351889U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- vertical wall
- electronic component
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Description
第1図は本考案の一実施例を示す電子部品取り
付け装置の分解構成斜視図、第2図A及びBは本
考案の電子部品取り付け装置の要部斜視図及び断
面図、第3図は電子部品を押圧する押圧部の押圧
力発生の機構を説明するための要部断面図、第4
図A及びBは従来の電子部品取り付け装置の断面
図及び要部斜視図である。
10……プリント基板、12……電子部品、2
0……ヒートシンク、22……ヒートシンク、2
3……凸状台、30……プロテクシヨンカバー、
31……押圧部、32……ネジ穴、33……作用
部、35……支持部。
FIG. 1 is an exploded perspective view of an electronic component mounting device showing an embodiment of the present invention, FIGS. 2A and B are perspective views and sectional views of essential parts of the electronic component mounting device of the present invention, and FIG. 3 is an electronic Main part sectional view for explaining the mechanism of pressing force generation of the pressing part that presses the part, No. 4
Figures A and B are a cross-sectional view and a perspective view of essential parts of a conventional electronic component mounting device. 10...Printed circuit board, 12...Electronic component, 2
0...Heat sink, 22...Heat sink, 2
3... Convex base, 30... Protection cover,
31... Pressing part, 32... Screw hole, 33... Action part, 35... Supporting part.
Claims (1)
、このヒートシンクに電子部品を押圧固定しプリ
ント基板と共にヒートシンクをカバーする蓋部と
からなる電子部品取り付け装置において、 前記ヒートシンクは、 前記プリント基板と略垂直な角度をなし相互に
平行に配列された垂直壁と、 前記垂直壁に平行に設けられ、その高さが垂直
壁の高さより低く形成された凸状台とを有し、 前記蓋部は、 前記凸状台に圧接し前記垂直壁に前記電子部品
を押圧するクランク形状の押圧部、 を有することを特徴とする電子部品取り付け装置
。[Claims for Utility Model Registration] An electronic component mounting device comprising a heat sink mounted on a printed circuit board, and a lid portion that presses and fixes electronic components to the heat sink and covers the heat sink together with the printed circuit board, the heat sink comprising: the printed circuit board; a vertical wall arranged parallel to each other at an angle substantially perpendicular to the substrate; and a convex pedestal provided parallel to the vertical wall and having a height lower than that of the vertical wall; An electronic component mounting device characterized in that the lid portion includes a crank-shaped pressing portion that presses against the convex base and presses the electronic component against the vertical wall.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11229689U JPH0351889U (en) | 1989-09-26 | 1989-09-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11229689U JPH0351889U (en) | 1989-09-26 | 1989-09-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0351889U true JPH0351889U (en) | 1991-05-20 |
Family
ID=31660745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11229689U Pending JPH0351889U (en) | 1989-09-26 | 1989-09-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0351889U (en) |
-
1989
- 1989-09-26 JP JP11229689U patent/JPH0351889U/ja active Pending