JPH0351113Y2 - - Google Patents
Info
- Publication number
- JPH0351113Y2 JPH0351113Y2 JP1983151746U JP15174683U JPH0351113Y2 JP H0351113 Y2 JPH0351113 Y2 JP H0351113Y2 JP 1983151746 U JP1983151746 U JP 1983151746U JP 15174683 U JP15174683 U JP 15174683U JP H0351113 Y2 JPH0351113 Y2 JP H0351113Y2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- magnet
- workpiece
- magnetic
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000696 magnetic material Substances 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 13
- 238000007747 plating Methods 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000006247 magnetic powder Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15174683U JPS6061187U (ja) | 1983-09-29 | 1983-09-29 | 磁性物品のチヤツク装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15174683U JPS6061187U (ja) | 1983-09-29 | 1983-09-29 | 磁性物品のチヤツク装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6061187U JPS6061187U (ja) | 1985-04-27 |
| JPH0351113Y2 true JPH0351113Y2 (zh) | 1991-10-31 |
Family
ID=30336185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15174683U Granted JPS6061187U (ja) | 1983-09-29 | 1983-09-29 | 磁性物品のチヤツク装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6061187U (zh) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5426263B2 (zh) * | 1976-12-24 | 1979-09-03 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5426263U (zh) * | 1977-07-25 | 1979-02-21 |
-
1983
- 1983-09-29 JP JP15174683U patent/JPS6061187U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5426263B2 (zh) * | 1976-12-24 | 1979-09-03 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6061187U (ja) | 1985-04-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3868764A (en) | Multiple magnetic alignment of semiconductor devices for bonding | |
| TW201703957A (zh) | 切削裝置 | |
| JPH0351113Y2 (zh) | ||
| CN216421545U (zh) | 一种便捷的焊线辅助夹具结构 | |
| JP4152201B2 (ja) | バックアップ装置および表面実装機 | |
| JP2002321063A (ja) | 抵抗溶接装置 | |
| GB1529857A (en) | Semiconductors | |
| CN110355520B (zh) | 压块放置装置及压块放置方法 | |
| JPH08306813A (ja) | 半導体パッケージのキャップ仮止め用治具 | |
| JP3187981B2 (ja) | シーム接合装置 | |
| JPH0885071A (ja) | 多面体治具と治具切替え機構 | |
| JPH06104347A (ja) | 半導体パッケージのキャップ仮止め用治具 | |
| CN221716040U (zh) | 一种电芯焊接支架 | |
| JPS62195141A (ja) | ペレツト移送装置 | |
| JPH0985471A (ja) | マーク付け装置 | |
| JPS595250U (ja) | ワ−ク交換装置 | |
| JPS56130935A (en) | Inspecting device | |
| JPS6120396A (ja) | 予備はんだ付け装置 | |
| JP2513670Y2 (ja) | 水平搬送ｉｃ搬送装置のデバイスコンタクトユニット | |
| JP2557433B2 (ja) | ペレットマウント装置 | |
| JPH071797Y2 (ja) | 半導体製造装置 | |
| JPH0429563Y2 (zh) | ||
| JPH02212031A (ja) | マグネットチャック | |
| CN115484752A (zh) | 一种模块引脚焊接设备 | |
| JPS60142027U (ja) | 自動組立装置 |