JPH0350899A - Component centering mechanism - Google Patents

Abstract

PURPOSE:To automatically switch a part of an X-position-regulating face and a part of a Y-direction-regulating face which are used to center an electronic component according to a size of the electronic component by a method wherein the X-position- regulating face and the Y-position-regulating face are formed to be stepped faces. CONSTITUTION:At least an X-position-regulating face 71x on one side of an X-direction- regulating claw 7x and at least a Y-direction-regulating face 71y on one side of a Y-direction-regulating claw 7y which form a pair are formed to be stepped faces. A head driving part 51 is actuated to move a head 5 up to the upper side of a centering mechanism 6; then, an elevator 52 is actuated to lower the lead 5; an electronic component P is lowered to the centering mechanism 6. When the electronic component P ranges from a very small chip component to a medium-sized chip component in this case, the electronic component P is lowered down to positions of the regulating faces 71x, 71y which are situated below the stepped faces of the regulating claws 7x, 7y in both X and Y directions. When the component ranges from the medium-sized chip component to a large-sized component, the electronic component P is lowered down to the position of the 71x, 71y at the regulating faces above the stepped faces; the board 5 is on standby until a following centering operation is finished.

Description

[Detailed Description of the Invention] [Summary] Regarding the component centering mechanism, the X-direction regulating claw and the Y-direction regulating claw can be used in common for everything from microchip components to large components, thereby simplifying the structure of the mechanism and reducing equipment costs. The purpose of this product is to reduce the amount of damage caused by surface mount components, simplify maintenance, and increase the operating rate of surface mount component mounting machines. A pair of X-direction regulating claws that are built into the placement machine and align the electronic components in the X direction by moving toward each other relative to each other in the X direction; In a component centering mechanism equipped with a Y-direction regulating claw that aligns the center of a component in the Y-direction, a pair of X-direction inner regulating claws (one X-position regulating surface and at least one of the pair of Y-direction regulating claws) is used. The Y position regulating surface is formed on a stepped surface.

[Industrial application field]

The present invention relates to a component centering mechanism that is incorporated into a surface mount component mounting machine that mounts electronic components at predetermined positions on a printed circuit board.

[Conventional technology]

FIG. 3 is an overall configuration diagram of a surface mount component mounting machine that is common to both the component centering mechanism of the present invention and the conventional component centering mechanism. The detailed structure and operation of this surface mount component mounting machine will be described in the section describing the present invention, but will be briefly explained here in relation to the prior art. While electronic components P are individually fixed to each carrier 2 of the transfer device 1 by vacuum suction, each carrier 2 is sequentially fed frame by frame in accordance with a predetermined takt time by the transfer drive unit 13, and countertransferred at a predetermined position. The electronic component P is big-amplified from each transport carrier 2 by the loading device 4, and further, the electronic component P is vacuum-adsorbed to the lower end of the head 5, picked up from the reverse transfer loading device 4, and moved to the component centering mechanism 6. It has become.

Then, after aligning (centering) the electronic component P with the component centering mechanism 6 while adsorbed to the head 5, the electronic component P is again lifted from the component centering mechanism 6 by the head 5 and moved to a predetermined position on the printed circuit board, and then After correcting the direction of the electronic component P according to the direction, the head 5 is lowered close to the printed circuit board to temporarily place the electronic component P at a predetermined position on the printed circuit board.

The counter transfer machine 4, the head 5, and the component centering mechanism 6 are all designed to operate in accordance with the takt time.

The conventional component centering mechanism 6, as shown in FIG. 4(a) (plan view) and FIG. 4(b) (BB sectional view in FIG. 4(a)), A pair of X-direction regulating claws 7x that move away from each other, and a Y-direction regulating claw 7y that relatively approaches and separates from each other in the Y direction.
The actuator 8 controls the X-direction regulating claw 7x.
By narrowing the interval from both sides, the electronic component P inserted between the regulating claws 7x and 7y of the component centering mechanism 6 from the counter-transfer loading machine 4 can be moved in the X direction while being attracted to the head 5. Centering is performed in the Y direction, and by narrowing the interval between the regulating claws 7y in the Y direction from both sides.

[Problem to be solved by the invention]

By the way, the X direction regulating claw 7x of the component centering mechanism 6
Since the operating speeds of the actuators 8 for operating the and Y-direction regulating claws 7y are constant, the time required for centering the electronic component P varies depending on the size of the electronic component P mounted on the printed circuit board. That is, large parts, such as SOP (Small 0utline P
ackage), L CC (Leadless Chi
p Carrier), S OJ (Small 0
If you try to center a microchip component using a direction regulating claw that can center the parts (Utline J Bend), the problem is that the time required for centering is longer than the takt time, making it impossible to perform smooth continuous processing. There is. In particular, in the surface mount component mounting machine M whose speed has been increased to increase the processing capacity of the machine, this problem becomes even more serious because the takt time is extremely short at 0.4 seconds to 0.2 seconds.

Therefore, in the conventional surface mount component mounting machine M, for example, a small centering mechanism is used for centering from micro chip components to medium sized chip components, and a large centering mechanism is used for centering from medium sized chip components to large sized components. A solution has been adopted in which two component centering mechanisms are prepared and the centering mechanism selected according to the size of the component is installed.

According to this conventional solution, two centering mechanisms, one large and one small, are required, and the mounting structure of the centering mechanism on the surface mount component mounting machine becomes complicated, which is disadvantageous in terms of reducing equipment costs.

Furthermore, when the size of the electronic component P changes, it is necessary to replace the centering mechanism, which is not only troublesome for maintenance, but also disadvantageous in terms of increasing the operating rate of the surface mount component mounting machine M.

The present invention has been made in view of the above circumstances, and
Direction regulating claws and Y direction regulating claws are removed from microchip components.
By making it possible to share large parts such as P, it is possible to simplify the structure of the mechanism and reduce equipment costs, while also simplifying maintenance and increasing the operating rate of the surface mount component mounting machine. The object of the present invention is to provide a component centering mechanism that has the following features.

[Means to solve the problem]

The present invention is incorporated in a surface mount component mounting machine M that mounts an electronic component P at a predetermined position on a printed board A, and aligns the center of the electronic component P in the X direction by moving relatively toward and away from the X direction. Assuming a component centering mechanism including a pair of X-direction regulating claws 7x and a Y-direction regulating claw 7y that aligns the center of the electronic component P in the Y direction by moving relatively toward and away from the Y direction perpendicular to the X direction. In order to achieve the above objectives, we have taken the following measures.

That is, as shown in FIGS. 1 and 2, at least one X-position regulating surface 71x of the pair of X-direction regulating claws 7x and at least one Y-position regulating surface 71y of the pair of Y-direction regulating claws 7y are stepped. Formed on the attached surface.

[Effect]

In the present invention, at least one of the X-position regulating surfaces 71x of the pair of X-direction regulating claws 7x is formed as a stepped surface, so that, for example, a gap of two steps, large and small, is formed between the mutually opposing X-position regulating surfaces 71x. be done.

Therefore, for example, for centering from a microchip component P to a medium-sized chip component P, use a portion where the distance between both X-position regulating surfaces 71x is small, and for centering from a medium-sized chip component P to a large-sized component P, both X-position regulating surfaces 71x are used. By using the part with a large interval of 71x, the X direction regulating claw 7
without replacing x or component centering mechanism.
The time required for centering from a microchip component P to a medium-sized chip component P can be made equal to or less than the time required for centering from a medium-sized chip component P to a large-sized chip component P.

In addition, even if the size of the electronic component P is changed, it is only necessary to select the part of the X-direction regulating claw 7X used for centering the electronic component P, and the surface mount component mounting device can be used to replace the centering mechanism or regulating claw. There is no need to stop.

The same applies to the Y-direction regulating claw.

〔Example〕

Embodiments of the present invention will be described below based on the drawings.

FIG. 1 is a plan view of a centering mechanism according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line A-A, and FIG. 3 is a main part of a surface mount component mounting machine equipped with the centering mechanism. FIG. 3 is a perspective view (same as the conventional one except for the centering mechanism).

As shown in FIG. 3, this surface mount component mounting machine M includes a transfer device 1, a counter transfer device 4, a head 5, and a centering mechanism 6.

The transport device 1 includes an endless chain 11 that rotates on a horizontal plane, a rectangular transport carrier 2 connected to the outer circumferential side of the endless chain 11, and each electronic component P placed on the transport carrier 2.
A vacuum suction device vacuum suctions the electronic components P onto the upper surface of the transport carrier 2 through a minute vacuum communication hole formed in the transport carrier 2, and a simple device that aligns the electronic components P on the transport carrier 2 to a substantially constant position. Centering mtJ112 and
The conveyance drive unit 13 that drives the endless chain 11 and the conveyance carrier 2 is provided.

The counter-transfer loading machine 4 includes an arm 4I that flips and swings 180 degrees (see the circular arrow in the third country) and a wind motor 42 that swings and drives the arm 4I. 1 by vacuum suctioning the electronic component P to the arm 41.
By swinging 80', the electronic component P is lifted up from the transport carrier 2.

The head 5 is moved in parallel by a head drive unit 51 from above the inverted and swung arm 41 to a predetermined position on the printed circuit board, and is also driven up and down by an elevation drive device 52. The motor 53 horizontally rotates approximately 360 degrees.

A centering mechanism 6 is provided below the movement trajectory of the head 5.

As shown in FIG. 1, the centering mechanism 6 includes two parts that are movable in the X direction around a centering position where the electronic component P is raised and lowered together with the head 5.
A pair of X-direction regulating claws 7x, a pair of X-direction regulating claws 7y each provided movable in the X direction around the centering position, and 4 for driving the regulating claws 7x and 7y to move forward and backward toward the centering position. The actuator 8 is provided with two actuators 8. These actuators 8 share a common base plate 9
They are supported by the same system and operate in synchronization with each other.

The X-direction regulating claw 7x is made of a plate bent into a crank shape, and its mutually opposing surfaces form an X-position regulating surface 71X that receives both ends of the lead of the electronic component P and regulates its position in the X direction. This X position regulating surface 71X
As shown in FIG. 2, the upper half is a stepped surface that is set back farther from the centering position than the lower half.

The X-direction regulating claw 7y is made of a plate bent into a crank shape, and its mutually opposing surfaces receive and hold the body of the electronic component P, and the Y-position regulating surface 7y regulates the position in the X direction.
As shown in FIG. 2, this X position regulating surface 71y is a stepped surface that is set back such that its upper half is farther from the centering position than its lower half.

Note that the base plate 9 constitutes a part of the base plate 9 that supports the conveyance device 1, the counter transfer device 4, the head drive section 51, and the elevation drive device 52. Moreover, each actuator 8 is protected by a cover 10 that surrounds each of the regulating claws 7x and 7y above them.

In this surface mount component mounting machine M, the electronic component P supplied to the transport carrier 2 is corrected in its position on the transport carrier 2 by the simple centering mechanism 12, and then rebound from the transport carrier 2 at the end of transport of the transport device 1. It is pinked up by the transfer and loading machine 4 and reversed by 180°. After that, the head 5 is lowered from a predetermined height onto the electronic component P on the arm 41 of the anti-transfer transfer machine 4, and after the electronic component P is vacuum-adsorbed by the head 5, the head 5 is moved to a predetermined position by the lifting device 52. The electronic component P is picked up from the anti-transfer loading machine 4 by raising it to a height of . After that, the head driving unit 51 is operated to move the head 5 to the upper side of the centering mechanism 6, and the elevating device 52 is operated to lower the head 5, and the electronic component P
is lowered to the centering mechanism 6. At this time, if the electronic component P is a small chip component or a medium-sized chip component, the electronic component P is lowered to the position of the regulating surfaces 71x and 71y below the stepped surfaces of the regulating claws 7x and 7y in both the X and 7 directions. In addition, in the case of medium-sized chip parts to large-sized parts, the electronic parts P up to the positions of the regulating surfaces 71X and 71Y above the stepped surface
is lowered, and the hood 5 remains in a standby state until the following centering operation is completed. Thereafter, the actuator 8 is actuated to cause the direction regulating claws 7x and 7y to approach each other, thereby centering the electronic component P.

After this centering, the actuator 8 is operated in reverse to open the four direction regulating claws 7x and 7y, and the lifting drive device 52
is activated to raise the head 5 to a predetermined height, the head drive section 51 is activated to move the head 5 and the electronic component P above a predetermined position on the printed circuit board, and the head rotation motor is activated as necessary. 53 to correct the direction of the electronic component P, the elevating drive device 52 is activated to lower the electronic component P and the head 5, and after mounting the electronic component P at a predetermined position on the printed circuit board, the head 5 After releasing the vacuum suction, the elevating drive device 52 is operated to return the head 5 to a predetermined height, and the head drive unit 51 is further operated to return the head 5 to its original position above the reverse transfer machine 4. The electronic component P is then returned to standby in preparation for the next pink-up of the electronic component P.

In this way, the above-mentioned centering mechanism 6 has four direction regulating claws 7
Centering can be done by the lower half of y,
Since centering of medium-sized chip parts to large-sized parts can be performed using the upper halves of the regulating claws 7x and 7y in four directions, there is no need to replace the centering mechanism 6 depending on the size of the parts. Therefore, it is only necessary to provide one centering mechanism 6, which simplifies the configuration compared to the conventional system which had two large and small centering mechanisms, which reduces equipment costs and simplifies maintenance work. Become.

Moreover, there is no need to stop the operation of the surface mount component mounting machine iM for replacing the centering mechanism, and the operating rate of the surface mount component mounting machine M can be increased.

In the above embodiment, the X position regulating surface 71X and the Y position regulating surface 71y are configured with one level stepped surface, but it is also possible to configure these with two or more multilevel stepped surfaces. .

When the X-position regulating surface 71x and the Y-position regulating surface 71y are configured with two or more stepped surfaces, the time required for centering can be further shortened, making surface mount component mounting WIM even faster. It becomes possible to become

〔Effect of the invention〕

As described above, according to the present invention, by forming the X position regulating surface and the Y position regulating surface as stepped surfaces, the portion of the X position regulating surface used for centering the electronic component can be adjusted depending on the size of the electronic component. The Y-position regulating surface part is automatically switched, and the distance between the X-position regulating surface and the Y-position regulating surface and the electronic component can be kept below a predetermined distance, reducing the time required for centering microchip components or medium-sized chip components. The time required for centering medium-sized chip parts or large-sized parts can be reduced to the same level or less. Therefore, without replacing the centering mechanism or direction regulating claw, it is possible to center everything from microchip components to large components within a certain takt time with one centering mechanism, and two or more centering mechanisms are available. There is no need to do so. As a result, the assembly of the centering mechanism into the surface-mounted component replacement device can be simplified in structure, and equipment costs can be reduced. In addition, since there is no need to replace the centering mechanism depending on the size of the component, maintenance is simplified, and there is no need to stop the surface mount component placement machine to replace the centering mechanism. can increase the operating rate.

[Brief explanation of drawings]

FIG. 1 is a plan view of a centering mechanism according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line A-A, and FIG. 3 is a main part of a surface mount component mounting machine equipped with the centering mechanism. FIG. 4 is a plan view and a sectional view of a conventional component centering mechanism. In the figure, M...Surface mount component mounting machine, P...Electronic component, 7
x...X direction regulation claw, 7y...Y direction regulation claw, 7
1x...X position regulation surface, 71y...Y position regulation surface. (a) (b) '& 釆-K At>5' lin 2 fake;

Claims (1)

[Scope of Claims] [1] Built into a surface mount component mounting machine (M) that mounts an electronic component (P) at a predetermined position on a printed circuit board, the electronic component (P) ) and a pair of X-direction regulating claws (7x) that align the center of the electronic component (P) in the In a component centering mechanism equipped with a direction regulating claw (7y), a pair of X direction regulating claws (
7x) and at least one Y-position regulating surface (71y) of the pair of Y-direction regulating claws (7y) are formed as stepped surfaces. mechanism.