JPH03503104A - 高誘電多層コンデンサー - Google Patents
高誘電多層コンデンサーInfo
- Publication number
- JPH03503104A JPH03503104A JP50124289A JP50124289A JPH03503104A JP H03503104 A JPH03503104 A JP H03503104A JP 50124289 A JP50124289 A JP 50124289A JP 50124289 A JP50124289 A JP 50124289A JP H03503104 A JPH03503104 A JP H03503104A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- capacitor according
- layers
- dielectric
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims description 43
- 239000010410 layer Substances 0.000 claims description 46
- 239000000463 material Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000001465 metallisation Methods 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000011247 coating layer Substances 0.000 claims description 5
- 239000002356 single layer Substances 0.000 claims description 5
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- ZBSCCQXBYNSKPV-UHFFFAOYSA-N oxolead;oxomagnesium;2,4,5-trioxa-1$l^{5},3$l^{5}-diniobabicyclo[1.1.1]pentane 1,3-dioxide Chemical compound [Mg]=O.[Pb]=O.[Pb]=O.[Pb]=O.O1[Nb]2(=O)O[Nb]1(=O)O2 ZBSCCQXBYNSKPV-UHFFFAOYSA-N 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 238000005253 cladding Methods 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 239000010955 niobium Substances 0.000 claims description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 239000004416 thermosoftening plastic Substances 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000011230 binding agent Substances 0.000 claims 3
- AEVQQNOXVSKIRO-UHFFFAOYSA-N [O-2].[Fe+2].[W+4].[O-2].[O-2] Chemical group [O-2].[Fe+2].[W+4].[O-2].[O-2] AEVQQNOXVSKIRO-UHFFFAOYSA-N 0.000 claims 1
- 229910002113 barium titanate Inorganic materials 0.000 claims 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims 1
- 239000012777 electrically insulating material Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000008188 pellet Substances 0.000 description 25
- 229920000642 polymer Polymers 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 8
- 239000003989 dielectric material Substances 0.000 description 4
- 229920005570 flexible polymer Polymers 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004697 Polyetherimide Substances 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229920001601 polyetherimide Polymers 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 241000287462 Phalacrocorax carbo Species 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005596 polymer binder Polymers 0.000 description 2
- 239000002491 polymer binding agent Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002998 adhesive polymer Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- WAKZZMMCDILMEF-UHFFFAOYSA-H barium(2+);diphosphate Chemical compound [Ba+2].[Ba+2].[Ba+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O WAKZZMMCDILMEF-UHFFFAOYSA-H 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- JHOPGIQVBWUSNH-UHFFFAOYSA-N iron tungsten Chemical compound [Fe].[Fe].[W] JHOPGIQVBWUSNH-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US291,520 | 1988-12-29 | ||
| US07/291,520 US4853827A (en) | 1988-08-01 | 1988-12-29 | High dielectric multilayer capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03503104A true JPH03503104A (ja) | 1991-07-11 |
Family
ID=23120636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50124289A Pending JPH03503104A (ja) | 1988-12-29 | 1989-11-14 | 高誘電多層コンデンサー |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0402446A1 (fr) |
| JP (1) | JPH03503104A (fr) |
| BR (1) | BR8907274A (fr) |
| GB (1) | GB2234855A (fr) |
| WO (1) | WO1990007785A1 (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
| US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
| US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
| US7782587B2 (en) | 2005-03-01 | 2010-08-24 | X2Y Attenuators, Llc | Internally overlapped conditioners |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3582729A (en) * | 1969-10-01 | 1971-06-01 | Gen Electric | Thick film capacitors and method of forming |
| US3673092A (en) * | 1970-06-05 | 1972-06-27 | Owens Illinois Inc | Multilayer dielectric compositions comprising lead-barium borosilicate glass and ceramic powder |
| US3679440A (en) * | 1971-01-18 | 1972-07-25 | Owens Illinois Inc | High k dielectric materials |
| US3988405A (en) * | 1971-04-07 | 1976-10-26 | Smith Robert D | Process for forming thin walled articles or thin sheets |
| US4071881A (en) * | 1976-03-30 | 1978-01-31 | E. I. Du Pont De Nemours And Company | Dielectric compositions of magnesium titanate and devices thereof |
| US4641221A (en) * | 1985-08-02 | 1987-02-03 | The Dow Chemical Company | Thin tape for dielectric materials |
-
1989
- 1989-11-14 WO PCT/US1989/005140 patent/WO1990007785A1/fr active Application Filing
- 1989-11-14 BR BR898907274A patent/BR8907274A/pt unknown
- 1989-11-14 JP JP50124289A patent/JPH03503104A/ja active Pending
- 1989-11-14 EP EP19900901177 patent/EP0402446A1/fr not_active Withdrawn
- 1989-11-14 GB GB9018907A patent/GB2234855A/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| GB2234855A (en) | 1991-02-13 |
| EP0402446A1 (fr) | 1990-12-19 |
| BR8907274A (pt) | 1991-03-12 |
| GB9018907D0 (en) | 1990-10-31 |
| WO1990007785A1 (fr) | 1990-07-12 |
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