EP0402446A1 - Condensateur multicouche a dielectrique eleve - Google Patents

Condensateur multicouche a dielectrique eleve

Info

Publication number
EP0402446A1
EP0402446A1 EP19900901177 EP90901177A EP0402446A1 EP 0402446 A1 EP0402446 A1 EP 0402446A1 EP 19900901177 EP19900901177 EP 19900901177 EP 90901177 A EP90901177 A EP 90901177A EP 0402446 A1 EP0402446 A1 EP 0402446A1
Authority
EP
European Patent Office
Prior art keywords
capacitor
chips
metallized
high dielectric
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19900901177
Other languages
German (de)
English (en)
Inventor
Jorge M. Hernandez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Corp
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/291,520 external-priority patent/US4853827A/en
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of EP0402446A1 publication Critical patent/EP0402446A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits

Definitions

  • This invention relates to the field of multi layer capacitors. More particularly, this invention relates to a multi layer capacitor which incorporates a flexible high dielectric constant sheet material as its insulator which results in a high capacitance, low inductance capacitor.
  • flexible high dielectric materials of this type are manufactured by mixing small particles (e.g. 1-3 microns) of a high dielectric constant material into a flexible polymeric matrix.
  • the resultant effective dielectric constant of the dielectric impregnated polymer is relatively low.
  • the dielectric constant of a Z5U BaTiO is in the range of 10,000 to 12,000.
  • a flexible polymer such as polyimide. polyester, polyetherimide and like materials
  • the effective dielectric constant relizable is only on the order of 20 to 40 (depending on the loading ratio of the dielectric in the polymer) .
  • prior art capacitive devices all suffer from high ESR and high expense.
  • An example of a prior art device is an aluminium electrolytic capacitor which has a high ESR (Equivalent Series
  • a prior art device is a large monolithic ceramic capacitor which is very expensive.
  • a Tantalum capacitor which has a high ESR and is only suitable for very low voltages of three to six volts.
  • a plurality of conductive elements are separated by and sandwiched between a plurality of layers of a high capacitance flexible dielectric material.
  • the dielectric material is comprised of a monolayer of multilayer or single layer high dielectric constant (e.g. ceramic) chips or pellets of relatively small area and thickness which are arranged in a planar array. These high dielectric constant chips are spaced apart by a small distance. The spaces between the chips are then filled with a flexible polymer/adhesive to define a cohesive sheet with the polymer binding the array of high dielectric constant (e.g.
  • the opposite planar surfaces of the array including the polymer
  • metallized e.g. electroless plated or metallized by vacuum deposition, sputtering, etc.
  • opposed metallized surfaces e.g. electroless plated or metallized by vacuum deposition, sputtering, etc.
  • the small high dielectric constant chip are cylindrical in shape.
  • the chips may be any other suitable shape including rectangular.
  • the high dielectric constant chips may include punches or cut-outs to improve mechanical adhesion between the chips and the polymeric binding material.
  • the discrete high dielectric constant monolayer may be comprised of an array of multilayer ceramic chips such as those disclosed at Figures 4 and 10 in U.S. Patent No. 4,748,537 and at
  • the high capacitance multilayer capacitor provides a very high capacitance capacitor module, yet it has low inductance and low ESR.
  • the capacitor is compact and easily installed.
  • the capacitor of the present invention is highly reliable, by virtue of using relatively thick ceramic chip elements as parts of the individual high capacitance flexible layers. This is in contrast to prior art MLC capacitors which use very thin dielectric layers (less than or equal to 0.001") where small deviations in thickness, or holes in the layer may cause problems.
  • FIGURE 1 is a perspective view of the high dielectric constant flexible sheet material of the present invention.
  • FIGURE 2 is a cross-sectional elevation view along the line 2-2 of FIGURE 1;
  • FIGURE 3 is a perspective view, similar to FIGURE 1, of a different embodiment of the present invention
  • FIGURE 4 is a cross-sectional elevation view along the line 4-4 of FIGURE 3;
  • FIGURES 5A, 5B and 5C are perspective views of alternative high dielectric constant pellet configurations which may be used in accordance with the present invention.
  • FIGURE 6 is a cross-sectional elevation view of still another embodiment of the present invention utilizing multilayer capacitive elements;
  • FIGURE 7 is a cross-sectional elevation view similar to FIGURE 6, subsequent to metallization
  • FIGURE 8 is a cross-sectional elevation view similar to FIGURE 7, and subsequent to additional metallization
  • FIGURE 9 is a cross-sectional front elevation view of the capacitor of the present invention.
  • FIGURE 10 is a cross-sectional front perspective view of the capacitance element of the capacitor of FIGURE 8.
  • FIGURE 11 is a sectional perspective view of the insulator used in the capacitor of FIGURE 8.
  • FIGURE 12 is an exploded front perspective view of the capacitance elements of an alternative embodiment of the capacitor of FIGURE 8;
  • FIGURE 13 is a front perspective view which shows the capacitance elements of FIGURE 11;
  • FIGURE 14 is a cross-sectional view of the capacitor of FIGURE 12. Description of the Preferred Embodiment:
  • the present invention relates to a high capacitance multi-layer capacitive element comprised of a plurality of interleaved conductive electrodes separated by a plurality of sheets of a high dielectric constant flexible polymeric material.
  • Flexible sheet 10 is comprised of a monolayer of high dielectric constant pellets or chips 12 which are of relatively small area and thickness and are arranged in a planar array. The chips are separated from each other by a small distance to define spaces therebetween. The spaces between the chips 12 are filled with a suitable polymeric material 14.
  • Polymeric material 14 will act as a binder to hold the array of high dielectric constant pellets 12 together.
  • polymeric material 14 will contact only the sides of pellets 12 and will be out of contact with the top and bottom surfaces 16 and 18 of each pellet 12. This will result in both end surfaces 16, 18 of high dielectric constant pellets 12 and end surfaces 20, 22 of polymeric binder 14 being exposed.
  • these opposed and exposed surfaces are metallized to define a thin (e.g. about 10-50 micro inches) metallized layer 24 and 26.
  • These thin metallized layers 24 and 26 may then be plated up to higher thicknesses (e.g. about 1-2 mils) by well known electroplating techniques to define layers 28 and
  • the thin metallized layers may be produced using any known method including electroless plating or by vapor deposition techniques including vacuum deposition, sputtering, etc.
  • the material used to produce high dielectric constant pellets 12 may be any suitable high dielectric constant material and is preferably a high dielectric constant ceramic material such as BaTiO-.
  • other known high dielectric ceramic materials may be utilized including lead magnesium niobate, iron tungsten niobate, etc. It will be appreciated that by "high” dielectric constant, it is meant dielectric constants of over about 10,000.
  • the pellets are relatively small and are preferably cylindrical in shape having a height of 0.015" and a diameter of 0.020". If a ceramic is used, the pellets should be fully sintered prior to being bonded together by the polymer.
  • any other suitably shaped high dielectric constant pellet may be used.
  • a flexible high capacitance sheet is shown at 32 incorporating an array of rectangularly shaped pellets 34 in a polymer matrix 36.
  • square shaped pellets are shown at 38, 39 and 40 respectively which are provided with from two through eight slots or grooves 42. It will be appreciated that these grooves or slots will provide a stronger mechanical bond between the polymeric binder and the pellet.
  • the pellet array is impregnated with a suitable polymer which may be a either a flexible thermoplastic or a flexibilized thermoset (epoxy, polye herimide, polyester, etc.) to give the array mechanical strength and electrical insulating stability with temperature, moisture, solvents, etc.
  • a suitable polymer which may be a either a flexible thermoplastic or a flexibilized thermoset (epoxy, polye herimide, polyester, etc.) to give the array mechanical strength and electrical insulating stability with temperature, moisture, solvents, etc.
  • the polymeric material should be a high temperature (approximately 350 F) polymer which is somewhat flexible and has a dielectric constant of between about 4-9.
  • Preferred materials include polyetherimides, polyimides, polyesters and epoxies. It will be appreciated that the flexibility is necessary to preclude cracking of the sheet under stress.
  • the dielectric sheet is electroless plated with copper or nickel.
  • the resultant sheet material will have an effective high dielectric constant of better than 1,000, a small thickness (approximately 0.005" - 0.015"), will be flexible, will be metallized on both sides and will be drillable and platable.
  • a mathematical analysis can be made to determine the effective dielectric constant of the combined pellet array and polymeric matrix.
  • FIGURES 1 and 2 which incorporates cylindrical pellets measuring 0.020" in diameter by 0.010" in length; and assuming a sheet of one square inch having a total of about 2,500 cylinders.
  • Capacitance of the dielectric sheet is determined using the following formula:
  • N number of dielectric pellets Assuming that the pellets are made of a Z5U dielectric with a dielectric constant of 15,000, then the capacitance of such an array would be:
  • a rectangular ceramic pellet (such as shown in FIGURE 3) made from lead magnesium niobate (having a dielectric constant of 17,000) is selected with each pellet having surface area dimensions of 0.20" x 0.30" and 0.015 " in thickness; and with the array of. pellets being spaced apart 0.020", then, using the same calculations as in Example 1, the capacitance will be 224 nF/sq.in.
  • an internal boundary layer dielectric is selected with a dielectric constant of approximately 60,000 [such as (Sr Q 4 Ba Q 6 ) TiOg + 10H 2 O] then the effective capacitance per square inch will be equal to 759 n F./sq.in.
  • Capacitive element 44 is a known multilayer ceramic chip capacitor (such as disclosed in aforementioned U.S. Patent Nos. 4,745,537 and 4,706,162) comprised of a plurality of metallized layers 46 with alternating layers being connected to end electrodes 48 and 50.
  • the top and bottom surfaces of multilayer chip 44 includes exposed electrodes 52 and 54 which are also connected to opposed end electrodes 48 and 50, respectively. Finally, an insulating cap 56 is provided on each end electrode 48 and 50 to prevent shorting between an exposed top or bottom electrode 52, 54 and one of the end electrodes 48 and 50.
  • a plurality of multilayer capacitive elements 44 are arranged in a monolayer array and a suitable polymeric adhesive 58 is used to bind the side edges of the multilayer chips 44 together. As shown in FIGURE 6, this will typically result in an undulating surface between the polymer 58 and each multilayer capacitive element 44.
  • the array can then be electroless plated with copper, nickel, tin or any other suitable plating material to define thin metallized outer layers 60 and 62.
  • the undulating surface features may be eliminated by sufficiently building up the thickness of the plated electrodes and then grinding or lapping them to define a planar outer surface as in FIGURE 8.
  • FIGURE 8 As an illustration of the levels of capacitance achievable with the embodiment of FIGURES 6-8, a flexible sheet of the type shown in FIGURE 8 using multilayer capacitive elements 44 having length dimensions of 0.35", width dimensions of 0.20" and thickness dimensions of 0.018" will be discussed.
  • the dielectric used in the capacitive element is a lead magnesium niobate dielectric wherein capacitance on an average of 1.0 micro F/chip is obtainable.
  • a 0.030" gap between chips in the chip array there would be 4.4 chips in the y direction and 3.03 chips in the x direction for a total of 13.33 chips per square inch or a total capacitance of 13.33 micro F./sq.in. This is compared to the far lower capacitance obtained from using the embodiment of FIGURE 1 (see Example 1) of 0.312 micro F./sq.in.
  • Capacitor 70 is comprised of a plurality of spaced layers 72 of flexible dielectric sheet material of the type described in FIGURES 1-8. Layers 72 are separated by layers 73 of a suitable insulative material. A pair of conductive ribbons 74 and 76 are electrically connected to respective adjacent metallized layers 78 and 80 of each layer 72. Thus, conductive ribbon 74 includes a plurality of substantially perpendicular extensions 82 which electrically connect to alternating metallized layers 78 and 80 while ribbon 76 includes a plurality of extensions 84 for like electrical connection.
  • dielectric insulators 72 and conductor ribbons 74 and 76 are encased in an encapsulating material 86.
  • One end of each ribbon 74 and 76 extends beyond the edge of the encapsulating material 86 to form bent tabs 88.
  • Tabs 88 of capacitor 70 allow for electrical contact with other circuitry.
  • Dielectric layers 72 are comprised primarily of high dielectric flexible sheet material 10 and include opposed polymeric end portions 90.
  • Conductive ribbon 74 and 76 contacts dielectric layers at opposing ends.
  • Conductive ribbons 74 and 76 are flattened elongated, relatively wide piece of conductive material. Extensions 82 and 84 are displaced parallel from one another at preselected distances to enable the extensions to contact the dielectric layers at appropriate locations.
  • capacitor 70 Because of the high dielectric flexible layer 10 and wide conductive ribbon 74 and 76, capacitor 70 has both high capacitance and low inductance. A capacitor with these electrical properties is well suited for to noise suppression in high current power distribution systems digital computers, telecommunications modules AC ripple filtering in DC power supplies, etc.
  • Capacitor 90 comprises a stack-up of alternating dielectric layers 92, insulating layers 94 (also shown in FIGURE 14) and conductive layers 96. Conductive layers 96 are perpendicular to one another and every other layer 96 is separated by a dielectric layer 92, an insulating layer 94, and a perpendicular conductive layer 96.
  • dielectric layers 92 are of the type disclosed in FIGURES 1-8 and at 72 in FIGURES 9-11. Each conductive layer is perpendicular to an adjacent conductive layer as shown in the FIGURES.
  • conductive layers 96 are electrically attached (via solder or conductive adhesive) to the metallized layers on dielectric sheet 92.
  • the stack-up includes as many layers as are needed to reach a predetermined capacitance.
  • an encapsulating material 98 encapsulates the layers.
  • Insulation layer 94 may be any insulative material, but preferably comprises an insulating adhesive or suitable polymer.
  • Conductive layers 96 are comprised of a flat elongated conductive metal. Each layer 96 is bent together to form a uniform tab 98. Tab 98 has a placement means (e.g. opening 100) for attachment to circuitry.
  • FIGURES 12-14 has an advantage over • the embodiment of FIGURES 9-11 in that only one main body is required to maintain capacitance for two circuits.
  • both of the multi-layer capacitor embodiments of FIGURES 9-14 exhibit excellent electrical and mechanical characteristics including low inductance, low ESR and a compact, sturdy body for ease of installation.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

Condensateur multicouche de capacitance élevée et de basse inductance, se composant de plusieurs couches conductrices (28, 30) séparées les unes des autres par un matériau diélectrique flexible en feuilles à capacitance élevée qui est pris entre lesdites couches. Ledit matériau diélectrique en feuilles consiste en une couche monomoléculaire d'une couche unique ou multicouche de pastilles ou granules (12) à diélectrique élevé (par exemple de céramique) ayant une superficie et une épaisseur relativement petites et qui sont disposées en rangées plates. Lesdites pastilles à constante diélectrique élevée sont espacées par un écart de faible ampleur, qui est rempli ensuite par un adhésif/polymère flexible (14) de manière à former une feuille cohésive, où le polymère lie ensemble les rangées de pastilles à diélectrique élevé (par exemple de céramique). Par la suite, les surfaces planes opposées des rangées (y compris le polymère) sont recouvertes sans courant ou métallisées ou vaporisées sous vide par électrolyse, pour former des surface opposées métallisées.
EP19900901177 1988-12-29 1989-11-14 Condensateur multicouche a dielectrique eleve Withdrawn EP0402446A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/291,520 US4853827A (en) 1988-08-01 1988-12-29 High dielectric multilayer capacitor
US291520 1988-12-29

Publications (1)

Publication Number Publication Date
EP0402446A1 true EP0402446A1 (fr) 1990-12-19

Family

ID=23120636

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19900901177 Withdrawn EP0402446A1 (fr) 1988-12-29 1989-11-14 Condensateur multicouche a dielectrique eleve

Country Status (5)

Country Link
EP (1) EP0402446A1 (fr)
JP (1) JPH03503104A (fr)
BR (1) BR8907274A (fr)
GB (1) GB2234855A (fr)
WO (1) WO1990007785A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
JP2008535207A (ja) 2005-03-01 2008-08-28 エックストゥーワイ アテニュエイターズ，エルエルシー 共平面導体を有する調整器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3582729A (en) * 1969-10-01 1971-06-01 Gen Electric Thick film capacitors and method of forming
US3673092A (en) * 1970-06-05 1972-06-27 Owens Illinois Inc Multilayer dielectric compositions comprising lead-barium borosilicate glass and ceramic powder
US3679440A (en) * 1971-01-18 1972-07-25 Owens Illinois Inc High k dielectric materials
US3988405A (en) * 1971-04-07 1976-10-26 Smith Robert D Process for forming thin walled articles or thin sheets
US4071881A (en) * 1976-03-30 1978-01-31 E. I. Du Pont De Nemours And Company Dielectric compositions of magnesium titanate and devices thereof
US4641221A (en) * 1985-08-02 1987-02-03 The Dow Chemical Company Thin tape for dielectric materials

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9007785A1 *

Also Published As

Publication number Publication date
GB9018907D0 (en) 1990-10-31
GB2234855A (en) 1991-02-13
JPH03503104A (ja) 1991-07-11
WO1990007785A1 (fr) 1990-07-12
BR8907274A (pt) 1991-03-12

Similar Documents

Publication Publication Date Title
US4853827A (en) High dielectric multilayer capacitor
US4908258A (en) High dielectric constant flexible sheet material
US5065284A (en) Multilayer printed wiring board
USRE35064E (en) Multilayer printed wiring board
US9679697B2 (en) Method for manufacturing multilayer ceramic condenser
US7170737B2 (en) Window via capacitor
CN103971930B (zh) 多层陶瓷电容器及其制造方法
CN104658756B (zh) 多层陶瓷电子组件和其上安装有多层陶瓷电子组件的板
US4274124A (en) Thick film capacitor having very low internal inductance
US20100188799A1 (en) Controlled esr low inductance capacitor
CN101308727A (zh) 焊盘格栅穿心低等效串联电感技术
GB2096820A (en) Multilayer bus bar
US5051542A (en) Low impedance bus bar
US4599486A (en) High capacitance bus bar including multilayer ceramic capacitors
US4399321A (en) High capacitance bus bar including multilayer ceramic capacitors
US5185690A (en) High dielectric constant sheet material
CN101465204A (zh) 叠层电容器阵列
US7535694B2 (en) Feedthrough multilayer capacitor
USH416H (en) High capacitance flexible circuit
US20190259533A1 (en) Electronic component
KR20190121169A (ko) 적층 세라믹 전자부품
EP0402446A1 (fr) Condensateur multicouche a dielectrique eleve
CN111161955B (zh) 多层陶瓷电子组件
US20090161292A1 (en) Laminated ceramic capacitor
CN114694968A (zh) 多层电容器和其上安装有该多层电容器的板

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): FR

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 19910115

RHK1 Main classification (correction)

Ipc: H01G 4/30