JPH0347333Y2 - - Google Patents
Info
- Publication number
- JPH0347333Y2 JPH0347333Y2 JP1986046775U JP4677586U JPH0347333Y2 JP H0347333 Y2 JPH0347333 Y2 JP H0347333Y2 JP 1986046775 U JP1986046775 U JP 1986046775U JP 4677586 U JP4677586 U JP 4677586U JP H0347333 Y2 JPH0347333 Y2 JP H0347333Y2
- Authority
- JP
- Japan
- Prior art keywords
- cap
- sealing
- electronic component
- anodic oxide
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Closures For Containers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986046775U JPH0347333Y2 (enExample) | 1986-03-29 | 1986-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986046775U JPH0347333Y2 (enExample) | 1986-03-29 | 1986-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62158828U JPS62158828U (enExample) | 1987-10-08 |
| JPH0347333Y2 true JPH0347333Y2 (enExample) | 1991-10-08 |
Family
ID=30866752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986046775U Expired JPH0347333Y2 (enExample) | 1986-03-29 | 1986-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0347333Y2 (enExample) |
-
1986
- 1986-03-29 JP JP1986046775U patent/JPH0347333Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62158828U (enExample) | 1987-10-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR0154111B1 (ko) | 알루미늄 합금 반도체 패키지 | |
| US5892278A (en) | Aluminum and aluminum alloy radiator for semiconductor device and process for producing the same | |
| JPH0821519B2 (ja) | チップ型固体電解コンデンサおよびその製造方法 | |
| JPH0362261B2 (enExample) | ||
| JPH0575180B2 (enExample) | ||
| JPH0347332Y2 (enExample) | ||
| JP2520850Y2 (ja) | 電子部品封止用キャップ | |
| JPH0414935Y2 (enExample) | ||
| JPH0342683Y2 (enExample) | ||
| JPS62183541A (ja) | 電子部品封止用キヤツプとその製造方法 | |
| JPH0353508Y2 (enExample) | ||
| JPS62214644A (ja) | 電子部品封止用キヤツプとその製造方法 | |
| JPH01156496A (ja) | 耐蝕被覆方法 | |
| JP2550991B2 (ja) | ピングリッドアレイ半導体モジュ−ル | |
| KR950006468B1 (ko) | 칩형 탄탈콘덴서의 소자와 리드프레임의 접착방법 | |
| JPH0535032B2 (enExample) | ||
| JPH0311903Y2 (enExample) | ||
| JPS6119154A (ja) | 樹脂封止型半導体装置 | |
| JPH0452999Y2 (enExample) | ||
| JPS62158828U (enExample) | ||
| JPH0620315Y2 (ja) | 面発熱体 | |
| JPS5936909Y2 (ja) | 固体電解コンデンサ | |
| JPS6054784B2 (ja) | Icパツケ−ジの製造方法 | |
| JPH0331076Y2 (enExample) | ||
| JPS60135596A (ja) | 陽極酸化被膜の処理方法 |