JPH0347244Y2 - - Google Patents
Info
- Publication number
- JPH0347244Y2 JPH0347244Y2 JP18680486U JP18680486U JPH0347244Y2 JP H0347244 Y2 JPH0347244 Y2 JP H0347244Y2 JP 18680486 U JP18680486 U JP 18680486U JP 18680486 U JP18680486 U JP 18680486U JP H0347244 Y2 JPH0347244 Y2 JP H0347244Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- strip
- copper foil
- fusible
- insulating tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 239000011889 copper foil Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 6
- 230000000670 limiting effect Effects 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002195 soluble material Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18680486U JPH0347244Y2 (fr) | 1986-12-05 | 1986-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18680486U JPH0347244Y2 (fr) | 1986-12-05 | 1986-12-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6393046U JPS6393046U (fr) | 1988-06-16 |
| JPH0347244Y2 true JPH0347244Y2 (fr) | 1991-10-08 |
Family
ID=31136695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18680486U Expired JPH0347244Y2 (fr) | 1986-12-05 | 1986-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0347244Y2 (fr) |
-
1986
- 1986-12-05 JP JP18680486U patent/JPH0347244Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6393046U (fr) | 1988-06-16 |
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