JPH0346517Y2 - - Google Patents
Info
- Publication number
- JPH0346517Y2 JPH0346517Y2 JP1984198920U JP19892084U JPH0346517Y2 JP H0346517 Y2 JPH0346517 Y2 JP H0346517Y2 JP 1984198920 U JP1984198920 U JP 1984198920U JP 19892084 U JP19892084 U JP 19892084U JP H0346517 Y2 JPH0346517 Y2 JP H0346517Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- auxiliary
- insulating substrate
- pattern
- layer wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984198920U JPH0346517Y2 (en:Method) | 1984-12-28 | 1984-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984198920U JPH0346517Y2 (en:Method) | 1984-12-28 | 1984-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61114880U JPS61114880U (en:Method) | 1986-07-19 |
| JPH0346517Y2 true JPH0346517Y2 (en:Method) | 1991-10-01 |
Family
ID=30758360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984198920U Expired JPH0346517Y2 (en:Method) | 1984-12-28 | 1984-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0346517Y2 (en:Method) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0514553Y2 (en:Method) * | 1987-07-22 | 1993-04-19 | ||
| JPH0648906Y2 (ja) * | 1988-08-04 | 1994-12-12 | 富士通株式会社 | 多層基板のパターン構造 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5956793A (ja) * | 1982-09-27 | 1984-04-02 | 株式会社日立製作所 | 非貫通信号経由孔形成方法 |
-
1984
- 1984-12-28 JP JP1984198920U patent/JPH0346517Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61114880U (en:Method) | 1986-07-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1501500A (en) | Multilayer printed circuit boards | |
| JPH0346517Y2 (en:Method) | ||
| US5132864A (en) | Printed circuit board | |
| JPS63271996A (ja) | 大電流用プリント基板 | |
| CN223310005U (zh) | 一种低电阻电路板 | |
| JPH01290283A (ja) | 混成集積回路用厚膜印刷基板 | |
| GB1456994A (en) | Methods for forming electrical internconnection between metal layers for printed circuit assembly | |
| JPS6424492A (en) | Coil device | |
| JPH0143877Y2 (en:Method) | ||
| JP2025141604A (ja) | プリント基板、および電子制御装置 | |
| JPH0350782A (ja) | 回路モジュール | |
| JPS61100178U (en:Method) | ||
| JPH06851Y2 (ja) | セラミック多層配線基板 | |
| JPS63100867U (en:Method) | ||
| JPH0672249U (ja) | 集積回路装置 | |
| JPS61131868U (en:Method) | ||
| JPH0349292A (ja) | プリント配線板 | |
| JPH031465U (en:Method) | ||
| JPS61270897A (ja) | 多層回路基板 | |
| JPS62200788A (ja) | 多層プリント板 | |
| JPS62208691A (ja) | 両面実装型混成集積回路 | |
| JPS6273640A (ja) | ハイブリツド型集積回路 | |
| JPH04120263U (ja) | 電子回路組立体 | |
| JPH0288268U (en:Method) | ||
| JPH01289195A (ja) | 両面パターン基板回路 |