JPH0343751Y2 - - Google Patents

Info

Publication number
JPH0343751Y2
JPH0343751Y2 JP1987084601U JP8460187U JPH0343751Y2 JP H0343751 Y2 JPH0343751 Y2 JP H0343751Y2 JP 1987084601 U JP1987084601 U JP 1987084601U JP 8460187 U JP8460187 U JP 8460187U JP H0343751 Y2 JPH0343751 Y2 JP H0343751Y2
Authority
JP
Japan
Prior art keywords
heat
printed circuit
circuit board
piece
radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1987084601U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63193896U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987084601U priority Critical patent/JPH0343751Y2/ja
Publication of JPS63193896U publication Critical patent/JPS63193896U/ja
Application granted granted Critical
Publication of JPH0343751Y2 publication Critical patent/JPH0343751Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP1987084601U 1987-05-29 1987-05-29 Expired JPH0343751Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987084601U JPH0343751Y2 (enExample) 1987-05-29 1987-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987084601U JPH0343751Y2 (enExample) 1987-05-29 1987-05-29

Publications (2)

Publication Number Publication Date
JPS63193896U JPS63193896U (enExample) 1988-12-14
JPH0343751Y2 true JPH0343751Y2 (enExample) 1991-09-12

Family

ID=30939246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987084601U Expired JPH0343751Y2 (enExample) 1987-05-29 1987-05-29

Country Status (1)

Country Link
JP (1) JPH0343751Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7603279B2 (ja) * 2021-03-29 2024-12-20 株式会社アカネ ヒートシンク部材

Also Published As

Publication number Publication date
JPS63193896U (enExample) 1988-12-14

Similar Documents

Publication Publication Date Title
KR0156013B1 (ko) 태브 집적회로에 대한 히트싱크 및 커버
JP2001159931A (ja) コンピュータ
CN101730445A (zh) 散热装置
US5790379A (en) Surface complemental heat dissipation device
JP2928236B1 (ja) 発熱素子の放熱部材
US6483704B2 (en) Microprocessor heat sink retention module
JP2000269676A (ja) 電子機器の放熱装置
JPH08130385A (ja) 電子回路基板及びその冷却方法
JPH0412683Y2 (enExample)
CN217689993U (zh) 电源装置和具有电源装置的计算设备
JPH0334916Y2 (enExample)
JP2556436Y2 (ja) 電子機器用筐体
KR20000008453A (ko) 냉각장치를 갖는 반도체 패키지
KR200373156Y1 (ko) 전기,전자제품용 히트싱크
JPS6141244Y2 (enExample)
JPH06334374A (ja) 電子装置の冷却機構
JPH11220278A (ja) 発熱部品の放熱構造
JPH07106782A (ja) 電子機器における冷却構造
JPH0322920Y2 (enExample)
JPH0445249Y2 (enExample)
JP2830686B2 (ja) 電子機器
JP2595054Y2 (ja) 電子制御ユニットの放熱装置
JPH08204371A (ja) 電子部品の放熱構造
JP2522519Y2 (ja) ヒートシンク
KR100281527B1 (ko) 반도체 집적회로 냉각장치