JPH0343248Y2 - - Google Patents
Info
- Publication number
- JPH0343248Y2 JPH0343248Y2 JP5703688U JP5703688U JPH0343248Y2 JP H0343248 Y2 JPH0343248 Y2 JP H0343248Y2 JP 5703688 U JP5703688 U JP 5703688U JP 5703688 U JP5703688 U JP 5703688U JP H0343248 Y2 JPH0343248 Y2 JP H0343248Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- solution
- base metal
- pinholes
- plated product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 52
- 239000000243 solution Substances 0.000 claims description 26
- 239000010953 base metal Substances 0.000 claims description 21
- 229910021645 metal ion Inorganic materials 0.000 claims description 10
- 238000005260 corrosion Methods 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 claims description 6
- 239000003929 acidic solution Substances 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims description 3
- 239000012670 alkaline solution Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- -1 aluminum ions Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Investigating And Analyzing Materials By Characteristic Methods (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5703688U JPH0343248Y2 (cg-RX-API-DMAC7.html) | 1988-04-27 | 1988-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5703688U JPH0343248Y2 (cg-RX-API-DMAC7.html) | 1988-04-27 | 1988-04-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01161270U JPH01161270U (cg-RX-API-DMAC7.html) | 1989-11-09 |
| JPH0343248Y2 true JPH0343248Y2 (cg-RX-API-DMAC7.html) | 1991-09-10 |
Family
ID=31282891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5703688U Expired JPH0343248Y2 (cg-RX-API-DMAC7.html) | 1988-04-27 | 1988-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0343248Y2 (cg-RX-API-DMAC7.html) |
-
1988
- 1988-04-27 JP JP5703688U patent/JPH0343248Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01161270U (cg-RX-API-DMAC7.html) | 1989-11-09 |
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