JPH0343179Y2 - - Google Patents

Info

Publication number
JPH0343179Y2
JPH0343179Y2 JP1985200387U JP20038785U JPH0343179Y2 JP H0343179 Y2 JPH0343179 Y2 JP H0343179Y2 JP 1985200387 U JP1985200387 U JP 1985200387U JP 20038785 U JP20038785 U JP 20038785U JP H0343179 Y2 JPH0343179 Y2 JP H0343179Y2
Authority
JP
Japan
Prior art keywords
chip
shaped electronic
adhesive
electronic component
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985200387U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62108265U (US07368563-20080506-C00056.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985200387U priority Critical patent/JPH0343179Y2/ja
Publication of JPS62108265U publication Critical patent/JPS62108265U/ja
Application granted granted Critical
Publication of JPH0343179Y2 publication Critical patent/JPH0343179Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Packages (AREA)
JP1985200387U 1985-12-27 1985-12-27 Expired JPH0343179Y2 (US07368563-20080506-C00056.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985200387U JPH0343179Y2 (US07368563-20080506-C00056.png) 1985-12-27 1985-12-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985200387U JPH0343179Y2 (US07368563-20080506-C00056.png) 1985-12-27 1985-12-27

Publications (2)

Publication Number Publication Date
JPS62108265U JPS62108265U (US07368563-20080506-C00056.png) 1987-07-10
JPH0343179Y2 true JPH0343179Y2 (US07368563-20080506-C00056.png) 1991-09-10

Family

ID=31162850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985200387U Expired JPH0343179Y2 (US07368563-20080506-C00056.png) 1985-12-27 1985-12-27

Country Status (1)

Country Link
JP (1) JPH0343179Y2 (US07368563-20080506-C00056.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022044766A1 (ja) * 2020-08-28 2022-03-03 株式会社村田製作所 積層コンデンサ、積層コンデンサ群および積層コンデンサの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5769297U (US07368563-20080506-C00056.png) * 1980-10-14 1982-04-26

Also Published As

Publication number Publication date
JPS62108265U (US07368563-20080506-C00056.png) 1987-07-10

Similar Documents

Publication Publication Date Title
US3729819A (en) Method and device for fabricating printed wiring or the like
US3703603A (en) Rub-on sub-element for electronic circuit board
JPH0567869A (ja) 電装部品接合方法並びにモジユール及び多層基板
JPH1022645A (ja) キャビティ付きプリント配線板の製造方法
JP2844778B2 (ja) 片面プリント基板に2種類の部品を半田付けする方法
JPH0343179Y2 (US07368563-20080506-C00056.png)
JPS63204695A (ja) 可撓性プリント基板への部品実装用粘着基板
JPS6464389A (en) Flexible printed-circuit board
JPS63283136A (ja) 回路基板の実装方法
JPH07195657A (ja) クリーム半田の塗布装置
JPH0435000A (ja) 回路基板へのチップ部品の実装方法
JPS6364916B2 (US07368563-20080506-C00056.png)
JPS594879B2 (ja) チップ部品の実装方法
JPS599996A (ja) 電子部品仮固定方法
JP2581103B2 (ja) チップ部品の導電接合方法
JPS63204696A (ja) 可撓性プリント基板への部品ハンダ付け実装法
JPH051640B2 (US07368563-20080506-C00056.png)
JPH01276695A (ja) 表面実装型電子部品とそのテーピング体
JPS6272473A (ja) はんだ付装置
JPS61267335A (ja) 回路間の接続方法および該回路間の接続方法に使用する導電シ−ト
JPH02128500A (ja) フレキシブルプリント配線板の製造法
JPH01220801A (ja) チップ状電気素子
JP3110329B2 (ja) 電子部品の半田付け方法
JPS629756Y2 (US07368563-20080506-C00056.png)
JPH0535339U (ja) スクリーン印刷用の版