JPH0342683Y2 - - Google Patents

Info

Publication number

JPH0342683Y2

JPH0342683Y2 JP2081686U JP2081686U JPH0342683Y2 JP H0342683 Y2 JPH0342683 Y2 JP H0342683Y2 JP 2081686 U JP2081686 U JP 2081686U JP 2081686 U JP2081686 U JP 2081686U JP H0342683 Y2 JPH0342683 Y2 JP H0342683Y2

Authority

JP

Japan

Prior art keywords

electronic component

cap

substrate

sealing

board

Prior art date

1986-02-14

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 238000007789 sealing Methods 0.000 claims description 34
• 239000000463 material Substances 0.000 claims description 18
• 229910052782 aluminium Inorganic materials 0.000 claims description 9
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
• 239000000758 substrate Substances 0.000 description 25
• 239000010407 anodic oxide Substances 0.000 description 15
• 239000000853 adhesive Substances 0.000 description 12
• 230000001070 adhesive effect Effects 0.000 description 12
• 239000012790 adhesive layer Substances 0.000 description 9
• 239000011248 coating agent Substances 0.000 description 6
• 238000000576 coating method Methods 0.000 description 6
• 239000011347 resin Substances 0.000 description 5
• 229920005989 resin Polymers 0.000 description 5
• QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
• 230000007797 corrosion Effects 0.000 description 3
• 238000005260 corrosion Methods 0.000 description 3
• 229910052751 metal Inorganic materials 0.000 description 3
• 239000002184 metal Substances 0.000 description 3
• 239000003973 paint Substances 0.000 description 3
• 150000003839 salts Chemical class 0.000 description 3
• 239000007864 aqueous solution Substances 0.000 description 2
• 239000000919 ceramic Substances 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 230000036571 hydration Effects 0.000 description 2
• 238000006703 hydration reaction Methods 0.000 description 2
• 230000000873 masking effect Effects 0.000 description 2
• 238000000034 method Methods 0.000 description 2
• 230000005457 Black-body radiation Effects 0.000 description 1
• MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
• 238000005452 bending Methods 0.000 description 1
• 238000004040 coloring Methods 0.000 description 1
• 230000007547 defect Effects 0.000 description 1
• 238000001035 drying Methods 0.000 description 1
• 238000004043 dyeing Methods 0.000 description 1
• 230000017525 heat dissipation Effects 0.000 description 1
• 239000010410 layer Substances 0.000 description 1
• 239000002075 main ingredient Substances 0.000 description 1
• 229940078494 nickel acetate Drugs 0.000 description 1
• 239000011148 porous material Substances 0.000 description 1
• 239000004065 semiconductor Substances 0.000 description 1
• 239000000126 substance Substances 0.000 description 1