JPH0341848U - - Google Patents

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Publication number
JPH0341848U
JPH0341848U JP10209889U JP10209889U JPH0341848U JP H0341848 U JPH0341848 U JP H0341848U JP 10209889 U JP10209889 U JP 10209889U JP 10209889 U JP10209889 U JP 10209889U JP H0341848 U JPH0341848 U JP H0341848U
Authority
JP
Japan
Prior art keywords
reaction chamber
electrode
heater
plasma cvd
reaction gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10209889U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10209889U priority Critical patent/JPH0341848U/ja
Publication of JPH0341848U publication Critical patent/JPH0341848U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図と第2図は、本考案の各実施例によるプ
ラズマCVD装置の概略を示す説明図、第3図は
、従来例によるプラズマCVD装置の概略を示す
説明図である。 1……ヒータ、2……基板、3……電極、4…
…排気ダクト、5……電極部ヒータ、6……反応
ガス導入路、7……高周波電流発生器、10……
反応室。
1 and 2 are explanatory diagrams schematically showing plasma CVD apparatuses according to embodiments of the present invention, and FIG. 3 is an explanatory diagram schematically showing a plasma CVD apparatus according to a conventional example. 1... Heater, 2... Substrate, 3... Electrode, 4...
... Exhaust duct, 5 ... Electrode heater, 6 ... Reactant gas introduction path, 7 ... High frequency current generator, 10 ...
reaction chamber.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 反応室10の中に収納される基板2を加熱する
ヒータ1と、上記反応室10の中に反応ガスを導
入する反応ガス導入路6と、上記反応室10の中
の反応ガスを排気する排気ダクト4と、上記反応
室10の中に配置された電極3と、同電極3に高
周波電流を流す高周波電流発生器7とを備えるプ
ラズマCVD装置において、上記電極3の部分を
加熱するヒータ5を備えることを特徴とするプラ
ズマCVD装置。
A heater 1 that heats the substrate 2 housed in the reaction chamber 10, a reaction gas introduction path 6 that introduces a reaction gas into the reaction chamber 10, and an exhaust that exhausts the reaction gas inside the reaction chamber 10. In a plasma CVD apparatus comprising a duct 4, an electrode 3 disposed in the reaction chamber 10, and a high frequency current generator 7 for passing a high frequency current through the electrode 3, a heater 5 for heating a portion of the electrode 3 is provided. A plasma CVD apparatus comprising:
JP10209889U 1989-08-31 1989-08-31 Pending JPH0341848U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10209889U JPH0341848U (en) 1989-08-31 1989-08-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10209889U JPH0341848U (en) 1989-08-31 1989-08-31

Publications (1)

Publication Number Publication Date
JPH0341848U true JPH0341848U (en) 1991-04-22

Family

ID=31651017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10209889U Pending JPH0341848U (en) 1989-08-31 1989-08-31

Country Status (1)

Country Link
JP (1) JPH0341848U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63119520A (en) * 1986-11-07 1988-05-24 Agency Of Ind Science & Technol Method and apparatus for depositing amorphous silicon alloy
JPH0217555B2 (en) * 1979-08-23 1990-04-20 Sankyo Co
JPH02236279A (en) * 1989-03-08 1990-09-19 Fujitsu Ltd Device for forming thin amorphous silicon film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217555B2 (en) * 1979-08-23 1990-04-20 Sankyo Co
JPS63119520A (en) * 1986-11-07 1988-05-24 Agency Of Ind Science & Technol Method and apparatus for depositing amorphous silicon alloy
JPH02236279A (en) * 1989-03-08 1990-09-19 Fujitsu Ltd Device for forming thin amorphous silicon film

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