JPH0341064B2 - - Google Patents
Info
- Publication number
- JPH0341064B2 JPH0341064B2 JP16047483A JP16047483A JPH0341064B2 JP H0341064 B2 JPH0341064 B2 JP H0341064B2 JP 16047483 A JP16047483 A JP 16047483A JP 16047483 A JP16047483 A JP 16047483A JP H0341064 B2 JPH0341064 B2 JP H0341064B2
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- aluminum hydroxide
- cellulose fiber
- laminate
- fiber base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004080 punching Methods 0.000 claims description 24
- 229920003043 Cellulose fiber Polymers 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 239000002344 surface layer Substances 0.000 claims description 9
- 239000010410 layer Substances 0.000 claims description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 17
- 239000002655 kraft paper Substances 0.000 description 16
- 238000005476 soldering Methods 0.000 description 12
- 239000000123 paper Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 239000005011 phenolic resin Substances 0.000 description 8
- 238000000465 moulding Methods 0.000 description 6
- 238000009824 pressure lamination Methods 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229910001679 gibbsite Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XBWAZCLHZCFCGK-UHFFFAOYSA-N 7-chloro-1-methyl-5-phenyl-3,4-dihydro-2h-1,4-benzodiazepin-1-ium;chloride Chemical compound [Cl-].C12=CC(Cl)=CC=C2[NH+](C)CCN=C1C1=CC=CC=C1 XBWAZCLHZCFCGK-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- MBHRHUJRKGNOKX-UHFFFAOYSA-N [(4,6-diamino-1,3,5-triazin-2-yl)amino]methanol Chemical compound NC1=NC(N)=NC(NCO)=N1 MBHRHUJRKGNOKX-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16047483A JPS6052332A (ja) | 1983-09-02 | 1983-09-02 | 打抜き加工性の良好な熱硬化性樹脂積層板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16047483A JPS6052332A (ja) | 1983-09-02 | 1983-09-02 | 打抜き加工性の良好な熱硬化性樹脂積層板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6052332A JPS6052332A (ja) | 1985-03-25 |
| JPH0341064B2 true JPH0341064B2 (zh) | 1991-06-20 |
Family
ID=15715733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16047483A Granted JPS6052332A (ja) | 1983-09-02 | 1983-09-02 | 打抜き加工性の良好な熱硬化性樹脂積層板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6052332A (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6144634A (ja) * | 1984-08-09 | 1986-03-04 | 昭和電工株式会社 | プリント基板 |
-
1983
- 1983-09-02 JP JP16047483A patent/JPS6052332A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6052332A (ja) | 1985-03-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6673190B2 (en) | Lasable bond-ply materials for high density printed wiring boards | |
| JPH02197190A (ja) | 多層印刷配線板 | |
| JPH10131017A (ja) | 積層板用基材及びその製造法ならびにプリプレグ及び積層板 | |
| JPS607796A (ja) | 印刷回路用銅張積層板及びその製造方法 | |
| US20040170795A1 (en) | Lasable bond-ply materials for high density printed wiring boards | |
| JPH0341064B2 (zh) | ||
| JP2003204154A (ja) | 多層プリント配線板の製造法 | |
| JP2612129B2 (ja) | 積層板 | |
| JPH0744344B2 (ja) | 金属コア内蔵型多層プリント基板の製造方法 | |
| JPS6112331A (ja) | 打抜き加工性の良好な熱硬化性樹脂積層板の製造方法 | |
| JPH0771840B2 (ja) | 銅張積層板およびその製造法 | |
| JPH11100767A (ja) | 積層板用基材及びその製造法ならびにプリプレグ及び積層板 | |
| JPH041770B2 (zh) | ||
| JPS6031956A (ja) | 寸法安定性の良好な熱硬化性樹脂積層板 | |
| JPH0356583B2 (zh) | ||
| JPS6241468B2 (zh) | ||
| JPS60255830A (ja) | 打抜き加工性の良好な熱硬化性樹脂積層板の製造方法 | |
| JPH11163527A (ja) | 多層配線板の製造法 | |
| JPH0324897B2 (zh) | ||
| JPH0464434A (ja) | 熱硬化性樹脂積層板 | |
| JPS59184643A (ja) | 不飽和ポリエステル樹脂積層板 | |
| JPH0497838A (ja) | 銅張積層板 | |
| JPH0878854A (ja) | 多層プリント配線板用基板 | |
| JPH04316836A (ja) | 積層板の製造方法 | |
| JPH06260765A (ja) | 多層配線基板及び多層配線板の製造方法 |