JPH034021Y2 - - Google Patents
Info
- Publication number
- JPH034021Y2 JPH034021Y2 JP18174285U JP18174285U JPH034021Y2 JP H034021 Y2 JPH034021 Y2 JP H034021Y2 JP 18174285 U JP18174285 U JP 18174285U JP 18174285 U JP18174285 U JP 18174285U JP H034021 Y2 JPH034021 Y2 JP H034021Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- insulating plate
- utility
- electrolytic capacitor
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 39
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 27
- 238000007789 sealing Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000006071 cream Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004826 seaming Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18174285U JPH034021Y2 (xx) | 1985-11-25 | 1985-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18174285U JPH034021Y2 (xx) | 1985-11-25 | 1985-11-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6289124U JPS6289124U (xx) | 1987-06-08 |
| JPH034021Y2 true JPH034021Y2 (xx) | 1991-02-01 |
Family
ID=31126894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18174285U Expired JPH034021Y2 (xx) | 1985-11-25 | 1985-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH034021Y2 (xx) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0683009B2 (ja) * | 1988-07-22 | 1994-10-19 | 日本電波工業株式会社 | 絶縁板及び圧電振動子 |
-
1985
- 1985-11-25 JP JP18174285U patent/JPH034021Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6289124U (xx) | 1987-06-08 |
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