JPH034019Y2 - - Google Patents
Info
- Publication number
- JPH034019Y2 JPH034019Y2 JP1984070841U JP7084184U JPH034019Y2 JP H034019 Y2 JPH034019 Y2 JP H034019Y2 JP 1984070841 U JP1984070841 U JP 1984070841U JP 7084184 U JP7084184 U JP 7084184U JP H034019 Y2 JPH034019 Y2 JP H034019Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- lead wires
- parallel
- resin layer
- exterior resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 30
- 238000005452 bending Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7084184U JPS60183428U (ja) | 1984-05-15 | 1984-05-15 | チツプ形電解コンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7084184U JPS60183428U (ja) | 1984-05-15 | 1984-05-15 | チツプ形電解コンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60183428U JPS60183428U (ja) | 1985-12-05 |
| JPH034019Y2 true JPH034019Y2 (it) | 1991-02-01 |
Family
ID=30607790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7084184U Granted JPS60183428U (ja) | 1984-05-15 | 1984-05-15 | チツプ形電解コンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60183428U (it) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5624129B2 (it) * | 1975-05-12 | 1981-06-04 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5499056U (it) * | 1977-12-26 | 1979-07-12 | ||
| JPS5624129U (it) * | 1979-07-30 | 1981-03-04 | ||
| JPS5658845U (it) * | 1979-10-09 | 1981-05-20 | ||
| JPS58138326U (ja) * | 1982-03-10 | 1983-09-17 | ニチコン株式会社 | 電解コンデンサ |
-
1984
- 1984-05-15 JP JP7084184U patent/JPS60183428U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5624129B2 (it) * | 1975-05-12 | 1981-06-04 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60183428U (ja) | 1985-12-05 |
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