JPH033999B2 - - Google Patents
Info
- Publication number
- JPH033999B2 JPH033999B2 JP57037449A JP3744982A JPH033999B2 JP H033999 B2 JPH033999 B2 JP H033999B2 JP 57037449 A JP57037449 A JP 57037449A JP 3744982 A JP3744982 A JP 3744982A JP H033999 B2 JPH033999 B2 JP H033999B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric
- metal plate
- adhesive
- plate
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 description 22
- 238000010586 diagram Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Transducers For Ultrasonic Waves (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57037449A JPS58155000A (ja) | 1982-03-09 | 1982-03-09 | 圧電バイモルフの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57037449A JPS58155000A (ja) | 1982-03-09 | 1982-03-09 | 圧電バイモルフの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58155000A JPS58155000A (ja) | 1983-09-14 |
JPH033999B2 true JPH033999B2 (enrdf_load_stackoverflow) | 1991-01-21 |
Family
ID=12497805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57037449A Granted JPS58155000A (ja) | 1982-03-09 | 1982-03-09 | 圧電バイモルフの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58155000A (enrdf_load_stackoverflow) |
-
1982
- 1982-03-09 JP JP57037449A patent/JPS58155000A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58155000A (ja) | 1983-09-14 |
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