JPH0339819Y2 - - Google Patents
Info
- Publication number
- JPH0339819Y2 JPH0339819Y2 JP1986090862U JP9086286U JPH0339819Y2 JP H0339819 Y2 JPH0339819 Y2 JP H0339819Y2 JP 1986090862 U JP1986090862 U JP 1986090862U JP 9086286 U JP9086286 U JP 9086286U JP H0339819 Y2 JPH0339819 Y2 JP H0339819Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- display
- mask plate
- emitting display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 17
- 239000011159 matrix material Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986090862U JPH0339819Y2 (US20020051482A1-20020502-M00012.png) | 1986-06-13 | 1986-06-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986090862U JPH0339819Y2 (US20020051482A1-20020502-M00012.png) | 1986-06-13 | 1986-06-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62201783U JPS62201783U (US20020051482A1-20020502-M00012.png) | 1987-12-23 |
JPH0339819Y2 true JPH0339819Y2 (US20020051482A1-20020502-M00012.png) | 1991-08-21 |
Family
ID=30951120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986090862U Expired JPH0339819Y2 (US20020051482A1-20020502-M00012.png) | 1986-06-13 | 1986-06-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0339819Y2 (US20020051482A1-20020502-M00012.png) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005013246A1 (ja) * | 2003-08-04 | 2005-02-10 | Koha Co., Ltd. | 表示装置 |
JP2008537804A (ja) * | 2005-03-12 | 2008-09-25 | スリーエム イノベイティブ プロパティズ カンパニー | イルミネーションデバイスおよびその製造方法 |
US8860296B2 (en) | 2006-09-11 | 2014-10-14 | 3M Innovative Properties Company | Illumination devices and methods for making the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100496066B1 (ko) * | 2002-06-04 | 2005-06-16 | 에이피전자 주식회사 | 엘이디전광판의 기판에 정밀한 실링제의 주사를 위한 선캡 |
-
1986
- 1986-06-13 JP JP1986090862U patent/JPH0339819Y2/ja not_active Expired
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005013246A1 (ja) * | 2003-08-04 | 2005-02-10 | Koha Co., Ltd. | 表示装置 |
JPWO2005013246A1 (ja) * | 2003-08-04 | 2006-09-28 | 株式会社光波 | 表示装置 |
JP2008537804A (ja) * | 2005-03-12 | 2008-09-25 | スリーエム イノベイティブ プロパティズ カンパニー | イルミネーションデバイスおよびその製造方法 |
JP2013092787A (ja) * | 2005-03-12 | 2013-05-16 | Three M Innovative Properties Co | イルミネーションデバイスおよびその製造方法 |
US8860296B2 (en) | 2006-09-11 | 2014-10-14 | 3M Innovative Properties Company | Illumination devices and methods for making the same |
US9303829B2 (en) | 2006-09-11 | 2016-04-05 | 3M Innovative Properties Company | Illumination devices and methods for making the same |
US9303827B2 (en) | 2006-09-11 | 2016-04-05 | 3M Innovative Properties Company | Illumination devices and methods for making the same |
Also Published As
Publication number | Publication date |
---|---|
JPS62201783U (US20020051482A1-20020502-M00012.png) | 1987-12-23 |
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