JPH0339750B2 - - Google Patents

Info

Publication number
JPH0339750B2
JPH0339750B2 JP15538285A JP15538285A JPH0339750B2 JP H0339750 B2 JPH0339750 B2 JP H0339750B2 JP 15538285 A JP15538285 A JP 15538285A JP 15538285 A JP15538285 A JP 15538285A JP H0339750 B2 JPH0339750 B2 JP H0339750B2
Authority
JP
Japan
Prior art keywords
adhesive
slider
nozzle
leaf spring
storage box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15538285A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6214964A (ja
Inventor
Hiroshi Ushiki
Masashi Kawamoto
Yoshio Shimazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP15538285A priority Critical patent/JPS6214964A/ja
Publication of JPS6214964A publication Critical patent/JPS6214964A/ja
Publication of JPH0339750B2 publication Critical patent/JPH0339750B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP15538285A 1985-07-15 1985-07-15 接着剤塗布装置 Granted JPS6214964A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15538285A JPS6214964A (ja) 1985-07-15 1985-07-15 接着剤塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15538285A JPS6214964A (ja) 1985-07-15 1985-07-15 接着剤塗布装置

Publications (2)

Publication Number Publication Date
JPS6214964A JPS6214964A (ja) 1987-01-23
JPH0339750B2 true JPH0339750B2 (cs) 1991-06-14

Family

ID=15604723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15538285A Granted JPS6214964A (ja) 1985-07-15 1985-07-15 接着剤塗布装置

Country Status (1)

Country Link
JP (1) JPS6214964A (cs)

Also Published As

Publication number Publication date
JPS6214964A (ja) 1987-01-23

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