JPH0339749B2 - - Google Patents

Info

Publication number
JPH0339749B2
JPH0339749B2 JP60155381A JP15538185A JPH0339749B2 JP H0339749 B2 JPH0339749 B2 JP H0339749B2 JP 60155381 A JP60155381 A JP 60155381A JP 15538185 A JP15538185 A JP 15538185A JP H0339749 B2 JPH0339749 B2 JP H0339749B2
Authority
JP
Japan
Prior art keywords
adhesive
leaf spring
nozzle
storage box
adhesive storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60155381A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6214963A (ja
Inventor
Yasunobu Suzuki
Hiroshi Ushiki
Yoshio Shimazaki
Masashi Kawamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP60155381A priority Critical patent/JPS6214963A/ja
Publication of JPS6214963A publication Critical patent/JPS6214963A/ja
Publication of JPH0339749B2 publication Critical patent/JPH0339749B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP60155381A 1985-07-15 1985-07-15 接着剤塗布装置 Granted JPS6214963A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60155381A JPS6214963A (ja) 1985-07-15 1985-07-15 接着剤塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60155381A JPS6214963A (ja) 1985-07-15 1985-07-15 接着剤塗布装置

Publications (2)

Publication Number Publication Date
JPS6214963A JPS6214963A (ja) 1987-01-23
JPH0339749B2 true JPH0339749B2 (cs) 1991-06-14

Family

ID=15604702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60155381A Granted JPS6214963A (ja) 1985-07-15 1985-07-15 接着剤塗布装置

Country Status (1)

Country Link
JP (1) JPS6214963A (cs)

Also Published As

Publication number Publication date
JPS6214963A (ja) 1987-01-23

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