JPH0339490A - Production of enameled substrate and thermal head and motor bearing using the same - Google Patents

Production of enameled substrate and thermal head and motor bearing using the same

Info

Publication number
JPH0339490A
JPH0339490A JP17445589A JP17445589A JPH0339490A JP H0339490 A JPH0339490 A JP H0339490A JP 17445589 A JP17445589 A JP 17445589A JP 17445589 A JP17445589 A JP 17445589A JP H0339490 A JPH0339490 A JP H0339490A
Authority
JP
Japan
Prior art keywords
glass
substrate
thermal head
hollow
temp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17445589A
Other languages
Japanese (ja)
Other versions
JP2734654B2 (en
Inventor
Masahiro Hiraga
将浩 平賀
Ichiro Tanahashi
棚橋 一郎
Yasuo Mizuno
水野 康男
Masaki Ikeda
正樹 池田
Atsushi Nishino
敦 西野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP17445589A priority Critical patent/JP2734654B2/en
Publication of JPH0339490A publication Critical patent/JPH0339490A/en
Application granted granted Critical
Publication of JP2734654B2 publication Critical patent/JP2734654B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Electronic Switches (AREA)
  • Sliding-Contact Bearings (AREA)
  • Glass Compositions (AREA)
  • Rotational Drive Of Disk (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

PURPOSE:To form a crystallized enameled substrate in which crystallites are deposited and having a smooth surface by calcining the crystallized glass coating a metallic substrate at a specified temp. to make the glass amorphous, then hot-pressing the glass and then sintering the glass. CONSTITUTION:The metallic substrate 1 is coated with crystallized glass 3, the glass is calcined below the glass crystallization initiating temp., and a glass film in which crystals are not deposited is obtained. The enameled substrate is hot-pressed in a specularly finished metallic mold at the temp. higher than the deflection point of glass and lower than the crystallization initiating temp. Consequently, the ruggednesses on the glass surface are leveled, and a vitreous enameled substrate having a specularly finished flat surface is obtained. The substrate is further sintered above the crystallization initiating temp., and an enameled substrate in which crystallites are deposited and having a smooth surface is obtained.

Description

【発明の詳細な説明】 産業上の利用分野 本発明CL  回路基板、サーマルヘッド用基板または
モータの軸受等の耐摩耗部品として用い得るホーロ基板
の製造方法に関すん 従来の技術 従来技術の説明としてサーマルヘッド用水−ロ基板の製
造方法を例に挙げ詳述すも 溶融・冷却して作製したガラスフリットをボールミルで
ミル引きして平均粒径が2〜3μmの電着用スラリーを
作製し このスラリーにホーロ用鋼板などの金属基板を
浸漬し 対極と金属基板間に直流電圧を印可してガラス
フリット粒子を金属基板上に電着すも その後、基板を
充分に乾燥し焼成してサーマルヘッド用絶縁ホーロ基板
を形成すも この方法で形成したサーマルヘッド用絶縁
ホーロ基板の表面粗度は 中心線平均粗さRaで0.0
5〜0.08μmであり、従来のホーロ基板(Ra: 
 0.15〜0.3μm)に比べて、極めて平滑性に優
れていも 発明が解決しようとする課題 しかし 上記従来例によるホーロ基板の平滑性で(よ 
基板表面にサーマルヘッドの導電回路を形成したとき、
抵抗値のバラツキが大きくなるためサーマルヘッド用基
板として(よ 満足なものではなかっt4 課題を解決するための手段 上記従来の問題を解決するために本発明番上  結晶化
ガラスを金属基板上に被MLA 前記ガラスの結晶化開
始点以下の温度で仮焼成してガラスを非晶質状態にした
檄 前記ガラスの屈伏点以上の温度で熱プレスし さら
に 前記ガラスの結晶化開始点以上の温度で焼成してホ
ーロ基板を形成するものであム 作   用 金属基板に結晶化ガラスを被覆し これを該ガラスの結
晶化開始点以下の温度で仮焼成すると、結晶の析出して
いないガラス膜となる。この状態の該ガラス表面のRa
l;L  O,05μm 〜0.08μm程度であり、
アルミナグレーズ基板のRa(0,01μm−0,00
6、um)に比べると非常に大きいものであも そこで、該ホーロ基板の温度を、該ガラスの屈伏点以上
 結晶化開始点以下の温度範囲で、表面を鏡面に仕上げ
た金型で熱プレスすると、ガラス表面の凹凸がレベリン
グされ 表面が鏡面状態の平滑なガラス質のホーロ基板
ができも さらに結晶化開始点以上の温度で該基板を焼
成すると、微結晶が析出した表面の平滑な結晶化ホーロ
基板を形成することができも 実施例 以下本発明の実施例について説明すも 〈実施例1〉 金属基板を脱脂・水洗・酸洗・水洗・ニッケルメッキ・
水洗して前処理を行った徴 平均粒径が7μmの第1表
組成のガラス粒子からなるスラリー中に浸漬して、対極
と金属基板間に直流電圧を印加して第1表組成のガラス
粒子を金属基板上に150μm被覆しt4  その抵 
ガラスの結晶化開始点以下の温度730℃で10分間仮
焼成し さらに 基板を680℃にして、表面を鏡面に
磨いた金型(Rag、  006μm)で熱プレスした
く5kg/cm”で2分間)。その檄 結晶化開始点以
上の温度900℃で10分間焼成してホーロ基板を形成
しtも 第1表 この基板上に第1図に示したサーマルヘッドを形成し九
 第1図は本実施例によるホーロ基板を用いたサーマル
ヘッドの断面図で、 1は金属基板2はニッケルメッキ
胤 3はホーロ凰 4は重態5は発熱抵抗体 6はオー
バーコート層である。
Detailed Description of the Invention Industrial Application Field of the Invention CL Prior art related to a method for manufacturing a hollow board that can be used as a wear-resistant part such as a circuit board, a thermal head board, or a motor bearing. The method for manufacturing a water-based substrate for a thermal head will be described in detail by taking as an example, a glass frit prepared by melting and cooling is milled in a ball mill to prepare a slurry for electrodeposition with an average particle size of 2 to 3 μm. A metal substrate such as a steel plate for hollow holes is immersed, and a DC voltage is applied between the counter electrode and the metal substrate to electrodeposit glass frit particles onto the metal substrate.Then, the substrate is sufficiently dried and fired to form an insulating hollow hole for thermal heads. Forming the substrate The surface roughness of the insulating hollow substrate for the thermal head formed by this method is 0.0 in terms of center line average roughness Ra.
5 to 0.08 μm, compared to the conventional hollow substrate (Ra:
However, the smoothness of the hollow substrate according to the above-mentioned conventional example does not improve the smoothness of the hollow substrate (0.15 to 0.3 μm).
When the conductive circuit of the thermal head is formed on the substrate surface,
Because of the large variation in resistance, it is not very satisfactory as a substrate for a thermal head (t4) Means for Solving the Problem In order to solve the above-mentioned conventional problems, the present invention is based on a method of coating crystallized glass on a metal substrate. MLA Temporary firing at a temperature below the crystallization starting point of the glass to make the glass amorphous Heat pressing at a temperature above the yielding point of the glass and further firing at a temperature above the crystallization starting point of the glass When a hollow metal substrate is coated with crystallized glass and calcined at a temperature below the crystallization starting point of the glass, a glass film with no precipitated crystals is obtained. Ra of the glass surface in this state
l; L O, approximately 05 μm to 0.08 μm,
Ra of alumina glaze substrate (0,01μm-0,00
6, um), so the temperature of the hollow substrate is set at a temperature range of above the deformation point of the glass and below the crystallization starting point, using a mold with a mirror-finished surface. As a result, the unevenness of the glass surface is leveled, creating a smooth glassy hollow substrate with a mirror-like surface.Furthermore, when the substrate is fired at a temperature higher than the crystallization starting point, the surface is smooth and crystallized, with microcrystals precipitated. A hollow substrate can be formed.Examples Examples of the present invention will be described below.Example 1: A metal substrate is degreased, washed with water, pickled, washed with water, nickel plated,
Signs that pretreatment was performed by washing with water.Glass particles having the composition in Table 1 were immersed in a slurry consisting of glass particles having the composition in Table 1 with an average particle size of 7 μm, and a DC voltage was applied between the counter electrode and the metal substrate. is coated on a metal substrate with a thickness of 150 μm and its resistance is
The substrate was pre-baked for 10 minutes at a temperature of 730℃, which is below the crystallization starting point of glass, and then the substrate was heated to 680℃ and hot pressed using a mold (Rag, 0.06μm) with a mirror-polished surface for 2 minutes at 5kg/cm''. ).A hollow substrate was formed by firing at a temperature of 900°C, above the crystallization starting point, for 10 minutes.The thermal head shown in Figure 1 was formed on this substrate. 1 is a cross-sectional view of a thermal head using a hollow substrate according to an embodiment, in which 1 is a metal substrate 2 which is nickel plated, 3 is a hollow glaze, 4 is a heavy state 5 is a heating resistor, and 6 is an overcoat layer.

〈実施例2〉 金属基板を脱脂・水洗・酸洗・水洗・ニッケルメッキ・
水洗して前処理を行った眞 平均粒径が7μmの第1表
組成のガラス粒子からなるスラリー中に浸漬して、対極
と金属基板間に直流電圧を印加して第1表組成のガラス
粒子を金属基板上に150μm被覆しt4  その抵 
ガラスの結晶化開始点以下の温度730℃で10分間仮
焼成し さらに 基板を680℃にして、表面を鏡面に
磨いた金型(Rag、  006μm)で熱プレスした
(51(g/cm”で2分間)。その眞 結晶化開始点
以上の温度900℃で10分間焼成してホーロ基板を形
成しtら この基板を第2図に示したコンパクトティスフ用モータ
の軸受とした 第2図は本実施例によるコンパクトディ
スク用モータの断面図で、 7は本実施例のホーロ基板
からなるモータの軸受、 8は整流子、 9はシャフト
、 10はモータケースである。
<Example 2> Metal substrate was degreased, washed with water, pickled, washed with water, nickel plated,
The glass particles having the composition shown in Table 1 were immersed in a slurry of glass particles having the composition shown in Table 1 and having an average particle diameter of 7 μm, and a DC voltage was applied between the counter electrode and the metal substrate. is coated on a metal substrate with a thickness of 150 μm and its resistance is
The substrate was calcined for 10 minutes at a temperature of 730°C, which is below the crystallization starting point of glass, and then heated to 680°C and hot pressed using a mold with a mirror-polished surface (Rag, 006 μm) (51 (g/cm)). The hollow substrate was formed by firing for 10 minutes at a temperature of 900°C, which is above the crystallization starting point, and this substrate was used as a bearing for the compact tires motor shown in Fig. 2. 1 is a cross-sectional view of a compact disc motor according to this embodiment, in which 7 is a bearing of the motor made of a hollow substrate according to this embodiment, 8 is a commutator, 9 is a shaft, and 10 is a motor case.

〈比較例1〉 金属基板を脱脂・水洗・酸洗・水洗・ニッケルメッキ・
水洗して前処理を行った眞 平均粒径が7μmの第■表
組成のガラス粒子からなるスラリー中に浸漬して、対極
と金属基板間に直流電圧を印加して第1表組成のガラス
粒子を金属基板上に150μm電着し 乾燥焼成(90
0℃)してホーロ基板としt4  さらに その上に実
施例1と同様にサーマルヘッドの導電回路を形成したく
比較例2〉 アルミナグレーズ基板上に実施例1と同様にサーマルヘ
ッドの導電回路を形成し1゜ 〈比較例3〉 金属基板を脱脂・水洗・酸洗・水洗・ニッケルメッキ・
水洗して前処理を行った眞 平均粒径が7μmの第1表
組成のガラス粒子からなるスラリー中に浸漬して、対極
と金属基板間に直流電圧を印加して第1表組成のガラス
粒子を金属基板上に150μm電着し 乾燥焼成(90
0℃)してホーロ基板とした さらに 実施例2と同様
にコンパクトディスク用モータの軸受とした く比較例4〉 実施例2と同様の軸受部にポリエステルフィルムを用い
てコンパクトディスク用モータとし氾以上の実施例1、
比較例1、2について(よ 基板表面上の中心線平均粗
さRa、サーマルヘッドの発熱抵抗体の抵抗値バラツキ
を測定し 比較したこの結果を第2表に示す。
<Comparative Example 1> Metal substrate was degreased, washed with water, pickled, washed with water, nickel plated,
The glass particles having the composition shown in Table 1 were immersed in a slurry of glass particles having the composition shown in Table 1 and having an average particle diameter of 7 μm, and a DC voltage was applied between the counter electrode and the metal substrate. was electrodeposited to a thickness of 150 μm on a metal substrate, and dried and fired (90 μm).
Comparative Example 2 A conductive circuit for a thermal head was formed on an alumina glaze substrate in the same manner as in Example 1.Comparative Example 2 1゜〈Comparative Example 3〉 Metal substrate was degreased, washed with water, pickled, washed with water, nickel plated,
The glass particles having the composition shown in Table 1 were immersed in a slurry of glass particles having the composition shown in Table 1 and having an average particle diameter of 7 μm, and a DC voltage was applied between the counter electrode and the metal substrate. was electrodeposited to a thickness of 150 μm on a metal substrate, and dried and fired (90 μm).
Comparative Example 4: Similar to Example 2, a polyester film was used for the bearing part to create a compact disc motor. Example 1,
For Comparative Examples 1 and 2, the centerline average roughness Ra on the substrate surface and the resistance variation of the heating resistor of the thermal head were measured and compared. The results are shown in Table 2.

第2表 第3表 また 実施例2、比較例3、4について(友 モータに
500gの荷重を加えて、 500 r pmの速さで
回転させ、 2000時間後の軸受の摩耗量を測定しt
も  この結果を第3表に示す。
Table 2 Table 3 Also, for Example 2 and Comparative Examples 3 and 4 (Tomo) A load of 500 g was applied to the motor, it was rotated at a speed of 500 rpm, and the amount of wear on the bearing was measured after 2000 hours.
The results are shown in Table 3.

以上のように 熱プレスによってガラス表面をレベリン
グして基板の表面粗さを小さくした粘気サーマルヘッド
としたときの抵抗値バラツキも極めて小さくすることが
できた まな 同様に本発明のホーロ基板をコンパクトディスク
用モータの軸受として応用することによって、軸受の摩
耗特性も向上させ得ることが確認できtら 本発明において仮焼成の温度乾固 熱プレスの温度範囲
は非常に重要であり、これら以外の温度では表面性に優
れたホーロ基板は形成できな鶏仮焼成の温度を結晶化開
始点以上にすると、結晶が析出してしまうためガラスが
軟化し難くなり、それ以降どんな温度で熱プレスしても
ガラスの表面はレベリングされな(1 また 熱プレスの温度を結晶化開始点以上にすると結晶
が析出するためレベリングされ哄 同様に 屈伏点以下
の温度にするとガラスが軟化しないのでレベリングされ
な〜1 これらのことより、仮焼成温度は結晶化開始点以下、熱
プレス温度は屈伏点から結晶化開始点の温度範囲でする
必要があも 発明の効果 以上の説明から明らかなように本発明1表 結晶化ガラ
スを金属基板上に被覆し 前記ガラスの結晶化開始点以
下の温度で仮焼成してガラスを非晶質状態にした後、前
記ガラスの屈伏点以上の温度で熱プレスし さらに 前
記ガラスの結晶化開始点以上の温度で焼成してホーロ基
板を形成したことによって、ホーロ基板の表面性を向上
させ、その粘気 サーマルヘッドとしたときの抵抗値バ
ラツキやモータの軸受としたときの摩耗特性も向上させ
得ることができも
As described above, when a viscous thermal head is made by leveling the glass surface by heat pressing to reduce the surface roughness of the substrate, the variation in resistance value can be extremely reduced.Similarly, the hollow substrate of the present invention can be made compact. It has been confirmed that the wear characteristics of the bearing can also be improved by applying it as a bearing for a disk motor. Therefore, a hollow substrate with excellent surface properties cannot be formed.If the temperature of the calcination is set above the crystallization starting point, crystals will precipitate, making it difficult for the glass to soften. The surface of the glass is not leveled (1. Also, if the temperature of the hot press is set above the crystallization starting point, crystals will precipitate, so the surface will be leveled. Similarly, if the temperature is set below the sagging point, the glass will not soften, so it will not be leveled. Therefore, the pre-calcination temperature must be below the crystallization starting point, and the hot pressing temperature must be within the temperature range from the yielding point to the crystallization starting point. After coating the glass on a metal substrate and pre-sintering the glass at a temperature below the crystallization starting point of the glass to make the glass amorphous, the glass is heat-pressed at a temperature above the deformation point of the glass. By forming a hollow substrate by firing at a temperature above the crystallization starting point, the surface properties of the hollow substrate are improved and its viscosity is reduced.It also reduces resistance variation when used as a thermal head and wear characteristics when used as a motor bearing. can also be improved

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の第1実施例におけるホーロ基板を使用
したサーマルヘッドの断面構T&は  第2図は本発明
の第2実施例におけるホーロ基板を使用したコンパクト
ディスク用モータの断面構成図である。 1・・・金属基板 2・・・ニッケルメッキ凰 3・・
・ホーロ凰 4・・・電板 5・・・発熱抵抗依 6・
・・オーバーコート凰 7・・・ホーロ基板からなるモ
ータの軸見 8・・・整流子、 9・・・シャフト、 
lO・・・モータケ−人
Fig. 1 shows the cross-sectional structure of a thermal head using a hollow substrate according to the first embodiment of the present invention, and Fig. 2 shows a cross-sectional structure of a compact disc motor using a hollow substrate according to the second embodiment of the present invention. be. 1...Metal board 2...Nickel plating 3...
・Hollow 4...Electric plate 5...Heating resistor 6・
... Overcoat 凰 7 ... Axis view of the motor made of hollow board 8 ... Commutator, 9 ... Shaft,
lO...motor ke person

Claims (3)

【特許請求の範囲】[Claims] (1)結晶化ガラスを金属基板上に被覆し、前記ガラス
の結晶化開始点以下の温度で仮焼成してガラスを非晶質
状態にした後、前記ガラスの屈伏点以上の温度で熱プレ
スし、さらに、前記ガラスの結晶化開始点以上の温度で
焼成することを特徴とするホーロ基板の製造法。
(1) Coat crystallized glass on a metal substrate, make the glass into an amorphous state by pre-sintering it at a temperature below the crystallization starting point of the glass, and then heat press it at a temperature above the yielding point of the glass. A method for producing a hollow substrate, further comprising firing at a temperature equal to or higher than the crystallization starting point of the glass.
(2)請求項1記載の製造方法で得られたホーロ基板を
用いたことを特徴とするサーマルヘッド。
(2) A thermal head characterized by using a hollow substrate obtained by the manufacturing method according to claim 1.
(3)請求項1記載の製造方法で得られたホーロ基板を
用いたことを特徴とするモータの軸受。
(3) A motor bearing characterized by using a hollow substrate obtained by the manufacturing method according to claim 1.
JP17445589A 1989-07-05 1989-07-05 Manufacturing method of hollow substrate and thermal head and motor bearing using the hollow substrate Expired - Fee Related JP2734654B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17445589A JP2734654B2 (en) 1989-07-05 1989-07-05 Manufacturing method of hollow substrate and thermal head and motor bearing using the hollow substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17445589A JP2734654B2 (en) 1989-07-05 1989-07-05 Manufacturing method of hollow substrate and thermal head and motor bearing using the hollow substrate

Publications (2)

Publication Number Publication Date
JPH0339490A true JPH0339490A (en) 1991-02-20
JP2734654B2 JP2734654B2 (en) 1998-04-02

Family

ID=15978789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17445589A Expired - Fee Related JP2734654B2 (en) 1989-07-05 1989-07-05 Manufacturing method of hollow substrate and thermal head and motor bearing using the hollow substrate

Country Status (1)

Country Link
JP (1) JP2734654B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019111997A1 (en) 2017-12-06 2019-06-13 三菱マテリアル株式会社 Insulating heat-transfer substrate, thermoelectric conversion module, and method for manufacturing insulating heat-transfer substrate
KR20200089673A (en) 2017-12-06 2020-07-27 미쓰비시 마테리알 가부시키가이샤 Insulated heating substrate, thermoelectric conversion module, and method for manufacturing insulating heating substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019111997A1 (en) 2017-12-06 2019-06-13 三菱マテリアル株式会社 Insulating heat-transfer substrate, thermoelectric conversion module, and method for manufacturing insulating heat-transfer substrate
KR20200089673A (en) 2017-12-06 2020-07-27 미쓰비시 마테리알 가부시키가이샤 Insulated heating substrate, thermoelectric conversion module, and method for manufacturing insulating heating substrate
US11404622B2 (en) 2017-12-06 2022-08-02 Mitsubishi Materials Corporation Insulated heat transfer substrate, thermoelectric conversion module, and method for manufacturing insulated heat transfer substrate

Also Published As

Publication number Publication date
JP2734654B2 (en) 1998-04-02

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