JPH0339218Y2 - - Google Patents

Info

Publication number
JPH0339218Y2
JPH0339218Y2 JP1986159071U JP15907186U JPH0339218Y2 JP H0339218 Y2 JPH0339218 Y2 JP H0339218Y2 JP 1986159071 U JP1986159071 U JP 1986159071U JP 15907186 U JP15907186 U JP 15907186U JP H0339218 Y2 JPH0339218 Y2 JP H0339218Y2
Authority
JP
Japan
Prior art keywords
pressure
resin
injection plunger
mold
transfer molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986159071U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6275910U (es
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986159071U priority Critical patent/JPH0339218Y2/ja
Publication of JPS6275910U publication Critical patent/JPS6275910U/ja
Application granted granted Critical
Publication of JPH0339218Y2 publication Critical patent/JPH0339218Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/46Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/58Details
    • B29C45/586Injection or transfer plungers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1986159071U 1986-10-16 1986-10-16 Expired JPH0339218Y2 (es)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986159071U JPH0339218Y2 (es) 1986-10-16 1986-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986159071U JPH0339218Y2 (es) 1986-10-16 1986-10-16

Publications (2)

Publication Number Publication Date
JPS6275910U JPS6275910U (es) 1987-05-15
JPH0339218Y2 true JPH0339218Y2 (es) 1991-08-19

Family

ID=31083159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986159071U Expired JPH0339218Y2 (es) 1986-10-16 1986-10-16

Country Status (1)

Country Link
JP (1) JPH0339218Y2 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3376037B2 (ja) * 1993-09-27 2003-02-10 株式会社サイネックス 半導体樹脂封止装置
NL2018533B1 (en) * 2017-03-16 2018-09-24 Besi Netherlands Bv Plunger for feeding encapsulating material to a mould cavity
JP6907044B2 (ja) * 2017-06-19 2021-07-21 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52125565A (en) * 1976-04-14 1977-10-21 Hitachi Ltd Transfer molding machine

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52125565A (en) * 1976-04-14 1977-10-21 Hitachi Ltd Transfer molding machine

Also Published As

Publication number Publication date
JPS6275910U (es) 1987-05-15

Similar Documents

Publication Publication Date Title
US4900485A (en) Method and apparatus for transfer molding
JPH11274196A (ja) 半導体装置の製造方法およびモールドシステム並びに半導体装置
JPH0339218Y2 (es)
JP2639232B2 (ja) 中空型樹脂封止半導体圧力センサ
KR20010014657A (ko) 압축성형 장치 및 반도체 장치의 제조 방법
JP2555497B2 (ja) 中空型樹脂封止半導体圧力センサ
JPH0229314A (ja) モールド金型
JPS629718Y2 (es)
JPH01216815A (ja) 被封止部品のトランスファ樹脂封止成形方法とこれに用いられる樹脂封止成形用金型装置及びフィルムキャリア
JP3272827B2 (ja) リードフレームの製造方法
JPH05243419A (ja) Ppga用樹脂封止金型
CN111416000A (zh) 一种感光芯片封装件及其制作方法
JP2737714B2 (ja) 半導体装置の製造方法
JPS59115826A (ja) キヤビテイ内圧測定装置
KR20200116490A (ko) 몰드체 및 패키지의 제조 방법, 및 몰드체 제조 장치
JPH03220738A (ja) 樹脂封止型半導体装置の製造装置
JPH09116051A (ja) 樹脂封止半導体装置およびその製造装置
JPH02205043A (ja) 樹脂封止型半導体装置の製造方法
CN114256279A (zh) Cis芯片的封装方法
JPH06204379A (ja) 半導体装置の製造方法
JP2006210784A (ja) リードフレームおよび半導体装置ならびに半導体装置製造方法
JPH0531229U (ja) 樹脂封止用金型
JPH03157943A (ja) 樹脂封止型半導体集積回路の製造方法
JP2005033133A (ja) 半導体装置封止用金型およびそれを用いた半導体装置封止方法
JPH03198354A (ja) 樹脂封止型半導体集積回路の樹脂封止方法