JPH0338655U - - Google Patents
Info
- Publication number
- JPH0338655U JPH0338655U JP9887689U JP9887689U JPH0338655U JP H0338655 U JPH0338655 U JP H0338655U JP 9887689 U JP9887689 U JP 9887689U JP 9887689 U JP9887689 U JP 9887689U JP H0338655 U JPH0338655 U JP H0338655U
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- base material
- fiber base
- circuit board
- fluororesin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000004760 aramid Substances 0.000 claims description 2
- 229920003235 aromatic polyamide Polymers 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 1
Landscapes
- Laminated Bodies (AREA)
Description
第１図および第２図はいずれも本考案に係る回
路基板の実例を示す正面図である。
１，２……ガラス繊維基材、３……芳香族ポリ
アミド繊維基材、４，５……金属層。
FIG. 1 and FIG. 2 are both front views showing an example of a circuit board according to the present invention. 1, 2... Glass fiber base material, 3... Aromatic polyamide fiber base material, 4, 5... Metal layer.
補正 平１．１１．２９
図面の簡単な説明を次のように補正する。
明細書を下記のとおり補正します。
(1)第８頁第２０行の「第１図および第２図」を
「第１図、第２図および第３図」と補正します。Amendment November 29, 1992 The brief description of the drawing is amended as follows. The statement will be amended as follows. (1) "Figures 1 and 2" on page 8, line 20 will be corrected to "Figures 1, 2, and 3."
Claims (1)
維基材の少なくとも１枚と、フツ素樹脂を含浸し
たガラス繊維基材の少なくとも１枚を積層した絶
縁材の表面に、金属層が設けられて成る回路基板
。 (2) 少なくとも一方の金属層がパターン状であ
る請求項１記載の回路基板。[Claims for Utility Model Registration] (1) The surface of an insulating material laminated with at least one aromatic polyamide fiber base material impregnated with fluororesin and at least one glass fiber base material impregnated with fluororesin. A circuit board consisting of a metal layer and a metal layer. (2) The circuit board according to claim 1, wherein at least one metal layer is patterned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9887689U JPH0338655U (en) | 1989-08-24 | 1989-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9887689U JPH0338655U (en) | 1989-08-24 | 1989-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0338655U true JPH0338655U (en) | 1991-04-15 |
Family
ID=31647955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9887689U Pending JPH0338655U (en) | 1989-08-24 | 1989-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338655U (en) |
-
1989
- 1989-08-24 JP JP9887689U patent/JPH0338655U/ja active Pending