JPH02767U - - Google Patents
Info
- Publication number
- JPH02767U JPH02767U JP16641887U JP16641887U JPH02767U JP H02767 U JPH02767 U JP H02767U JP 16641887 U JP16641887 U JP 16641887U JP 16641887 U JP16641887 U JP 16641887U JP H02767 U JPH02767 U JP H02767U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- board
- flexible
- sectional
- flexible board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の回路基板の絶縁構造を示す全
体斜視図、第２図ａは第１図におけるＦ−Ｆ線断
面図、第２図ｂは第１図におけるＧ−Ｇ線断面図
、第２図ｃは第１図におけるＨ−Ｈ線断面図、第
３図は、第１図におけるフレキシブル基板の形状
を示す説明図、第４図は従来の構成を示す斜視図
である。
符号、１ａ，１ｂ，１ｃ……回路基板、２０…
…フレキシブル基板。
FIG. 1 is an overall perspective view showing the insulation structure of the circuit board of the present invention, FIG. 2 a is a sectional view taken along the line FF in FIG. 1, and FIG. 2 b is a sectional view taken along the line GG in FIG. FIG. 2c is a sectional view taken along the line H--H in FIG. 1, FIG. 3 is an explanatory diagram showing the shape of the flexible substrate in FIG. 1, and FIG. 4 is a perspective view showing the conventional structure. Code, 1a, 1b, 1c...Circuit board, 20...
...Flexible substrate.
補正 平１．８．１１
図面の簡単な説明を次のように補正する。
本願明細書の第９頁第７行目乃至第９行目を以
下のように訂正する。「第２図は第１図における
フレキシブル基板の形状を示す説明図」。Amendment 1.8.11. The brief description of the drawing is amended as follows. Lines 7 to 9 of page 9 of the present specification are corrected as follows. "Figure 2 is an explanatory diagram showing the shape of the flexible substrate in Figure 1."
Claims (1)
において、 回路基板の外側をフレキシブル基板で被うこと
を特徴とする回路基板の絶縁構造。[Claims for Utility Model Registration] An insulating structure for a circuit board including a flexible board, characterized in that the outside of the circuit board is covered with a flexible board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16641887U JPH02767U (en) | 1987-10-30 | 1987-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16641887U JPH02767U (en) | 1987-10-30 | 1987-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02767U true JPH02767U (en) | 1990-01-05 |
Family
ID=31453780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16641887U Pending JPH02767U (en) | 1987-10-30 | 1987-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02767U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001358422A (en) * | 2000-06-13 | 2001-12-26 | Sony Corp | Electronic circuit device |
-
1987
- 1987-10-30 JP JP16641887U patent/JPH02767U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001358422A (en) * | 2000-06-13 | 2001-12-26 | Sony Corp | Electronic circuit device |