JPS62140767U - - Google Patents
Info
- Publication number
- JPS62140767U JPS62140767U JP2853686U JP2853686U JPS62140767U JP S62140767 U JPS62140767 U JP S62140767U JP 2853686 U JP2853686 U JP 2853686U JP 2853686 U JP2853686 U JP 2853686U JP S62140767 U JPS62140767 U JP S62140767U
- Authority
- JP
- Japan
- Prior art keywords
- coverlay
- forming portion
- terminal forming
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第1図は本考案の一実施例を示す説明図、第2
図a〜dは第1図に示したフレキシブルプリント
配線板における折曲目印部の各変形例を示す要部
説明図、第3図はフレキシブルプリント配線板の
端子形成部位を示す説明図、第4図a,b,cは
第3図に示した端子形成部位の導体層を折曲して
形成した端子付近の断面図、第5図は従来例を示
す説明図、第6図a〜dは第5図に示したフレキ
シブルプリント配線板における折曲目印部の各従
来例を示す要部説明図である。
10は導体層、11はカバーレイ、12は端子
形成部位、13は折曲目印部である。
Fig. 1 is an explanatory diagram showing one embodiment of the present invention;
Figures a to d are explanatory diagrams of main parts showing each modification of the bending mark part in the flexible printed wiring board shown in Figure 1, Figure 3 is an explanatory diagram showing terminal forming parts of the flexible printed wiring board, and Figure 4 Figures a, b, and c are cross-sectional views of the vicinity of the terminal formed by bending the conductor layer at the terminal forming part shown in Figure 3, Figure 5 is an explanatory diagram showing a conventional example, and Figures 6 a to d are FIG. 6 is an explanatory diagram of main parts showing conventional examples of bending mark portions in the flexible printed wiring board shown in FIG. 5; 10 is a conductor layer, 11 is a coverlay, 12 is a terminal forming portion, and 13 is a bending mark portion.
Claims (1)
を折曲して端子を形成する端子形成部位は上記カ
バーレイが除去されているフレキシブルプリント
配線板において、上記端子形成部位の折曲される
導体層の折り目の延長線と上記端子形成部位周囲
との交点におけるカバーレイに、折曲目印部を形
成したことを特徴とするフレキシブルプリント配
線板。 A terminal forming portion where a conductor layer is covered with a coverlay and a terminal is formed by bending this conductor layer is a flexible printed wiring board from which the coverlay has been removed, and the conductor to be bent at the terminal forming portion. A flexible printed wiring board characterized in that a bending mark portion is formed on the coverlay at an intersection between an extension line of the fold of the layer and the periphery of the terminal forming portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2853686U JPS62140767U (en) | 1986-02-27 | 1986-02-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2853686U JPS62140767U (en) | 1986-02-27 | 1986-02-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62140767U true JPS62140767U (en) | 1987-09-05 |
Family
ID=30831591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2853686U Pending JPS62140767U (en) | 1986-02-27 | 1986-02-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62140767U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009038298A (en) * | 2007-08-03 | 2009-02-19 | Sumitomo Electric Printed Circuit Inc | Flexible printed wiring board |
-
1986
- 1986-02-27 JP JP2853686U patent/JPS62140767U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009038298A (en) * | 2007-08-03 | 2009-02-19 | Sumitomo Electric Printed Circuit Inc | Flexible printed wiring board |
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