JP2009038298A - Flexible printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible printed wiring board in which a bend part can be easily recognized and which can be used by being easily deformed into an optional shape corresponding to an electronic device using the flexible printed wiring board. <P>SOLUTION: The flexible printed wiring board 1 is provided with a wiring pattern 5b formed of a conductor and also provided with an input wiring part 21 and an output wiring part 22 provided with an input terminal part 15 and an output terminal part 16 to be connected to the conductor pattern of the electronic device respectively. Also, the flexible printed wiring board has bend parts 40 and 41 provided to the input wiring part 21 and the output wiring part 22 and an insulating layer 7 provided to a part excluding the input terminal part 15 and the output terminal part 16. The insulating layer 7 is formed of a coverlay film 42 provided to the part other than the bend parts 40 and 41 and a cover coat 43 provided to the bend parts 40 and 41. Then, the cover coat 43 is colored in a color different from the coverlay film. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a flexible printed wiring board used as a component of an electronic device.

  In recent years, flexible printed wiring boards on which various electronic components are mounted have been used in the electronic equipment field due to demands for downsizing and weight reduction of electronic equipment. For example, in an electronic device such as a liquid crystal panel or a plasma display panel, a conductor is provided on the surface of a base material serving as a base, and a circuit portion having a conductor circuit pattern formed by the conductor and a wiring pattern formed by the conductor are provided. The flexible printed wiring board provided with the wiring part which has is used.

  In general, in such a flexible printed wiring board, an insulating layer is provided so as to cover the conductor in order to protect the above-described conductor circuit pattern and wiring pattern. And as such an insulating layer, in general, a cover lay film composed of an adhesive layer laminated on the surface of the conductor and a resin film laminated on the surface of the adhesive layer so as to cover the conductor Is used (see, for example, Patent Document 1).

  Next, an example of a conventional flexible printed wiring board using such a coverlay film will be described with reference to the drawings. As shown in FIGS. 4 and 5, the flexible printed wiring board 60 is provided on the surface of the base material 50 via the insulating base material 50 and the adhesive layer 70, and a predetermined conductor circuit pattern 49 is formed on the surface of the base material 50. And a conductor 52 on which a circuit portion (or electronic component mounting portion) 51 on which an electronic component is mounted is formed, an adhesive layer 71 provided on the surface of the conductor 52 and laminated on the conductor 52, An input wiring portion 55 having a wiring pattern 54 formed by a conductor 52 and drawn out from the circuit portion 51, and an output wiring portion, and a cover lay film 53 which is an insulating layer constituted by a resin film 72 laminated thereon 56. Further, in the flexible printed wiring board 60, as shown in FIGS. 4 and 5, the input wiring portion 55 is provided with an input terminal portion 58 connected to the wiring pattern 54, and the output wiring portion 56 is wired. An output terminal portion 57 connected to the pattern 54 is provided. And when using this flexible printed wiring board 60 for electronic devices, such as a liquid crystal panel, generally the terminal part (for example, output terminal part) formed in the front-end | tip of the wiring pattern 54 by anisotropically conductive film or soldering 57) is connected to a conductor pattern of an electronic device which is a connected member.

  Further, as shown in FIG. 4, the input wiring portion 55 is provided with a bent portion 80, and the bent portion 80 is bent when the input terminal portion 58 is electrically connected to the conductor pattern of the electronic device. Thus, the input terminal portion 58 and the conductor pattern of the electronic device are aligned, and the input terminal portion 58 is electrically connected to the conductor pattern of the electronic device. Similarly, as shown in FIG. 4, the output wiring portion 56 is provided with a bent portion 81, and when the output terminal portion 57 is electrically connected to the conductor pattern of the electronic device, the bent portion 81 is provided. Is configured such that the output terminal portion 57 and the conductor pattern of the electronic device are aligned, and the output terminal portion 57 is electrically connected to the conductor pattern of the electronic device.

Also, generally, the bent portions 80 and 81 are subjected to ruled line processing for processing a ruled line such as a line push, a half cut, and a sewing line, and silk printing for screen printing of a thermosetting resin ink such as an acrylic resin or an unsaturated polyester resin. As a result, a method is adopted in which the folding portions 80 and 81 are provided with indices of the folding positions 90 and 91.
JP-A-7-86719

  However, in the conventional ruled line processing method, as in the case of silk printing, a clear index with a thermosetting resin ink is not provided, and only a ruled line such as a half cut or a sewing line is processed. Therefore, the visibility of the folding positions 90 and 91 is lowered, the folding positions 90 and 91 are likely to be unclear, and the folding portions 80 and 81 may be difficult to recognize. Therefore, since it is difficult to bend the bending portions 80 and 81, for example, when the output terminal portion 57 is electrically connected to a conductor pattern of an electronic device, the output terminal portion 57 and the electronic device are bent by bending the bending portion 81. When aligning with the conductor pattern of the device, it becomes difficult to align the output terminal portion 57 with the conductor pattern of the electronic device, and when the output terminal portion 57 is electrically connected to the conductor pattern of the electronic device. There was a problem that workability was lowered. Further, when the ruled line processing is performed, there may be a problem that a crack occurs in the conductor 52.

  Further, in the flexible printed wiring board 60 on which the conventional cover lay film 53 is formed, the cover lay film 53 is composed of the adhesive layer 71 and the resin film 72 as described above. 53 has a large rigidity, and the insulating layer provided in the bent portion 81 is formed of the above-described coverlay film 53. Therefore, when the bent portion 81 is bent, the bent portion 81 is returned (spring back). Will become bigger. As a result, even if the folding position 91 is clarified by the above-described ruled line processing or silk printing, and the folded portion 81 can be recognized, it is difficult to bend the folded portion 81, and therefore the output terminal portion 57. Is electrically connected to the conductor pattern of the electronic device, it becomes difficult to align the output terminal portion 57 and the conductor pattern of the electronic device, and the output terminal portion 57 is electrically connected to the conductor pattern of the electronic device. However, there was a problem that workability deteriorated.

  Therefore, the present invention has been made in view of the above-mentioned problems, and can easily recognize a bent portion and can be easily deformed into an arbitrary shape corresponding to an electronic device in which a flexible printed wiring board is used. It aims at providing the flexible printed wiring board which can do.

  In order to achieve the above object, the invention according to claim 1 has a base material, a conductor provided on the surface of the base material, and a wiring pattern formed of the conductor, and a conductor pattern of an electronic device. The wiring part provided with the terminal part to be connected and the wiring part are provided in the wiring part, and when the terminal part is electrically connected to the conductor pattern of the electronic device, the terminal part and the conductor pattern of the electronic device are aligned. In a flexible printed wiring board comprising a bent part for performing and an insulating layer provided on a surface of a conductor excluding a terminal part, an adhesive layer in which the insulating layer is laminated on the surface of the conductor And a cover lay film made of a resin film laminated on the surface of the adhesive layer, and a cover coat mainly composed of polyimide resin and colored in a different color from the cover lay film. Cage, together with the cover coat is provided on the bent portion, wherein the cover lay film to a portion other than the bent portion.

  According to this configuration, it is possible to easily distinguish the bent portion formed by the cover coat and the portion other than the bent portion formed by the cover lay film. Therefore, since the bent portion can be easily recognized, the folding position of the bent portion becomes clear, and the bending process of the bent portion is facilitated. In addition, as compared with a flexible printed wiring board in which the insulating layer provided in the bent portion is formed of a coverlay film, it is possible to ensure the flexibility of the bent portion and bend the bent portion. Since the return (spring back) at the time can be reduced, the bending portions 40 and 41 can be easily bent. As a result, when the terminal part is electrically connected to the conductor pattern of the electronic device, it is easy to align the terminal part and the conductor pattern of the electronic device, and the terminal part is electrically connected to the conductor pattern of the electronic device. Workability is improved when

  In addition, since the cover coat formed by the cover coat ink containing an expensive polyimide resin as a main component is provided only in the bent portion, an increase in cost can be suppressed. In addition, when the cover coat is provided, the amount of polyimide photosensitive cover coat ink that is a raw material of the cover coat can be reduced, which can cope with environmental problems. Moreover, since it is set as the structure which provides the cover coat colored in the color different from a coverlay film in a bending part, unlike the case of the said conventional ruled line process, generation | occurrence | production of the crack in a conductor can be avoided.

  Invention of Claim 2 is the flexible printed wiring board of Claim 1, Comprising: The width | variety of a covercoat is 0.3 mm-1.5 mm, It is characterized by the above-mentioned. According to this configuration, when aligning the terminal portion and the conductor pattern of the electronic device, it is possible to select a desired bending position and perform the bending process. Further, the visibility of the bent portion is improved, and the bent portion can be more easily recognized, so that the bent position becomes clearer.

  The invention according to claim 3 is the flexible printed wiring board according to claim 1 or 2, wherein the cover coat has a thickness of 5 μm to 35 μm. According to the configuration, the bendability at the bent portion is improved, and the bending of the bent portion is further facilitated.

  A fourth aspect of the present invention is the flexible printed wiring board according to any one of the first to third aspects, comprising a plurality of bent portions. According to this configuration, since it is possible to select a desired bent portion and perform the bending process corresponding to the electronic device in which the flexible printed wiring board is used, the terminal portion can be used as the conductor pattern of the electronic device. Workability at the time of electrical connection is further improved.

  According to the present invention, in the flexible printed wiring board, the bent portion can be easily recognized, and the bending process of the bent portion is facilitated. Further, when the terminal portion is electrically connected to the conductor pattern of the electronic device, the positioning of the terminal portion and the conductor pattern of the electronic device is facilitated, and the terminal portion is electrically connected to the conductor pattern of the electronic device. This improves workability.

  Hereinafter, a preferred embodiment of the present invention will be described. FIG. 1 is a plan view of the front side showing a schematic configuration of a flexible printed wiring board according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA of FIG. In the present embodiment, a flexible printed wiring board used for an electronic device such as a liquid crystal panel or a plasma display panel will be described as an example.

  As shown in FIGS. 1 and 2, the flexible printed wiring board 1 is provided with a conductor 5 on one side of an insulating base 2 formed of a flexible resin film with an adhesive layer 3 interposed therebetween. This is a so-called single-sided plate, and an insulating layer 7 is provided on one side so as to cover the conductor 5.

  Further, as shown in FIG. 1, the flexible printed wiring board 1 is formed of a conductor 5, and for example, a circuit having a conductor circuit pattern 5a to which electronic components such as a chip capacitor, a chip resistor, and a connector are electrically connected. Part 20 is provided. As shown in FIG. 1, the flexible printed wiring board 1 includes an input wiring portion 21 and an output wiring portion 22 that are formed of a conductor 5 and have a wiring pattern 5 b drawn from the circuit portion 20. As shown in FIG. 1, the output wiring portion 22 is provided with an alignment mark 17 that is a positioning pin hole.

  The input wiring portion 21 is provided with an input terminal portion 15 connected to the wiring pattern 5b, and the output wiring portion 22 is provided with an output terminal portion 16 connected to the wiring pattern 5b. In order to electrically connect the input terminal portion 15 and the output terminal portion 16 to a conductor pattern (not shown) of an electronic device that is a connected member such as a liquid crystal panel, the input terminal portion is formed without forming the insulating layer 7. 15 and the output terminal portion 16 are exposed to the outside.

  Further, as shown in FIG. 1, the input wiring portion 21 of the flexible printed wiring board 1 is provided with a bent portion 40, and when the input terminal portion 15 is electrically connected to the conductor pattern of the electronic device, By bending the bent portion 40 at the bending position 45, the input terminal portion 15 and the conductor pattern of the electronic device are aligned, and the input terminal portion 15 is electrically connected to the conductor pattern of the electronic device. .

  Similarly, as shown in FIG. 1, the output wiring portion 22 of the flexible printed wiring board 1 is provided with a bent portion 41 to electrically connect the output terminal portion 16 to a conductor pattern of an electronic device. In addition, by bending the bent portion 41 at the bending position 46, the output terminal portion 16 and the conductor pattern of the electronic device are aligned, and the output terminal portion 16 is electrically connected to the conductor pattern of the electronic device. It has become.

  In addition, as shown in FIG. 2, the surface of the input terminal portion 15 and the output terminal portion 16 is covered with a plating layer 11 in order to improve connection reliability. The plating layer 11 is preferably a lead-free plating layer in consideration of the environment, and the connection reliability between the input terminal portion 15 and the output terminal portion 16 and the conductor pattern of the electronic device is reduced. From the viewpoint of prevention, a gold plating layer can be used as the plating layer 11 containing no lead.

  The plating process on the surface of the conductor 5 is performed by an electroless plating method or an electrolytic plating method. When a gold plating layer is provided, first, nickel as a diffusion preventing layer is formed on the exposed surface of the conductor 5. After forming the plating layer, a method of forming a gold plating layer on the surface of the nickel plating layer is employed. When the flexible printed wiring board 1 is used for an electronic device such as a liquid crystal panel, the input terminal portion 15 and the output terminal portion 16 formed at the tip of the wiring pattern 5b by an anisotropic conductive film or soldering are used. It is configured to be connected to a conductor pattern portion of an electronic device.

  As a resin film which comprises the base material 2, what consists of a resin material excellent in the softness | flexibility is used. As the resin film, for example, any resin film that is versatile for flexible printed wiring boards, such as a polyester film, can be used. In addition, in particular, it is preferable to have high heat resistance and mechanical strength in addition to flexibility. Examples of such resin films include polyamide resin films, polyimide resins such as polyimide and polyamideimide, and the like. Films, heat-resistant polyester films, polyethylene naphthalates and the like are preferably used. In addition, as thickness of the base material 2, 10 micrometers-150 micrometers are preferable. If the thickness is less than 10 μm, sufficient mechanical strength may not be obtained, and if it is greater than 150 μm, the flexibility of the flexible printed wiring board 1 may be reduced.

  The adhesive constituting the adhesive layer 3 is preferably an adhesive having excellent flexibility and heat resistance. Examples of such an adhesive include various types such as nylon, epoxy resin, butyral resin, and acrylic resin. Resin-based adhesives. Further, ceramic fillers and rubber fillers can be dispersed in these adhesive resins.

  Moreover, copper foil is used suitably as metal foil which comprises the conductor 5 which has the predetermined conductor circuit pattern 5a and the wiring pattern 5b. Moreover, the conductor 5 which has the conductor circuit pattern 5a and the wiring pattern 5b is formed by etching and processing this metal foil by a conventional method.

  Here, in the flexible printed wiring board 1 of the present invention, as shown in FIGS. 1 and 2, the insulating layer 7 provided on the surface of the conductor 5 is formed by the cover lay film 42 and the cover coat 43. .

  More specifically, as shown in FIGS. 1 and 2, in the flexible printed wiring board 1, the insulating layer 7 is provided in a portion excluding the input terminal portion 15 and the output terminal portion 16. The cover coat 43 is provided on the bent portions 40 and 41, and the cover lay film 42 is provided on a portion other than the bent portions 40 and 41.

  As shown in FIG. 2, the coverlay film 42 includes an adhesive layer 9 laminated on the surface of the conductor 5 and a resin film 10 laminated on the surface of the adhesive layer 9 so as to cover the conductor 5. It is comprised by. As the resin film 10, the thing similar to the resin film which comprises the above-mentioned base material 2 can be used. In addition, it is preferable to use what has a thickness of 10 micrometers-150 micrometers as the resin film 10 for the same reason as the case of the above-mentioned base material 2. Moreover, as an adhesive which comprises the adhesive bond layer 9, the thing similar to the adhesive which comprises the above-mentioned adhesive bond layer 3 can be used. The coverlay film 42 is provided on the surface of the conductor 5 by a laminating process.

  Further, as the cover coat 43, for example, a cover resin mainly composed of a polyimide resin formed by a polyimide-based photosensitive cover coat ink is used. Examples of the polyimide-based photosensitive cover coat ink include, for example, a polyimide resin (36 to 37% by weight) as a main component, ethyl benzoate (23 to 24% by weight), and triethylene glycol dimethyl ether (35 to 36% by weight). , And those containing magnesium hydroxide (3.5-4 wt%) can be used. Moreover, as a kind of polyimide resin used, an aromatic polyimide polymer etc. are mentioned, for example.

  The present embodiment is characterized in that the cover coat 43 is colored in a color different from that of the cover lay film 42. The cover coat 43 may be colored by any method, for example, a method in which a predetermined colorant (for example, dye or pigment) is added to a polyimide photosensitive cover coat ink for coloring, or a polyimide photosensitive resin. After forming the cover coat 43 with the conductive cover coat ink, a method of sticking a colored film on the surface of the cover coat 43 can be employed.

  Thus, in the flexible printed wiring board 1 in this embodiment, it is set as the structure which provides the cover coat 43 colored in the color different from the coverlay film 42 in the bending parts 40 and 41. FIG. Therefore, the bent portions 40 and 41 formed by the cover coat 43 and the portions other than the bent portions 40 and 41 formed by the cover lay film 42 can be easily distinguished. As a result, since the bent portions 40 and 41 can be easily recognized, the folding positions 45 and 46 of the bent portions 40 and 41 are clarified, and the bending of the bent portions 40 and 41 is facilitated. Further, the return (springback) of the bent portions 40 and 41 can be reduced as compared with the case where the above-described coverlay film 42 is provided in the bent portions 40 and 41. Therefore, the bending process of the bending parts 40 and 41 becomes easy. Further, since the cover coat 43 colored in a color different from that of the cover lay film 42 is provided in the bent portions 40 and 41, unlike the conventional ruled line processing, the occurrence of cracks in the conductor 5 is avoided. Can do.

  Next, an example of a method for manufacturing the flexible printed wiring board 1 will be described. As a manufacturing process of the flexible printed wiring board 1, first, a laminated body in which the conductor 5 is laminated on the base material 2 is produced. More specifically, the adhesive layer 3 is laminated on one side of the base material 2 formed of a flexible resin film. Next, the metal foil such as a copper foil laminated through the adhesive layer 3 is etched by a conventional method to form the conductor 5 having the conductor circuit pattern 5a and the wiring pattern 5b.

  Next, the resin film 10 with the adhesive layer 9 is formed on the conductor circuit pattern 5a and the wiring pattern 5b except for the portions corresponding to the input terminal portion 15 and the output terminal portion 16 and the bent portions 40 and 41. The coverlay film 42 is laminated on the surface of the conductor 5 by laminating the coverlay film 42.

  Next, a polyimide-based photosensitive cover coat ink colored by adding a predetermined colorant is applied by screen printing or the like, dried, and further exposed and developed to bend on the surface of the conductor 5. A cover coat 43 made of polyimide resin is formed on the portions 40 and 41.

  Note that the thickness of the cover coat 43 is preferably 5 μm to 35 μm from the viewpoint of improving the bendability of the bent portions 40 and 41 and further facilitating the bending of the bent portions 40 and 41.

  Also, when forming the cover coat 43, from the viewpoint of preventing the positional deviation of the boundary portion between the cover lay film 42 and the cover coat 43, as shown in FIG. It is preferable to apply the cover coat ink so that the surface and the surface of the cover lay film 42 which is the wall surface of the bent portions 40 and 41 are continuous, and the cover lay film 42 and the cover coat 43 overlap.

  Further, depending on the electronic device in which the flexible printed wiring board 1 is used, it may be necessary to adjust the alignment when the input terminal portion 15 and the output terminal portion 16 are electrically connected to the conductor pattern of the electronic device. is there. Accordingly, the cover coat 43 provided on the bent portions 40 and 41 has a certain width in order to select the desired bent positions 45 and 46 in the bent portions 40 and 41 and perform the bending process. Is preferred. More specifically, the width W of the cover coat 43 in the bent portions 40 and 41 is preferably 0.3 mm to 1.5 mm. Further, by setting the width W of the cover coat 43 to 0.3 mm to 1.5 mm, the visibility of the bent portions 40 and 41 is improved, and the bent portions 40 and 41 can be recognized more easily. Further, the folding positions 45 and 46 are further clarified.

  In addition, when performing screen printing, from the viewpoint of ensuring adhesion in vacuum between a printing table provided in the screen printing machine and a flexible printed wiring board fixed on the printing table before printing the cover coat ink. If necessary, a removable adhesive film may be attached in advance to the back surface of the printing surface. In general, the range of the thickness that can be coated by one printing is narrow, and depending on the shape of the wiring pattern 5b formed in the bent portions 40 and 41, the coating cannot be completed and printing can be left after one printing. Therefore, printing may be performed twice. In this case, after each printing, preliminary drying is performed to such an extent that the tackiness of the polyimide-based photosensitive cover coat ink is eliminated, and after the above-mentioned adhesive film is peeled off, the main drying is performed.

  Then, in the output wiring portion 22, the flexible printed wiring board 1 is manufactured by forming the alignment mark 17 by, for example, adding a predetermined wiring pattern or conductor circuit pattern, punching, drilling, laser irradiation, mold processing, or the like. Will be. Note that the diameter of the alignment mark 17 is preferably 0.1 to 1.0 mm from the viewpoint of improving the recognizability when the alignment mark 17 is recognized in a CCD camera or the like.

According to the present embodiment described above, the following effects can be obtained.
(1) In the flexible printed wiring board 1 of the present invention, the insulating layer 7 provided in the bent portions 40 and 41 has a polyimide resin as a main component and a cover coat colored in a color different from that of the cover lay film 42 43 is formed. Accordingly, since the bent portions 40 and 41 can be easily recognized, the bending positions 45 and 46 are clarified, and the bending portions 40 and 41 can be easily bent. In addition, as compared with the conventional flexible printed wiring board 60 in which the insulating layer provided in the bent portions 80 and 81 is formed by the coverlay film 53, the flexibility of the bent portions 40 and 41 is improved. It is possible to secure the bending portions 40 and 41, and the return (springback) when bending the bending portions 40 and 41 can be reduced, so that the bending portions 40 and 41 can be easily bent. As a result, when the input terminal portion 15 and the output terminal portion 16 are electrically connected to the conductor pattern of the electronic device, it is easy to align the input terminal portion 15 and the output terminal portion 16 with the conductor pattern of the electronic device. The workability when the input terminal portion 15 and the output terminal portion 16 are electrically connected to the conductor pattern of the electronic device is improved.

  (2) Since the cover coat 43 formed of an expensive cover coat ink mainly composed of a polyimide resin is provided only in the bent portions 40 and 41, an increase in cost can be suppressed. Further, when the cover coat 43 is provided, the amount of polyimide photosensitive cover coat ink discarded is small, and environmental problems can be addressed. Further, since the cover coat 43 colored in a color different from that of the cover lay film 42 is provided in the bent portions 40 and 41, unlike the conventional ruled line processing, the occurrence of cracks in the conductor 5 is avoided. Can do.

  (3) Moreover, the width W of the cover coat 43 is set to 0.3 mm to 1.5 mm. Therefore, when the input terminal portion 15 and the output terminal portion 16 are aligned with the conductor pattern of the electronic device, it is possible to select the desired bending positions 45 and 46 and perform the bending process. Further, the visibility of the bent portions 40 and 41 is improved, and the bent portions 40 and 41 can be recognized more easily, so that the folding positions 45 and 46 are further clarified.

  (4) In the flexible printed wiring board 1 of the present invention, the cover coat 43 has a thickness of 5 μm to 35 μm. Therefore, the bendability of the bent portions 40 and 41 is improved, and the bending of the bent portions 40 and 41 is further facilitated.

  In addition, this invention is not limited to the said embodiment, A various design change is possible based on the meaning of this invention, and they are not excluded from the scope of the present invention.

  -For example, it is good also as a structure which provides at least one of the bending parts 40 and 41 in multiple numbers. More specifically, for example, as shown in FIG. 3, a plurality of the bent portions 41 (three in FIG. 3) provided with the above-described cover coat 43 may be provided. With such a configuration, it is possible to select a desired bent portion 41 and perform a bending process in accordance with an electronic device in which the flexible printed wiring board 1 is used.

-Moreover, it is good also as a structure by which the conductor 5 is directly formed on the base material 2 without the adhesive bond layer 3 interposed. As the method, for example, a method of laminating and bonding a hot-melt type resin film, which is the base material of the base material 2, to one side of the metal foil, which is the base material of the conductor 5, under high temperature and high pressure (lamination method) Alternatively, a coating solution containing a resin precursor (monomer, oligomer, prepolymer, etc.) is applied, dried and solidified, and then subjected to a curing reaction as necessary to form the substrate 2 (casting method) Alternatively, for example, a plating method in which a conductive layer is formed on one surface of the substrate 2 using electroless plating, vacuum deposition, sputtering, or the like and then the conductor 5 is formed by electrolytic plating may be used.

  In the above embodiment, the flexible printed wiring board 1 has been described by taking as an example a so-called single-sided board in which the conductor 5 is provided on one side of the insulating base material 2, but formed of a flexible resin film. A configuration in which the present invention is applied to a so-called double-sided board in which two layers of conductors are provided on each of both surfaces of the insulating base material, and two layers of insulating layers are provided on both sides to cover the conductors. It is also good. More specifically, each of the two insulating layers is formed by the cover lay film similar to the cover lay film 42 and the cover coat 43 described in the present embodiment, and the cover coat, and at the bent portion of the double-sided plate. It is good also as a structure which provides the said cover coat and provides the said cover lay film in parts other than a bending part.

  As an application example of the present invention, there is a flexible printed wiring board used as a component of an electronic device.

It is a top view on the surface side which shows schematic structure of the flexible printed wiring board which concerns on embodiment of this invention. It is AA sectional drawing of FIG. It is a top view which shows the modification of the flexible printed wiring board which concerns on embodiment of this invention. It is a top view of the surface side which shows schematic structure of the conventional flexible printed wiring board. It is CC sectional drawing of FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Flexible printed wiring board, 2 ... Base material, 5 ... Conductor, 5a ... Conductor circuit pattern, 5b ... Wiring pattern, 7 ... Insulating layer, 9 ... Adhesive layer, 10 ... Resin film, 15 ... Input terminal part, 16 DESCRIPTION OF SYMBOLS ... Output terminal part, 17 ... Alignment mark, 20 ... Circuit part, 21 ... Input wiring part, 22 ... Output wiring part, 40 ... Bending part, 41 ... Bending part, 42 ... Coverlay film, 43 ... Cover coat, 45 ... Bending position, 46: Bending position, W: Cover coat width

Claims (4)

A substrate;
A conductor provided on the surface of the substrate;
A wiring part having a wiring pattern formed by the conductor and provided with a terminal part connected to the conductor pattern of the electronic device;
A bent portion for performing alignment between the terminal portion and the conductor pattern of the electronic device when the terminal portion is electrically connected to the conductor pattern of the electronic device while being provided in the wiring portion,
On the surface of the conductor, and a flexible printed wiring board comprising an insulating layer provided in a portion excluding the terminal portion,
The insulating layer is composed of an adhesive layer laminated on the surface of the conductor, a cover lay film made of a resin film laminated on the surface of the adhesive layer, a polyimide resin as a main component, and the cover lay film A flexible printed wiring formed of a cover coat colored in a different color, wherein the cover coat is provided in the bent portion and the cover lay film is provided in a portion other than the bent portion. Board.   The flexible printed wiring board according to claim 1, wherein a width of the cover coat is 0.3 mm to 1.5 mm.   The flexible printed wiring board according to claim 1, wherein the cover coat has a thickness of 5 μm to 35 μm.   The flexible printed wiring board according to claim 1, comprising a plurality of the bent portions.

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