JPH0330497U - - Google Patents
Info
- Publication number
- JPH0330497U JPH0330497U JP9168389U JP9168389U JPH0330497U JP H0330497 U JPH0330497 U JP H0330497U JP 9168389 U JP9168389 U JP 9168389U JP 9168389 U JP9168389 U JP 9168389U JP H0330497 U JPH0330497 U JP H0330497U
- Authority
- JP
- Japan
- Prior art keywords
- conductive film
- film
- wrapped
- thickness
- circle around
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000002985 plastic film Substances 0.000 claims description 3
- 229920006255 plastic film Polymers 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
図面は、この考案を使用したときの状態を示す
一部斜視断面図である。
１０……被シールド材、２０……プラスチツク
フイルム、３０……導電膜、４０……導電性接着
層、５０……突合わせ部。
The drawing is a partially perspective sectional view showing the state when this invention is used. DESCRIPTION OF SYMBOLS 10... Shielding material, 20... Plastic film, 30... Conductive film, 40... Conductive adhesive layer, 50... Butt part.
Claims (1)
ークル状に巻き付けるための導電フイルムと、長
尺な被シールド材の周囲にサークル状に巻き付け
られた導電フイルムを突合わせ部で接合通電させ
るための結合用フイルムとからなり、導電フイル
ムは、プラスチツクフイルムの表面に厚さ０．１
μｍ以上の導電膜が形成され、結合用フイルムは
、プラスチツクフイルムの表面に厚さ０．１μｍ
以上の導電膜が形成されてその導電膜の上に導電
性接着層が形成されていることを特徴とする、電
磁シールド材。 A conductive film that is wrapped in a circle around a long shielded material such as a cable line, and a conductive film that is wrapped in a circle around a long shielded material are joined at the butt part to conduct electricity. The conductive film has a thickness of 0.1 mm on the surface of the plastic film.
A conductive film with a thickness of 0.1 μm or more is formed on the surface of the plastic film.
An electromagnetic shielding material comprising the above conductive film and a conductive adhesive layer formed on the conductive film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9168389U JPH0717200Y2 (en) | 1989-08-02 | 1989-08-02 | Electromagnetic shield material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9168389U JPH0717200Y2 (en) | 1989-08-02 | 1989-08-02 | Electromagnetic shield material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0330497U true JPH0330497U (en) | 1991-03-26 |
| JPH0717200Y2 JPH0717200Y2 (en) | 1995-04-19 |
Family
ID=31641153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9168389U Expired - Lifetime JPH0717200Y2 (en) | 1989-08-02 | 1989-08-02 | Electromagnetic shield material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0717200Y2 (en) |
-
1989
- 1989-08-02 JP JP9168389U patent/JPH0717200Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0717200Y2 (en) | 1995-04-19 |
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