JPH033800U - - Google Patents
Info
- Publication number
- JPH033800U JPH033800U JP6449789U JP6449789U JPH033800U JP H033800 U JPH033800 U JP H033800U JP 6449789 U JP6449789 U JP 6449789U JP 6449789 U JP6449789 U JP 6449789U JP H033800 U JPH033800 U JP H033800U
- Authority
- JP
- Japan
- Prior art keywords
- package
- circuit board
- printed circuit
- fitted
- cutout portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Description
第1図はこの考案の一実施例によるIC組立治
具を用いてプリント基板上にZIP型ICの実装
を行つた場合の構成を示した側面図、第2図はこ
の考案の一実施例によるIC組立治具を用いてプ
リント基板上にSIP型ICの実装を行つた場合
の構成を示した斜視図、第3図は従来の手作業に
よりプリント基板上にZIP型ICの実装を行つ
た場合に、ICがプリント基板上に垂直に固定さ
れたときの構成を示した側面図、第4図は従来の
手作業によりプリント基板上にZIP型ICの実
装を行つた場合に、ICがプリント基板上に斜め
に固定されたときの構成を示した側面図、第5図
は従来の手作業によりプリント基板上にSIP型
ICの実装を行つた場合に、ICがプリント基板
上に垂直に固定されたときの構成を示した側面図
、第6図は従来の手作業によりプリント基板上に
SIP型ICの実装を行つた場合に、ICがプリ
ント基板上に斜めに固定されたときの構成を示し
た側面図、第7図は従来の手作業によりプリント
基板上にDIP型ICの実装を行つた場合に、I
Cがプリント基板上に垂直に固定されたときの構
成を示した側面図である。
1……プリント基板、2……プリント基板1の
孔、3……ZIP型IC、3a……ZIP型IC
3のリード端子、6……高さ調整棒、7……傾き
防止板。
Fig. 1 is a side view showing the configuration when a ZIP type IC is mounted on a printed circuit board using an IC assembly jig according to an embodiment of this invention, and Fig. 2 is an embodiment of this invention. A perspective view showing the configuration when a SIP type IC is mounted on a printed circuit board using an IC assembly jig. Figure 3 is a diagram showing a case where a ZIP type IC is mounted on a printed circuit board using conventional manual methods. 4 is a side view showing the configuration when the IC is vertically fixed on the printed circuit board, and FIG. 4 is a side view showing the configuration when the IC is vertically fixed on the printed circuit board. Figure 5 is a side view showing the configuration when the IC is fixed diagonally upward. Figure 6 shows the configuration when the IC is fixed diagonally on the printed circuit board when the SIP type IC is mounted on the printed circuit board by conventional manual methods. The side view shown in Fig. 7 shows the I
FIG. 3 is a side view showing the configuration when C is vertically fixed on a printed circuit board. 1... Printed circuit board, 2... Hole of printed circuit board 1, 3... ZIP type IC, 3a... ZIP type IC
3 lead terminal, 6... height adjustment rod, 7... tilt prevention plate.
Claims (1)
のリード端子が嵌め込まれるICパツケージとの
間に介挿され、半田が付着しない材質によつて形
成された丸棒状の治具と、前記ICパツケージの
幅よりもわずかに大きい幅の切り抜き部が複数個
形成され、前記切り抜き部分が前記ICパツケー
ジに嵌め込まれる櫛形状の治具とからなることを
特徴とするIC組立治具。 A round bar-shaped jig made of a material to which solder does not adhere, which is inserted between a printed circuit board and an IC package into which a plurality of lead terminals are fitted into the holes of the printed circuit board, and a width of the IC package. 1. An IC assembly jig comprising a comb-shaped jig in which a plurality of cutout portions are formed with a width slightly larger than that of the IC package, and the cutout portions are fitted into the IC package.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6449789U JPH033800U (en) | 1989-06-02 | 1989-06-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6449789U JPH033800U (en) | 1989-06-02 | 1989-06-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH033800U true JPH033800U (en) | 1991-01-16 |
Family
ID=31595495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6449789U Pending JPH033800U (en) | 1989-06-02 | 1989-06-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH033800U (en) |
-
1989
- 1989-06-02 JP JP6449789U patent/JPH033800U/ja active Pending