JPH0337305B2 - - Google Patents

Info

Publication number
JPH0337305B2
JPH0337305B2 JP60241873A JP24187385A JPH0337305B2 JP H0337305 B2 JPH0337305 B2 JP H0337305B2 JP 60241873 A JP60241873 A JP 60241873A JP 24187385 A JP24187385 A JP 24187385A JP H0337305 B2 JPH0337305 B2 JP H0337305B2
Authority
JP
Japan
Prior art keywords
multilayer wiring
integrated circuit
wiring board
solder
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60241873A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62102546A (ja
Inventor
Yoshitaka Fukuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP60241873A priority Critical patent/JPS62102546A/ja
Publication of JPS62102546A publication Critical patent/JPS62102546A/ja
Publication of JPH0337305B2 publication Critical patent/JPH0337305B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/60—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP60241873A 1985-10-29 1985-10-29 混成集積回路装置の製造方法 Granted JPS62102546A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60241873A JPS62102546A (ja) 1985-10-29 1985-10-29 混成集積回路装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60241873A JPS62102546A (ja) 1985-10-29 1985-10-29 混成集積回路装置の製造方法

Publications (2)

Publication Number Publication Date
JPS62102546A JPS62102546A (ja) 1987-05-13
JPH0337305B2 true JPH0337305B2 (enExample) 1991-06-05

Family

ID=17080796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60241873A Granted JPS62102546A (ja) 1985-10-29 1985-10-29 混成集積回路装置の製造方法

Country Status (1)

Country Link
JP (1) JPS62102546A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3397313B2 (ja) 1999-12-20 2003-04-14 富士通株式会社 半導体装置の製造方法及び電子部品の実装方法

Also Published As

Publication number Publication date
JPS62102546A (ja) 1987-05-13

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