JPH0336142U - - Google Patents

Info

Publication number
JPH0336142U
JPH0336142U JP9832689U JP9832689U JPH0336142U JP H0336142 U JPH0336142 U JP H0336142U JP 9832689 U JP9832689 U JP 9832689U JP 9832689 U JP9832689 U JP 9832689U JP H0336142 U JPH0336142 U JP H0336142U
Authority
JP
Japan
Prior art keywords
magnetic material
lid
hybrid
heat sink
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9832689U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9832689U priority Critical patent/JPH0336142U/ja
Publication of JPH0336142U publication Critical patent/JPH0336142U/ja
Pending legal-status Critical Current

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案のハイブリツドICの断面図
で、第2図、第3図は種々の実施例のフタの平面
図である。第4図は従来のハイブリツドICの断
面図である。 1……ヒートシンク(Fe−Niメツキ)、2
……セラミツク基板、3……電子部品、4……ケ
ース、5……シリコーンゲル、7……磁性体、8
……シリコーン接着剤、9,10……フタ。
FIG. 1 is a sectional view of the hybrid IC of this invention, and FIGS. 2 and 3 are plan views of lids of various embodiments. FIG. 4 is a sectional view of a conventional hybrid IC. 1...Heat sink (Fe-Ni plating), 2
... Ceramic substrate, 3 ... Electronic component, 4 ... Case, 5 ... Silicone gel, 7 ... Magnetic material, 8
...Silicone adhesive, 9,10...Lid.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 磁性体からなるヒートシンク上に形成した回路
素子を枠状ケース外周と絶縁体のゲルで封止し、
その上に樹脂からなるフタをしてカバーするハイ
ブリツドICにおいて、前記フタの特定箇所に磁
性体を配置したことを特徴とするハイブリツドI
C。
A circuit element formed on a heat sink made of a magnetic material is sealed with the outer periphery of a frame-shaped case and an insulating gel.
A hybrid IC covered with a lid made of resin, characterized in that a magnetic material is disposed at a specific location on the lid.
C.
JP9832689U 1989-08-22 1989-08-22 Pending JPH0336142U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9832689U JPH0336142U (en) 1989-08-22 1989-08-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9832689U JPH0336142U (en) 1989-08-22 1989-08-22

Publications (1)

Publication Number Publication Date
JPH0336142U true JPH0336142U (en) 1991-04-09

Family

ID=31647432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9832689U Pending JPH0336142U (en) 1989-08-22 1989-08-22

Country Status (1)

Country Link
JP (1) JPH0336142U (en)

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