JPH0335828B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an inner lead bonding apparatus for bonding a die of a semiconductor component to an inner lead provided on a carrier tape, and particularly to an apparatus for detecting defective or non-defective die.

Generally, in the production of semiconductor components, a wafer is attached to a wafer substrate and multiple dies are directly sliced vertically and horizontally to form a large number of dies, or a wafer is attached to a wafer sheet and divided vertically and horizontally to form a large number of dies. , probe this wafer. In this probe inspection process, defective marks such as ink dots are placed on defective dies such as cracks and chips. The wafer with defective marks is attached to the wafer mounting table of the inner lead bonding machine, and the defective dies marked with defective marks are detected by pattern recognition using an ITV camera installed above the wafer mounting table. detect,
Select a good die and bond it to the inner lead of the carrier tape.

However, when a mirror-finished stainless steel material or the like is used as the wafer substrate, or a silicone material is used as the wafer sheet, the degree of light reflection increases at the outer periphery of the wafer, so accurate detection is often not possible. Furthermore, due to the die manufacturing process, for example, when a wafer is manufactured and bumps are formed on the wafer, it is not possible to mark a defective die, which has the disadvantage that a defective die cannot be detected. Also, since the mark detection method uses pattern recognition, the detection time is 1
At least several milliseconds are required for each die.
That is, since the wafer has approximately 500-600 dies, the total detection time becomes very large.

SUMMARY OF THE INVENTION An object of the present invention is to provide an inner lead bonding device that eliminates the drawbacks of the prior art described above.

Hereinafter, the present invention will be explained with reference to illustrated embodiments.

FIG. 1 is a front view showing an embodiment of an inner lead bonding apparatus according to the present invention. A carrier tape 1 with inner leads (not shown) provided at equal intervals is connected to a tape guide plate 3 provided above a wafer mounting table 2 from a supply reel (not shown) and to both sides of this tape guide plate 3. The tape is guided by provided tape guide rollers 4 and 5 and is successively and intermittently fed in pitches, and bonded by a tool (not shown). After the bonding is completed, the film is wound onto a take-up reel (not shown).

As shown in FIG. 2, the wafers 7 of the wafer substrate 6 are pasted on the wafer mounting table 2, and a large number of dice 8 are separated by direct slicing in the vertical and horizontal directions.
Alternatively, a wafer 7 is attached to a wafer sheet (not shown), and a large number of dies 8 divided vertically and horizontally are placed thereon. These dies 8 have a chip 8 on the outer periphery.
As a result of the crack 8b and wafer probe inspection, the defective die 8c is separated from the other good die 8d.

In addition, the wafer mounting table 2 is driven by a motor 9 for driving in the X direction.
and is fixed to the upper surface of an XY table 11 that is moved in the XY directions by a Y direction drive motor 10. XY table 11 has card placement stand 1
2 is fixed, and a card 13 is placed on this card mounting stand 12. Further, a translucent device 14 and a light receiver 15 are fixed to the device fixing portion with the card 13 sandwiched therebetween at a position that does not interfere with the operation of the XY table 11. As shown in FIG. 3, if the card 13 is opaque, punch hole marks 13a are attached to the card 13 at positions corresponding to the defective dies 8a, 8b, and 8c shown in FIG. If it is transparent, a mark 13a made of ink or the like is attached.

Next, the operation of the inner lead bonding apparatus having such a configuration will be explained. First, in the wafer approach inspection process, defect marks are placed on the defective dies 8a, 8b, and 8c shown in FIG.
By sending a signal to mark the defective dies 8a, 8b, and 8c as defective in parallel to a card punching device (not shown) in which the card 13 is set, defective dies on the wafer 7 can be detected at the same time as the wafer probe inspection is completed. A card 13 or tape is produced with marks 13a attached to the portions corresponding to the dies 8a, 8b, and 8c as shown in FIG. in this case,
If a defective mark cannot be placed on the die 8, the mark 13a may be placed only on the card 13.

Next, the wafer substrate 6 to which the wafer 7 that has undergone the wafer probe inspection is attached is placed on the wafer mounting table 2. Further, the card 13 with the mark 13a attached is attached to the card mounting table 12. Here, the card 13 or the light projector 14 and the light receiver 15 are adjusted so that the portion of the card 13 corresponding to the die 8 at the bonding position is located between the light projector 14 and the light receiver 15.

When the apparatus is started in this state, each time the die 8 is bonded to the inner lead of the carrier tape 1 with a tool (not shown), the X-direction drive motor 9
And when the XY table 11 is pitch-fed by the Y-direction drive motor 10. Both the wafer substrate 6 and the card 13 move in the same direction, and the card 13 corresponding to the die 8 is always located at the bonding position.
The light is sent between the light emitter 14 and the light receiver 15 at the portion shown in FIG. Therefore, when the portion 13b of the card 13 that is not marked with the mark 13a comes to the detection position, the light receiver 15 is turned off, and the control unit ( (not shown). Bonding is performed based on this signal indicating that the product is good. When the portion marked with the mark 13a moves to the detection position, the light receiver 15 is turned on, and it is read that the dies 8 at the bonding position are defective dies 8a, 8b, and 8c. This signal issues a skip command to the XY table 11, causing the defective die to be skipped from the bonding position.

In this way, using the card 13, the defective die 8
a, 8b, 8c, the wafer substrate 6
Alternatively, defective dies 8a, 8b, and 8c can be detected regardless of the materials of the wafer sheet and wafer 7. Furthermore, even when it is not possible to attach a defective mark due to the manufacturing process of the die 8, the defective dies 8a, 8b, and 8c can be detected. In addition, since detection can be performed by the emitter 14 and the receiver 15, the transmission time of the optical signal from the emitter and receiver is several seconds.
The detection operation is completed in nanoseconds to several tens of nanoseconds, and the detection time is extremely fast. That is, the total detection time is significantly shortened.

In addition, in the above embodiment, the defective die 8a,
Although the mark 13a is attached to the part of the card 13 corresponding to the die 8b and 8c, the mark may be attached to the part of the card 13 corresponding to the good die 8d. In this case, when the control unit processes the signals output from the light emitter 14 and the light receiver 15, the level of the input signal may be inverted and read. Further, the card mounting table 12 may be fixed to the wafer mounting table 2.

As is clear from the above description, according to the inner lead bonding apparatus of the present invention, all defective dies or non-defective dies can be detected in a very short time regardless of the wafer substrate, wafer sheet, wafer material, or wafer manufacturing circumstances. .

[Brief explanation of drawings]

FIG. 1 is a front view showing an embodiment of the inner lead bonding apparatus according to the present invention, FIG. 2 is a plan view of a die provided on a wafer substrate, and FIG. 3 is a plan view of a card. 2...Wafer mounting table, 7...Wafer, 8...
...Die, 8a, 8b, 8c...Defective die, 8d...
...Good die, 11...XY table, 12...Card mounting stand, 13...Card, 13a...Mark,
14... Emitter, 15... Light receiver.

Claims (1)

[Claims] 1. In an inner lead bonding apparatus having a wafer mounting table on which a wafer which is divided vertically and horizontally to form a large number of dies is mounted, and an XY table to which the wafer mounting table is fixed and moves in pitch in the XY direction, A card with a mark attached to a portion corresponding to a defective die or a good die, a card mounting table fixed to the XY table or the wafer mounting table or the like so as to move together with the wafer mounting table and to which the card is attached, and a bonding position. an inner lead bonding device comprising: a detection means attached to a device fixing part so as to detect a mark on a portion of the card corresponding to a die located on the device.