JPH0334228B2 - - Google Patents
Info
- Publication number
- JPH0334228B2 JPH0334228B2 JP18231785A JP18231785A JPH0334228B2 JP H0334228 B2 JPH0334228 B2 JP H0334228B2 JP 18231785 A JP18231785 A JP 18231785A JP 18231785 A JP18231785 A JP 18231785A JP H0334228 B2 JPH0334228 B2 JP H0334228B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- fitting
- coupling
- heat pipe
- coupling fitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000008878 coupling Effects 0.000 claims description 44
- 238000010168 coupling process Methods 0.000 claims description 44
- 238000005859 coupling reaction Methods 0.000 claims description 44
- 238000001816 cooling Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18231785A JPS6242550A (ja) | 1985-08-20 | 1985-08-20 | 熱伝達結合装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18231785A JPS6242550A (ja) | 1985-08-20 | 1985-08-20 | 熱伝達結合装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6242550A JPS6242550A (ja) | 1987-02-24 |
| JPH0334228B2 true JPH0334228B2 (de) | 1991-05-21 |
Family
ID=16116190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18231785A Granted JPS6242550A (ja) | 1985-08-20 | 1985-08-20 | 熱伝達結合装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6242550A (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5398748A (en) * | 1991-06-05 | 1995-03-21 | Fujitsu Limited | Heat pipe connector and electronic apparatus and radiating fins having such connector |
| DE69217830T2 (de) * | 1991-06-05 | 1997-10-02 | Fujitsu Ltd | Verbindungsstück für wärmerohr, elektronische vorrichtung und strahlender heizkörper mit derartigem rohr |
| TWI266596B (en) * | 2005-09-15 | 2006-11-11 | Via Tech Inc | Electronic apparatus and thermal dissipating module thereof |
| JP4698413B2 (ja) * | 2005-12-27 | 2011-06-08 | 住友軽金属工業株式会社 | 液冷式ヒートシンク |
-
1985
- 1985-08-20 JP JP18231785A patent/JPS6242550A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6242550A (ja) | 1987-02-24 |
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