JPH0334225B2 - - Google Patents

Info

Publication number
JPH0334225B2
JPH0334225B2 JP60232658A JP23265885A JPH0334225B2 JP H0334225 B2 JPH0334225 B2 JP H0334225B2 JP 60232658 A JP60232658 A JP 60232658A JP 23265885 A JP23265885 A JP 23265885A JP H0334225 B2 JPH0334225 B2 JP H0334225B2
Authority
JP
Japan
Prior art keywords
heat dissipation
semiconductor device
dissipation fin
view
power module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60232658A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6292347A (ja
Inventor
Hiroshi Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60232658A priority Critical patent/JPS6292347A/ja
Publication of JPS6292347A publication Critical patent/JPS6292347A/ja
Publication of JPH0334225B2 publication Critical patent/JPH0334225B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60232658A 1985-10-17 1985-10-17 半導体装置用放熱フイン Granted JPS6292347A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60232658A JPS6292347A (ja) 1985-10-17 1985-10-17 半導体装置用放熱フイン

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60232658A JPS6292347A (ja) 1985-10-17 1985-10-17 半導体装置用放熱フイン

Publications (2)

Publication Number Publication Date
JPS6292347A JPS6292347A (ja) 1987-04-27
JPH0334225B2 true JPH0334225B2 (pl) 1991-05-21

Family

ID=16942755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60232658A Granted JPS6292347A (ja) 1985-10-17 1985-10-17 半導体装置用放熱フイン

Country Status (1)

Country Link
JP (1) JPS6292347A (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0926733B1 (en) * 1997-12-16 2004-03-17 STMicroelectronics S.r.l. Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink

Also Published As

Publication number Publication date
JPS6292347A (ja) 1987-04-27

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