JPH0332421U - - Google Patents
Info
- Publication number
- JPH0332421U JPH0332421U JP9207489U JP9207489U JPH0332421U JP H0332421 U JPH0332421 U JP H0332421U JP 9207489 U JP9207489 U JP 9207489U JP 9207489 U JP9207489 U JP 9207489U JP H0332421 U JPH0332421 U JP H0332421U
- Authority
- JP
- Japan
- Prior art keywords
- stem
- die
- semiconductor
- bonding
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の実施例１を示す構成概略図、
第２図は本考案の実施例１を示す縦断面図、第３
図は本考案の実施例２を示す縦断面図である。
１……カメラ、２……変倍レンズ、３……カメ
ラコントロールユニツト、４……ワークステージ
、５……ステム、６……ダイボンデイングヘツド
、７……ダイボンデイングアーム、８……半導体
素子、９……認識装置、１０……制御部、１１…
…ハンド、１２……ダイボンドソルダー、１３…
…ソルダー供給ユニツト。
FIG. 1 is a schematic configuration diagram showing Embodiment 1 of the present invention;
Fig. 2 is a vertical sectional view showing the first embodiment of the present invention;
The figure is a longitudinal sectional view showing a second embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Camera, 2...Variable lens, 3...Camera control unit, 4...Work stage, 5...Stem, 6...Die bonding head, 7...Die bonding arm, 8...Semiconductor element, 9... Recognition device, 10... Control unit, 11...
...Hand, 12...Dibond solder, 13...
...Solder supply unit.
Claims (1)
グ装置において、ステム全体とステムに搭載した
後の半導体素子をとらえるカメラと、前記カメラ
に取付ける変倍式レンズと、ステム及び搭載した
半導体素子を認識し搭載位置ズレを演算処理する
認識装置と、演算により得た半導体素子位置ズレ
量に応じて半導体搭載位置を修正するハンド及び
制御部とを有し、１つの半導体素子をダイボンド
した後、その素子を認識して演算した位置に２個
目以降の半導体素子をダイボンドすると共にダイ
ボンドの都度その対象素子の位置ずれを演算処理
しハンドにてずれ量分素子の位置を補正すること
を特徴とするダイボンデイング装置。 In a Dan bonding device that mounts a semiconductor device on a stem, there is a camera that captures the entire stem and the semiconductor device after it is mounted on the stem, a variable magnification lens that is attached to the camera, and a system that recognizes the stem and the mounted semiconductor device and adjusts the mounting position. It has a recognition device that performs calculation processing, and a hand and a control unit that corrects the semiconductor mounting position according to the amount of semiconductor element position deviation obtained by the calculation, and after die-bonding one semiconductor element, recognizes the element. A die bonding apparatus characterized in that a second or subsequent semiconductor element is die-bonded to a calculated position, and the positional deviation of the target element is processed each time the die-bonding is performed, and the position of the element is corrected by the amount of deviation by hand.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9207489U JPH0810187Y2 (en) | 1989-08-04 | 1989-08-04 | Die bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9207489U JPH0810187Y2 (en) | 1989-08-04 | 1989-08-04 | Die bonding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0332421U true JPH0332421U (en) | 1991-03-29 |
| JPH0810187Y2 JPH0810187Y2 (en) | 1996-03-27 |
Family
ID=31641520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9207489U Expired - Lifetime JPH0810187Y2 (en) | 1989-08-04 | 1989-08-04 | Die bonding machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810187Y2 (en) |
-
1989
- 1989-08-04 JP JP9207489U patent/JPH0810187Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0810187Y2 (en) | 1996-03-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |