JPH0330500A - Lead insertion state detecting mechanism - Google Patents

Abstract

PURPOSE:To enable the check of a circuit board at a high speed and to prevent it from being left unchecked by a method wherein a matter that a detecting pin bears against a lead or not is converted into the corresponding displacement of the detecting pin in an axial direction and detected as the output signal of a photodetector corresponding to that light is blocked by the check pin or not. CONSTITUTION:Detecting pins 9 and 10 are made opposed to a lead insertion hole 5c into which a lead 3c is inserted and a lead insertion hole 6c where a lead 4c is inserted respectively from below. For instance, when the lead 3c is properly inserted into the lead insertion hole 5c, light is detected by a photodetector 15. When the lead 4c is not inserted into the lead insertion hole 6c, light traveling from a light emitting element 14' to a photodetector 15' is blocked by a light screening section 10b. When even one of leads is not inserted into a lead insertion hole, a buzzer is sounded by the output of a circuit.

Description

DETAILED DESCRIPTION OF THE INVENTION The lead insertion state detection mechanism of the present invention will be described in detail according to the following items.

A. Total usage for business a. Summary of B2 invention C1 background technology Problems that the invention attempts to solve Means to solve E4 issues F. Example F-1.

First embodiment [Figures 1 to 5] a. Printed circuit board [Figures 1, 2, and 5] b. Lead insertion state detection mechanism [Figures 1 to 4] b- 1. Inspection board, detection pin [Figures 1 to 3] b-2, Photodetector, detection circuit [Figures 1 to 4] b-3 Detection of lead insertion state [Figure 1] F -2, Second embodiment [Figs. 6 to 88] Comic circuit board [Figs. 6 to 8] b. Lead insertion state detection mechanism [Figs. 6 and 7] b-1. Structure b-2. Detection of lead insertion state G1 Effects of the invention (A, a Togami usage total) The present invention relates to a novel lead insertion state detection mechanism. Specifically, the present invention relates to a mechanism for detecting whether or not an insertion type lead component, that is, an electronic component equipped with a lead that is inserted into a lead insertion hole formed in a printed circuit board, is inserted into a lead insertion hole. It is an object of the present invention to provide a novel lead insertion state detection mechanism that can detect whether or not each lead is inserted into a lead insertion hole, regardless of the number or arrangement of the leads.

(B. Summary of the Invention) The lead insertion state detection mechanism of the present invention is provided with a detection pin corresponding to the circuit board glue insertion hole so as to be freely movable in the axial direction of the lead insertion hole, and a detection pin corresponding to the circuit board glue insertion hole. A photodetector is provided to detect changes in position, and when the lead of an electronic component is inserted into the lead insertion hole, the lead and the corresponding detection pin abut in the axial direction, and the detection pin is placed against the photodetector. Accordingly, whether or not the lead of the electronic component is inserted into the lead insertion hole can be detected as an output signal from the photodetector.

(C, Background Art) Electronic components having insertion type leads are mounted on a printed circuit board by inserting the leads into lead insertion holes formed on the printed circuit board, and inserting all or all of the multiple leads. This is done by bending a portion of the tip.

A so-called automatic insertion machine, which is a device that mechanically mounts such electronic components onto a printed circuit board, usually holds the electronic component and inserts its leads into the printed circuit board board insertion holes. In addition to the insertion mechanism, it is equipped with a lead bending mechanism that bends the lead as described above, and the lead bending mechanism bends the lead after directly or indirectly detecting that the lead has been inserted into the lead insertion hole. It is supposed to be done.

By the way, the number and arrangement form of such electronic components are various, for example, those in which three or more are arranged in a non-linear direction, such as the leads of variable capacitors or semi-fixed capacitors, or so-called ICs, etc. Like the leads of connectors, slide switches, etc., many wires are connected in a straight line.
There are some that are arranged in a row or multiple rows.

However, with automatic insertion machines, as mentioned above, electronic components that have three or more leads in an irregular arrangement, or electronic components that have a large number of leads even in a regular arrangement, cannot be easily inserted. Since it is extremely difficult to detect that the lead has been inserted into the lead insertion hole and to bend the lead for all the leads, it is difficult It is designed to detect insertion and bend.

For example, for a semi-fixed capacitor with three leads, the presence or absence of insertion is detected and bent for only two leads, and for connectors and ICs, the direction in which the leads are arranged out of a large number of leads is detected. Bending is performed only at both ends of the board, and the presence or absence of insertion is detected by checking the position of the main body relative to the printed circuit board in the height direction.

(D. Problem to be Solved by the Invention) Therefore, when such electronic components are mounted on a printed circuit board by an automatic insertion machine, it is necessary to check whether the leads are inserted into the lead insertion holes or not. The electronic component has been successfully mounted on the printed circuit board even if some of the leads are not inserted into the lead insertion holes because nothing is done or the leads cannot be directly checked. There is a problem in that the solder is transferred to the solder dip process or the like.

Of course, before being transferred to the solder dip process, etc., the circuit board is inspected to confirm whether there are any leaks in the lead insertion, but it is extremely difficult to perform such an inspection visually. Moreover, there is no guarantee that if there is any omission in insertion, it will be discovered without being overlooked.

(E. Means for Solving the Problems) Therefore, the lead insertion state detection mechanism of the present invention was developed in order to solve the above-mentioned problems in performing the inspection, and it is designed to are located corresponding to the photodetector and the lead insertion hole of the circuit board, which are provided facing each other.
In addition, a detection pin is provided that is slidably supported in the axial direction of the lead insertion hole and has a light shielding part that blocks light traveling from the light emitting part to the light receiving part of the photodetector, so that the lead of the electronic component can be attached to the circuit board. Converts whether or not the lead is inserted into the insertion hole into the displacement in the axial direction of the detection pin corresponding to the presence or absence of contact between the lead and the detection pin, and the detection of the photodetector corresponding to the presence or absence of light shielding by the detection pin. This allows it to be detected as an output signal.

Therefore, the lead insertion state detection mechanism of the present invention can detect whether or not the leads of an electronic component are inserted into the lead insertion holes of the circuit board, regardless of the number or arrangement of the leads.
They can be detected individually as electrical signals, so that circuit boards on which electronic components have been mounted can be inspected quickly and without any omissions.

(F. Embodiments) Details of the lead insertion state detection mechanism of the present invention will be described below according to the illustrated embodiments.

(F-1, First Embodiment) [Figs. 1 to 5] Figs. 1 to 5 show a first embodiment 1 of the lead insertion state detection mechanism of the present invention.

First, an example of the circuit board will be explained, and then the lead insertion state detection mechanism 1 will be explained.

(a, printed circuit board) [Figure 1, Figure 2, Figure 5] 2 is a printed circuit board (only a part is shown in the drawing), and the printed circuit board 2 has two semi-fixed parts. A type capacitor 3.4 and other electronic components (not shown) are mounted.

The semi-fixed capacitors 3 and 4 each have three leads 3a, 3b, 3c, 4a, and 4b.

4C and these leads are semi-fixed capacitors 3.
Lead insertion holes 5a, 5b, 5c, and 6a are formed at predetermined positions on the printed circuit board 2, and are arranged at three vertices of a triangle when viewed from the height direction.
, 6b, and 6c, respectively.

The semi-fixed capacitors 3 and 4 are mounted on the printed circuit board 2 by an automatic insertion machine, and each of the three leads 3a and 3b are mounted on the printed circuit board 2.

After it is confirmed that the two wires 3a and 3b, 4a and 4b, which are opposite in the thickness direction of 3C, 4a, 4b, and 4c, have been inserted into the lead insertion hole by the insertion detection mechanism of the automatic insertion machine. The clinch mechanism bends the semi-rigid capacitor 3 as shown in FIG.
4 is held on the printed circuit board 2.

(b. Lead insertion state detection mechanism) [Figures 1 to 4
Figure] The lead insertion state detection mechanism 1 includes a test board, a detection pin supported movably in the axial direction on the test board, a photodetector fixed to the test board, a detection circuit, and the like.

(b-1, inspection board, detection pin) [Figs. 1 to 3] 7 is an inspection board (only a portion is shown in the drawing).

The test board 7 has, for example, a flat plate shape that is approximately the same size as the printed circuit board 2, and has detection pin insertion holes 8a and 8b formed at predetermined positions. These detection pin insertion holes 8a and 8b are connected to the lead insertion holes 5a and 5.
Two lead insertion holes 5C and 6C1 formed in the printed circuit board 2 have approximately the same diameter as those of the test board 7a, 6b, and 6c, and have a positional relationship with respect to the reference position of the test board 7, i.e., an automatic insertion machine. The lead insertion holes through which the leads 3c and 4c, which are not bent by the bending process, are inserted are formed so as to match the positional relationship with respect to the reference position of the printed circuit board 2.

In addition, as such a test board, the same printed circuit board as the printed circuit board 2 may be used, or the perforation pattern of the lead insertion holes of the printed circuit board 2 may be formed on the laminated board that forms the base of the printed circuit board 2. It is also possible to use a device in which lead insertion holes are formed in the same drilling pattern, and among the many lead insertion holes, those corresponding to the lead insertion holes 5C16C may be used as the detection pin insertion holes 8a and 8b.

Reference numeral 9.10 indicates a detection pin having a circular cross section, and a main portion 9 having approximately the same thickness as the diameter of the detection pin insertion holes 8a and 8b.
a, 10a and light shielding parts 9b, iob formed at the upper ends of the main parts 9a, 10a, the light shielding parts 9b, 10b
has a diameter approximately twice that of the main portions 9a, 10a, and the main portions 9a, 10a are slidably inserted into the detection pin insertion holes 8a, 8b, respectively.

(b-2, photodetector, detection circuit) [Figures 1 to 4] Reference numerals 11 and 12 are photodetectors, which include base portions 13 and 13' that are approximately U-shaped when viewed from above; Section 13.13'
Two side parts 13a and 13 facing each other in parallel to each other
a, 13'a and 13'a, a light emitting element chamber 4.14', such as a light emitting diode, and a photoelectric conversion type light receiving element 15, 15', such as a phototransistor, are provided separately in opposing directions. The base portions 13 and 13' are fixed at positions corresponding to the two detection pin insertion holes 8a and 8b on the upper surface 7a of the inspection board 7, respectively.

In addition, when these photodetectors 11.12 are viewed from above, the optical path of the light emitted from the light emitting element 14.14' toward the light receiving element 15.15' is the main part 9a, 10a of the detection pin 9.10.
It is arranged so that it brushes against the outer peripheral surface of.

Also, the light shielding portion 9b of the detection pin 9.10.

The height of the detection pins 9 and 10b is determined at the position where these detection pins 9 and 10 are placed on the upper surface 7a of the test substrate 7 (hereinafter referred to as the "non-push-up position") like the pressure detection pins 10 shown in FIG. ), the height is such that it can block the above optical path.

Therefore, when the detection pin 9.10 is in the non-push-up position, the light emitted from the light emitting element 14.14' is prevented from being received by the light receiving element 15.15'.
．． 10 is pushed up so that its light shielding parts 9b and 10b are above the optical path, the light emitted from the light emitting element 14.14' can be received by the light receiving element 15.15'.

Note that the distance between the upper surface 7a of the test board 7 and the optical path is determined by the leads 3a, 3b, 3c, and 3c of the semi-fixed capacitor 3.4.
Of 4a, 4b, and 4c, the distance is slightly shorter than the length that would protrude from the lead insertion hole if insertion into the lead insertion hole was performed correctly.

16 is a detection circuit including the photodetectors 11 and 12.

17 is a light receiving element 15.15 via an amplifier 18.18'.
' and the OR circuits are connected separately to each other, and its output terminal connects the alarm circuit 19 for buzzer sounding and the printed circuit board 2 to the lead insertion state detector I, ! It is connected to a transfer control circuit 20 that controls an eight-feeding mechanism (not shown) that transfers the light to the lower part of the light emitting element 14, 14'. When a signal is output when the light from the light receiving element 15, 15' is not received, a signal is output from the OR circuit 17,
When this pressure is present, the buzzer sounds and the transfer mechanism stops working.

(Detection of insertion state of b-3, 1, J-card) [Fig. 1] After the printed circuit board 2 has been loaded with the semi-fixed capacitors 3, 4, and other electronic components, as shown in Fig. 1. As shown, the lead protruding surfaces 2a, that is, the leads 3a, 3b,
3c, 4a.

4b, 4c with their protruding tips facing upward, and are transported to a position to be inspected below the lead insertion state detection mechanism 1 by a transport mechanism (not shown), and to a position (not shown). The alignment mechanism aligns the printed circuit board 2 and the test board 7.

Therefore, when the printed circuit board 2 comes to the position to be inspected, the lead insertion hole 5C into which the lead 3C of the semi-fixed capacitor 3 should be inserted is inserted into the detection pin 9, and the lead 4c of the semi-fixed capacitor 4 is inserted into the lead insertion hole 5C. Lead insertion hole 6 to be
C are opposed to the detection pins 10 from below.

In addition, the lead insertion state detection mechanism 1 also has a test board 7.
is supported by an elevator mechanism (not shown), and in the initial state, it is placed on standby at a standby position slightly above the inspection position, and when the printed circuit board 2 is transported to the inspection position, it is moved downward. He worked 9 shifts for the N5
fJl is the detection position shown in FIG.
This is done until the distance between the detection pins 9 and the printed circuit board 2 is approximately the same length as the length of the detection pins 9 and 10 protruding downward from the test board 7 when they are in the non-push-up position. As a result, the insertion state of the lead 3C of the semi-fixed capacitor 3 and the lead 4c of the semi-fixed capacitor 4 is detected.

For example, when the lead 3C shown in FIG. 1 is correctly inserted into the lead insertion hole 5C, when the lead insertion state detection mechanism 1 comes a little short of the detection position, the lead 3c The detection pin 9 corresponding to the above is placed on the tip of the lead 3c, and the lead insertion state detection mechanism 1 is moved upward relative to the open light detector 11 moving to the detection position, so that the light shielding portion 9b is It will be removed from the optical path of the light heading from the light emitting element 14 to the light receiving element 15,
Thereby, the light is received by the light receiving element 15. Furthermore, when the lead 4C shown in FIG. 1 is not inserted into the lead insertion hole 6C, the detection pin 10 corresponding to the lead 4C is blocked from light even if the lead insertion state detection mechanism 1 moves to the detection position. Since the light from the light emitting element 14' to the light receiving element 15' is not pushed upward relative to the part 12 and remains in the non-pushed position, the light directed from the light emitting element 14' to the light receiving element 15' is blocked by the light shielding part i o b. It will be blocked.

If either of the leads 3C and 40 to be inspected is not inserted into the lead insertion hole, a signal is output from the OR circuit 17, and as a result of twisting,
At the same time as the buzzer sounds, the operation of the transfer mechanism for transferring the printed circuit board 2 to the position to be inspected is stopped.

Note that the lead insertion state detection mechanism 1 has been moved to the detection position.
is returned to the standby position after a predetermined period of time, for example, several seconds, and as a result, the detection pin, which had been pushed up to the side, returns to the non-pushed position due to its own weight.

In addition, if both leads 3c and 4c are inserted into the lead insertion holes, the printed circuit board 2 that has been inspected
As the printed circuit board 2 is transferred from the position to be inspected, the next printed circuit board 2 is transferred to the position to be inspected.

(F-2, Second Embodiment) [Figs. 6 to 8] Figs. 6 to 8 show a second embodiment IA of the reed insertion state detection mechanism of the present invention.

The lead insertion state detection mechanism IA shown in this second embodiment is an electronic component 5 in which a large number of leads are arranged linearly in two rows.
For example, it is used to detect the insertion state of a lead in a connector.

(a, Circuit Board) [FIGS. 6 to 8] A connector 21 and other electronic components (not shown) are mounted on the printed circuit board 2A.

22 is the main body of the connector 21, and 23, 23, . . . are its leads, and the upper ends of these leads 23, 23, . . . project into pin insertion holes (not shown) formed in the main body 22. The remaining portion protrudes from the lower surface of the main body portion 22, and is arranged in two rows with four wires in each row lined up at a constant pitch in the linear direction. Look, one row of leads 23a,
23b, 23c, 23ci and the other row of leads 23e,
23f, 23g, and 23h are arranged alternately.

And, such a connector 21 has leads 23, 23,
are inserted into the lead insertion holes 24, 24, . . . formed in the printed circuit board 2A, and the leads 23, 23, . 23h located at the other end of the other row is held on the printed circuit board 2 by being bent.

(b. Lead insertion state detection mechanism) [Figs. 6 and 7] The lead insertion state detection mechanism IA includes the inspection board 7, the detection pins 9 and 10, and the photodetector 11 shown in the first embodiment.
．． It consists of a test board having the same structure or function as No. 12, six detection pins, one photodetector, etc.

(b-1, structure) 25 is a board for inspection, and among the eight sword insertion holes 24, 24, . Detection pin insertion holes 26, 26, . . . are formed at positions corresponding to the six lead insertion holes 24, 24, . . . , and six lead insertion holes 26, 26, . Main part 27a127a1 of pressure detection pin 27.27,...
... are inserted so as to be able to freely slide in the axial direction, and the main portion 27 a is inserted into the upper end of these pressure detection pins 27, 27, ...
, 27a, . . . Larger diameter light shielding portions 27b, 2
7b1... is formed.

Therefore, these detection pins 27, 27, . . . are 3 in one row.
The detection pins 27.27.27. of one row and the detection pins 27.27.27.
27 are arranged alternately.

The thickness of the light shielding parts 27b, 27b, .
A part of the light shielding parts 27b, 27b, 27b and the light shielding parts 27b, 27b, 27 of the detection pins 27.27.27 in the other row
The thickness is such that it overlaps a part of b.

Reference numeral 28 denotes a photodetector fixed to the upper surface of the inspection substrate 25, and a light emitting element 30 and a light receiving element 31 are provided in opposite sides of the base part 29, which is approximately U-shaped when viewed from above, so as to face each other. When viewed from above, the optical path of light from the light emitting element 3o to the light receiving element 31 is the detection pin 27, 27, . . .
The light shielding portions 27b, 27b, . . . are arranged so as to extend through the mutually overlapping portions.

Note that the light receiving element 31 is connected to a detection circuit (not shown) having the same function as the detection circuit 16 described above.

(b-2, Pressure Testing in Lead Insertion State) Then, when the printed circuit board 2A is transferred to the position to be inspected below the lead insertion state detection mechanism IA, the lead insertion state detection mechanism IA is lowered, and, Connector 2
1 of 6 tree leads 23 b, 23 c, 23 d,
23e, 23f, 23g are lead insertion holes 24.24,・
If it is correctly inserted into..., the detection pin 27.27,...
... are pushed up by the leads 23, 23, ... and the light shielding portions 27b, 27b, ... escape above the optical path of the light from the light emitting element 30 to the light receiving element 31, so that the light is transmitted to the light receiving element. 31, and when not one of the six leads 23, 23, . . . has been inserted through the lead insertion holes 24, 24, . . . The third lead 23c counted from the side is shown bent without being inserted into the lead insertion hole 24. ), since the detection pin 27 corresponding to the lead remains in the non-push-up position, the light path is blocked by the light shielding portion 27b of the detection pin 27, so that the light receiving element 31 does not receive light. become.

(G. Effects of the Invention) As is clear from the above description, the lead insertion state detection mechanism of the present invention includes a photodetector in which a light emitting part and a light receiving part are provided facing each other, and a lead on a circuit board. a detection pin that is positioned corresponding to the insertion hole, is slidably supported in the axial direction of the lead insertion hole, and has a light blocking portion that blocks light directed from the light emitting portion to the light receiving portion of the photodetector; Converts whether or not the lead of the electronic component is inserted into the circuit board glue insertion hole into the displacement in the axial direction of the detection pin corresponding to the presence or absence of contact between the lead and the detection pin, and blocks light by the detection pin. It is characterized in that it can be detected as an output signal of a photodetector corresponding to the presence or absence of.

Therefore, the lead insertion state detection mechanism of the present invention can detect whether or not the leads of an electronic component are inserted into the circuit board glue insertion holes, regardless of the number or arrangement of the leads.
Each individual component can be detected as an electrical signal, and as a result, a circuit board on which electronic components have been mounted can be inspected quickly and without any omissions. The types of electronic components, the number and arrangement form of their leads, and the number and arrangement form of corresponding detection pins shown in the examples are merely examples of implementing the present invention. Electronic components and the like to be inspected by the lead insertion state detection mechanism to which the present invention can be applied are not limited to these.

[Brief explanation of drawings]

1 to 5 show a first practical example of the lead insertion state detection mechanism of the present invention. FIG. 3 is a partially cutaway perspective view of the main parts; FIG. 4 is a block diagram of the detection circuit;
FIG. 5 is a perspective view of essential parts showing an example of a circuit board, and FIGS. 6 to 8 show a second embodiment of the lead insertion state detection mechanism of the present invention. FIG. FIG. 7 is a plan view of the main part showing the state where the circuit board is located below, and FIG. 8 is a perspective view of the main part showing an example of the circuit board.・ ・ ・Lead, ...Lead insertion hole, ...Detection pin, b...Light shielding part, ...Photodetector, '...Emitting part, '...Light receiving part, Lead insertion state detection mechanism , circuit board, 21... electronic component, 23c, 23cl, 23e, 23f.・Lead, lead insertion hole, detection pin, 27b...light shielding part, photodetector, 30...light emitting part, light receiving part 3c, 4c 5c, 6c 9, 10 ・ 9b, 10 11, 12 14, 14 15 , 15 1 A ・ ・ 2 A ・ ・ 23b , 23 g ・ ・ 24 ・ ・ 27 ・ ・ ・ 28 ・ ・ ・ 31 ・ ・ Explanation of symbols 1...Lead insertion state detection mechanism,

Claims (1)

[Claims] A photodetector in which a light emitting part and a light receiving part are provided facing each other, and a photodetector that is positioned corresponding to a lead insertion hole of a circuit board and is slidable in the axial direction of the lead insertion hole. A detection pin is supported by the detector and has a light shielding part that blocks light from the light emitting part to the light receiving part of the photodetector. This is converted into a displacement in the axial direction of the detection pin corresponding to the presence or absence of contact with the detection pin, and can be detected as an output signal of the photodetector corresponding to the presence or absence of light blocking by the detection pin. Features a lead insertion state detection mechanism.