JPH04223354A - Lead bend check device for ic device - Google Patents

Abstract

PURPOSE:To enable leads to be surely and accurately detected in bend by a method wherein a detector is mounted on one end of a swing lever, a swing supporting point is provided to a point of the swing lever biased toward the link section of a cover member from the intermediate point of the lever concerned, and the position of the detector is detected when the cover member is brought into contact with the lead of an IC device. CONSTITUTION:A position detective means formed of an air sensor 20 is required to be improved in distance resolution so as to accurately detect the bend of leads. Therefore, a detector 6 is provided with a mechanism which enables it to be enhanced in movement of displacement when a cover member 2 is brought into contact with an IC device D. That is, a swing supporting point 8 is provided to a point of a swing lever 5 biased toward its end linked to the cover member 2. For instance, the distance between the cover member 2 and the swing supporting point 8 is set half that between the swing supporting point 8 and the detector 6. By this setup, the detector 6 is moved twice as much as the quantity of displacement of the cover member 2.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC device lead bending inspection apparatus for detecting the presence or absence of bends in the leads of an IC device (integrated circuit element).

0002

2. Description of the Related Art As is well known, an IC device is constructed by providing a package portion with a large number of leads. This IC device is mounted on a board on which a wiring pattern is formed, and depending on the method of mounting on this board, there are two types: a pin insertion type and a surface mounting type. A typical pin insertion type device is a DIP type device, and there are also PGA type devices and the like. In this pin insertion type device, the leads of the device are inserted into through holes drilled in the substrate. In addition, surface mounting type devices include SOP type, SOJ type, PLCC type, L
There are various types of devices such as CC type and QFP type, all of which have leads soldered to wiring patterns formed on a substrate. In recent years, due to the demand for more compact device-mounted substrates, many surface-mounting type devices have come into use, and the number of types of devices has also been increasing depending on their uses.

By the way, when mounting the various devices mentioned above on a board, the leads of the devices must be in a predetermined state, and the leads may be bent in a manner different from the normal state. Then, it becomes impossible to mount it on the board. For example, in a pin-insertion type device, if the pins of the device are bent inward or outward, or bent in the left-right direction, the leads cannot be inserted into the through-holes of the board. Furthermore, in the case of a surface mounting type, the leads are no longer connected to the wiring on the board. In particular, in surface-mount type devices, some of the leads are lifted off the board, and although the solder is interposed between the leads and the wiring pattern on the board, it is not electrically effective. There may be cases where it is connected. This is a soldering defect, and it is impossible to detect this soldering defect by an electrical continuity test or the like, and it is also difficult to detect by visual inspection. Therefore, the device is installed in a predetermined device such as a computer and shipped, assuming that the device is installed in a normal state. Then, while the device is actually operating, there is a risk that the aforementioned defective solder portions will peel off due to the effects of heat, vibration, etc., which poses a very serious problem. For this reason, before the device is mounted, it is necessary to check whether the leads of the device are in a normal state.

0004

[Problem to be solved by the invention] In the prior art,
Various methods have been proposed as this type of lead bending inspection method. A typical example of these methods is one that uses optical means to inspect lead bending. For example, the distance and reflection angle between the sensor and the lead can be measured by emitting a laser beam or the like toward the lead and receiving the reflected light. Lead bending inspection devices that use manual methods are not only expensive, but also can cause malfunctions depending on the surface condition of the leads, such as the gloss of the solder coated on the surface, leading to false alarms. There are also problems in terms of reliability, such as a high rate. In addition, a device in which lead bending is inspected using a mechanical method has also been proposed. For example, some devices are configured so that device leads are inserted through a test plate that has holes into which the leads are inserted. However, this method can only be used for pin insertion type devices such as DIP type devices, and SOJ type and P type devices with leads curved in a J shape.
LCC type devices and SOPs with L-shaped leads
It is not possible to inspect surface mounting type devices such as type and QFP type devices.

[0005] In view of the above, currently, inspection of lead bending of devices, especially inspection of surface mounting type devices, is performed visually. In particular, in recent years, the number of leads in IC devices has tended to increase, making it extremely difficult to visually inspect lead bends, resulting in problems such as poor efficiency and poor inspection accuracy. There is.

The present invention has been made in view of the above points, and its object is to provide a lead for an IC device that can be reliably tested regardless of the type of device with a simple configuration. An object of the present invention is to provide a bending inspection device.

[0007]

[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention provides recesses at positions corresponding to the respective leads provided in an IC device, and provides a state in which the leads are accommodated in each of the recesses. It has a base member for positioning an IC device, and a cover member that can be moved toward and away from the base member to approach and separate from the root portion of the lead in the IC device, and a swing lever is attached to the cover member. One end of the swing lever is connected to the other end of the swing lever, and a detection body is attached to the other end of the swing lever. The present invention is characterized in that the presence or absence of a bend in the lead of the IC device is detected by detecting the position of the detection body by a position detection means when the detection body is brought into contact with the lead of the IC device. .

[0008]

[Function] In IC devices, whether it is a pin insertion type or a surface mounting type, the leads are not in a normal state, and the leads are not in a normal state, and the leads are not in a normal condition, and the leads are not in a normal state. If it is bent, it will not fit into the recess in the base member, or even if it does, it will
The height position will be different from the normal one. That is, when an IC device is placed on the base member, this I
The height position of the base of the lead differs depending on whether the lead of the C device is normal or abnormal. Therefore,
By bringing a cover member into contact with the base of the lead and detecting the height position of the cover member, lead bending can be inspected. However, the difference in height between normal and abnormal leads is not very large. Therefore, instead of directly measuring the height position of the cover member, a swing lever is used to amplify this height displacement amount. This makes it possible to accurately detect the presence or absence of lead bending without increasing the distance resolution of the position detection means. Therefore, lead bending can be inspected using an inexpensive device with a relatively simple structure, such as an air sensor. Moreover, if too much load is applied when the cover member is brought into contact with the leads of the IC device, the leads may be bent by this load. In order to prevent this, a mechanism is provided to balance the weight of the cover member. As this balancer mechanism, in the swing lever,
It may be provided on the side closer to the connecting portion to the detection body than the swing fulcrum.

[0009]

Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIGS. 1 and 2 show the basic configuration of a lead bending inspection device. In the figure, 1 is a base member and 2 is a cover member. The base member 1 is for positioning the IC device D, and is fixedly installed on the base 3. And, on the upper surface of this base member 1, I
A recess 1a is formed to accommodate the lead L led out from the side of the package P in the C device D. On the other hand, the cover member 2 includes a guide rod 4 erected on the base 3,
4, and lead contacts 2a, 2a that can come into contact with the bases of the leads L of the IC device D installed on the base member 1 are vertically provided on the lower surface thereof. Reference numeral 5 denotes a swing lever, one end of which is connected to the cover member 2, and the other end connected to a detection body 6. The swing lever 5 is capable of swinging about a swing fulcrum 8 provided on the support member 7 at a position close to the connecting portion from the middle portion of the swing lever 5 to the cover member 2 . Here, the cover member 2 is connected to the guide rod 4 as described above.
The detection body 6 is configured to be vertically displaced along a guide rod 9, and the detection body 6 can be moved up and down along a guide rod 9. On the other hand, since the swing lever 5 swings around the swing fulcrum 8, rollers 10a and 10b are attached to both ends of the swing lever 3.
These rollers 10a and 10b are engaged with roller receivers 11 and 12 provided on the cover member 2 and the detection body 4, and by swinging the swing lever 3, the cover member 2 and the detection body 6 are moved. It can be moved up and down.

[0011] By swinging the swing lever 3, the cover member 2
Package part P of lead L in IC device D in which lead contacts 2a, 2a of
A pushing means 13 is provided in order to move the base portion, which is led out from the base portion, toward and away from the base portion. This pushing means 13 has a cylinder as a driving means, and this cylinder 14 is attached to a fixed block 15, and its piston rod 14 is attached to a fixed block 15.
A pusher 16 is connected to the tip portion of a. This pusher 16 is inserted through an actuating part 17 pivotally connected to the swing lever 3, and a spring 18 is interposed between the pusher 16 and the actuating part 17. Therefore, when the cylinder 14 is operated to extend the piston rod 14a, the spring 18 interposed between the pusher 16 and the pushing member 17 is bent, and the spring force generated at this time causes the swing lever 3 to move. The cover member 2 is pushed down, and the lead contacts 2a vertically disposed on the bottom surface of the cover member 2 come into contact with the bases of the leads L of the IC device D placed on the base member 1. . However, in order to prevent excessive force from acting on the lead L at this time, as described above, the force of the cylinder 14 is not applied directly to the lead L, but the force of the spring 18 is used to press the lead L, thereby reducing the impact. is maintained so that it is not added. In addition, in order to adjust the load on this lead L, a swing lever 5
A balancer 19 made of a weight having a predetermined weight is attached to the side closer to the detection body 6 than the swing fulcrum 8 of the balancer 19 . This balancer 19 allows the cover member 2 to be brought into contact with the IC device D reliably with a light force of, for example, about 10 g. Thereby, there is no risk that this lead L will be bent during the lead bending inspection. In addition, when the balancer 19 contracts the cylinder 14 and releases the force acting on the swing lever 5 of the spring 18, the cover member 2 is moved to the IC due to its weight.
It also functions as a return means for displacing the swing lever 5 in the direction away from the device D.

As described above, when the lead contact 2a of the cover member 2 is brought into contact with the lead L of the IC device D, the presence or absence of lead bending is detected by detecting the position of the detection body 6. It is something to do. For this purpose, an air sensor 20 is provided to face the detection object 6, and the distance between the detection head 20a of the air sensor 20 and the detection object 6 is measured. here,
The air sensor 20 is connected to an air source 2 as shown in FIG.
The flow path of pressurized air supplied from 1 is divided into a reference flow path 22 and a detection flow path 23, and a nozzle 24 for opening to the atmosphere is provided at the tip of these reference flow path 22 and detection flow path 23. and a nozzle 25 facing the detection body 6, and fixed orifices 26 and 27 are provided in the middle of these, respectively. And these fixed orifices 26,2
A communication passage 28 is interposed between the nozzle 7 and the nozzles 24 and 25 to allow the flow passages 22 and 23 to communicate with each other. A pressure detection chamber 29 is provided in this communication path 28, and this pressure detection chamber 2
By arranging the magnetic float 30 in the upper and lower parts 9, the pressure detection chamber 29 is divided into two upper and lower compartments 2.
It is divided into sections 9a and 29b. Therefore, the pressure in the reference channel 22 is introduced into the upper section 29a, and the pressure in the detection channel 23 is introduced into the lower section 29b. Further, the reference flow path 22 is provided with a variable orifice 31 near the nozzle 24 thereof.

[0013] Thus, the nozzle 2 used for detection
When the nozzle 5 is opposed to the detection body 6, the back pressure in the flow path 23 changes depending on the distance between the nozzle 25 and the detection body 6. That is, when the lead L of the IC device D is in an abnormal state, the distance between the detection body 6 and the nozzle 25 is larger than the distance when it is in a normal state, and as a result, the back pressure is reduced and the detection The pressure in the water passage 23 and the lower section 29b does not rise to a predetermined value. On the other hand, since the variable orifice 31 is interposed in the reference flow path 22, a pressure corresponding to the amount of restriction of the variable orifice 31 is generated in the reference flow path 22 and the upper section 29a. Therefore, by adjusting the amount of restriction of the variable orifice 31, the pressure generated in the reference flow path 22 can be reduced to reduce the back pressure generated in the detection flow path 23 when the lead L of the IC device D is in a normal state. Set the pressure so that it is approximately the same as the pressure or slightly lower. As a result, if the lead L of the IC device D is bent, the pressure in the detection channel 23 will be lower than the pressure in the reference channel 22, so the magnetic float disposed in the pressure detection chamber 29 30 is held in a lowered state. On the other hand, when there is no lead bend L, the pressure in the detection flow path 23 becomes higher than the pressure in the reference flow path 23, and the pressure in the lower section 29a of the pressure detection chamber 29 is higher than that in the reference flow path 23. becomes higher than the pressure in the upper section 29b, causing the magnetic float 30 to rise. Therefore, by detecting the displacement of the position of the magnetic float 30, it is possible to detect whether or not the lead is bent.

By the way, in order to improve the accuracy of detecting lead bending, it is necessary to improve the position detection ability, that is, the distance resolution, of the position detection means consisting of the air sensor 20. For this reason, in this lead bending inspection device, when the cover member 2 is brought into contact with the IC device D, the detection body 6 is provided with a mechanism for amplifying the amount of movement thereof and displacing it. That is, the swing fulcrum 8 of the swing lever 5 is not provided in the middle portion thereof, but is provided at a position biased towards the connection side to the cover member 2. for example,
The distance from the swing fulcrum 8 to the detection body 6 is set to be twice the distance from the cover member 2 to the swing fulcrum 8. As a result, the detection body 6 moves by an amount twice the amount of displacement of the cover member 2.

By the way, when inspecting for lead bending, even if the IC devices D to be inspected are of the same type, there may be differences in the position and size of the leads L due to differences in manufacturer, etc. be. Therefore, the equipment must be changed accordingly. In particular, when an IC device whose leads are in a normal state is placed on the base member 1, it is necessary to reliably accommodate the leads in the recess 1a. Therefore, the position and shape of the recess 1a must be changed. Therefore, in order to be able to easily change the setup of this base member, it may be configured as shown in FIG. 4, for example. As is clear from the figure, the base member 100 has a base portion 101 and a recess forming piece 102, and the recess forming piece 102 corresponds to the lead of the IC device to be inspected in its longitudinal direction. A groove portion 102a is formed. The recess forming piece 102 is sandwiched between the pair of wall members 103 and 104, and is fixed on the base 101 by means of fixing means such as bolts with a spacer member 105 interposed in the center. It has become so. Furthermore, the four corner portions of the spacer member 105 are provided with locking pieces 10.
6 on the base portion 101. As a result, the recess forming piece 10
Groove portion 102a and wall members 103 and 104 in 2
Thus, a recessed portion for accommodating the lead is formed. Therefore, the recess forming piece 102 may be replaced, or the spacer member 10 may be replaced together with the recess forming piece 102.
5 or when the type of IC device changes by replacing the wall members 103 and 104,
Setup can be changed without replacing the entire base member.

The lead bending inspection device according to the present invention is constructed as described above, and will be described below. A method for inspecting lead bending of various IC devices will be described.

First, a base member 21 and a cover member 22 used for inspecting lead bending of a DIP type IC device are shown in FIG. 5 together with a DIP type device D1.
Shown below. As is clear from this figure, the device D1 has a large number of leads L1 from both left and right sides of the package portion P1.
The lead L1 of this device D1 is mounted by being inserted into a through hole provided in an electronic circuit board.

In order to inspect lead bending of this type of device D1, a base member 51 and a cover member 52 shown in FIGS. 6 and 7 are used. Recesses 51a are formed in the base member 51 so as to correspond to the number and position of the leads L1 of the device D1. Here, the recess 51a
One width x1 is within the range of positional deviation error in the direction in which the leads L1 are lined up, that is, in the direction of the plate surface. Further, the other width y1 is in the direction perpendicular to the arrangement of the leads L1,
That is, it is within the range of positional deviation error in the plate thickness direction. Further, the depth z1 is shorter than the length from the bottom surface of the package portion P1 to the lower end of the lead L1. On the other hand, a pair of left and right protrusions 52a, 52a are vertically provided on the cover member 52 as lead contacts that come into contact with the root portion of the lead L1 of the device D1 extending from the package portion P1.

With this configuration, when the device D1 is placed on the base member 51, each lead L
1 are in a normal state, they are housed in corresponding recesses 51a formed in this base member 51, and each of these leads L1 descends to a position where it abuts the bottom surface of this recess 51a. . However, if one lead L1' among the leads L1 is bent in the left-right direction beyond the permissible limit, it may not fit into the recess 51a, or it may come into contact with the side wall and float from the bottom wall. Become. For this reason, as shown in FIG. 8, the height of the portion of the lead L1' that the protrusion 52a of the cover member 52 abuts becomes higher. Also, one lead L1″
If it is bent in the front-back direction beyond the allowable limit,
This lead L1'' deviates from the recess 51a, or as shown in FIG. 9, it comes into contact with the side wall and does not reach the bottom wall. The portion where the strip 52a comes into contact becomes higher. Therefore, by placing the IC device D1 on the base member 1 and operating the swing lever 5, the cover member 2
By lowering the IC and bringing the protrusion 52a into contact with the base of the lead L1, the air sensor 20 detects how much the detection body 6 rises.
It is possible to accurately and reliably inspect the presence or absence of bends in the leads of the device D1.

Next, a case will be described in which lead bending of an SOJ type IC device is inspected. First, Figure 10
This SOJ type device D2 is shown in FIG. As is clear from this figure, the device D2 has a large number of leads L2 bent inward from both left and right sides of the package part P2 in a J-shape, and these leads L2 are formed on the surface of the electronic circuit board. It is mounted by soldering to the wiring pattern formed on the board. This type of device D2
11 and 12 to inspect lead bending.
The base member 61 and cover member 62 shown in FIG. The base member 61 has a lead L of the device D2.
Similar to the base member 51, the recesses 61a are formed to correspond to the number and position of the recesses 61a, and the width x2 of one side of the recesses 61a is within the range of positional deviation error in the direction in which the leads L2 are lined up. be. However, the other width y2
is a dimension that is maintained in a non-contact state with the edge portions on both sides defining the width y2 when the lead L2 is bent in a normal state. Further, the depth z2 is shorter than the length from the bottom surface of the package part P2 to the lowest end of the lead L2 bent in a J-shape, so that when the device D2 is installed on the base member 61, the package The portion P2 is in a state separated from the base member 61. On the other hand, the cover member 62 is
A pair of left and right protrusions 62a, 62a are provided as lead contacts that can come into contact with the root portion of the lead L2 of the device D2 extending from the package portion P2.

With the above configuration, if each lead L2 is in a normal state when the device D2 is placed on the base member 61, each lead L2 will be placed at the lowest end of the curved portion. is housed in contact with the bottom surface of the recess 61a. On the other hand, if even one of the leads L2 is bent in the left-right direction beyond the permissible limit, it will not completely fit into the recess 61a, and as explained for the DIP type, the cover member 62 will not be bent. The height of the portion where the strip 62a comes into contact becomes higher. Furthermore, if the curvature of the curved portion of one lead L2' is too small, as shown in FIG. Become. On the other hand, as shown in FIG.
If the curvature of the curved portion of the lead L2'' is too large, compared to the lead L2 which is in a normal curved state, a recess 6
The dimension up to the lowest end in contact with the bottom surface of 1a becomes larger. Therefore, the height position of the cover member 62 at this time is amplified by the swing lever 5 to displace the detection body 6,
By detecting the height position of the detection body 6 with the air sensor 20, it is detected whether the lead L2 of the device D2 is bent beyond the permissible range.

Furthermore, FIG. 15 shows an SOP type IC device D3. As is clear from the figure, the device D3 has a large number of leads L from both left and right sides of the package portion P3.
3 extends downward and bends horizontally outward from a midway position to form an L-shape. This device D3 is mounted by bringing the horizontal portions of the leads L3 into contact with a wiring pattern formed on the surface of an electronic circuit board and soldering.

In order to inspect lead bending of this type of device D3, the base member 71 and cover member 72 shown in FIGS. 16 and 17 are used. A recess 71a is formed to correspond to the position and the width x of one side of the recess 71a.
3 is similar to the base member 51 in that it is within the range of positional deviation error in the direction in which the leads L3 are lined up. However, the other width y3 has a dimension that is longer than the length of the horizontal portion of the lead L3 by the allowable error thereof. Furthermore, the depth z3 is such that the horizontal portion of the lead L3 is in the recess 71a.
The package part P3 has a depth z3 at which it is separated from the base member 71 when it comes into contact with the bottom surface of the base member 71. On the other hand, the cover member 72 is adapted to come into contact with the horizontal portion of the lead L3 of the device D3 housed in each recess 71a, and therefore, the cover member 72 has this lead L3 as a lead contact. A number of protrusions 72a corresponding to the number of protrusions 72a are vertically arranged in a comb shape.

With this configuration, when the device D3 is placed on the base member 71, each lead L
3 is in a normal state, the horizontally bent portion of each lead L3 is accommodated in a state in contact with the bottom surface of the recess 71a. On the other hand, if even one of the leads L3 is bent in the left-right direction beyond the allowable limit, the recess 61a
As explained for the DIP type, the height of the portion of the cover member 72 that the protrusion 72a abuts becomes higher. Furthermore, if the horizontal portion of one lead L3' rises toward the tip, as shown in FIG. The position is higher than L3. On the other hand, Figure 1
As shown in 9, even if the tip of the horizontal portion of one lead L3'' falls down, the protrusion 72a will come into contact with it at a higher position than the lead L3, similar to the lead L3'. Therefore, the protrusion 72 provided on the cover member 72
When the lead L3 is brought into contact with the lead L3, the height of the cover member 72 will be higher, so by detecting this,
A bend in the lead L3 of the device D2 is detected.

With the above configuration, it is possible to apply not only pin insertion type DIP type IC devices but also SOJ type and PLCC type devices with leads curved in a J-shape, and SOP type devices with L-shaped leads. It is possible to very accurately inspect lead bending of surface-mount type devices such as 3D and QFP type devices. Furthermore, lead bending is detected by amplifying the amount of displacement of the cover member 2 by the swing lever 5 and transmitting it to the detection body 6, and detecting the height position of the detection body 6 with the displacement amount amplified in this way. This allows the air sensor 20 to accurately and reliably detect the presence or absence of lead bending.

[0026]

As explained above, the present invention detects bending of the leads by positioning the IC device on the base member and bringing the cover member into contact with the base portion of the leads in the IC device. There was no such thing,
In addition, one end of a swing lever is connected to the cover member, a detection body is attached to the other end of the swing lever, and a swing fulcrum is provided at a position closer to the connection part to the cover member than the intermediate part thereof. , when this cover member is brought into contact with the lead of the IC device, the bending of the lead of the IC device is detected by detecting the position of the detection object by the position detecting means. Regardless of the type of device, especially surface mounting type devices that are difficult to detect, such as SOJ type and PLCC type devices with leads curved in a J-shape, SOP type and QFP type devices with L-shaped leads. Even if it is a type of device,
It is now possible to inspect lead bending reliably and with extremely high precision, significantly reducing the false alarm rate, and furthermore, it is possible to amplify the displacement of the detection object relative to the displacement of the cover member. As a result, lead bending can be detected extremely reliably and accurately using a detection means with a simple configuration.

[Brief explanation of the drawing]

FIG. 1 is an overall configuration diagram of a lead bending inspection device.

FIG. 2 is a right side view of FIG. 1.

FIG. 3 is a circuit diagram of an air sensor.

FIG. 4 is an exploded perspective view of the base member.

FIG. 5 is an external view showing a base member and a cover member used for inspecting lead bending of a DIP type IC device together with the IC device.

FIG. 6 is a longitudinal cross-sectional view showing a state in which an IC device is sandwiched between a base member and a cover member.

FIG. 7 is a cross-sectional view showing a state in which an IC device is sandwiched between a base member and a cover member.

FIG. 8 is an explanatory diagram showing a detection state of lead bending.

FIG. 9 is an explanatory diagram showing another detection state of lead bending.

FIG. 10 is an external view showing a base member and a cover member used for inspecting lead bending of an SOJ type IC device together with the IC device.

FIG. 11 is a longitudinal sectional view showing a state in which an IC device is sandwiched between a base member and a cover member.

FIG. 12 is a cross-sectional view showing a state in which an IC device is sandwiched between a base member and a cover member.

FIG. 13 is an explanatory diagram showing a detection state of lead bending.

FIG. 14 is an explanatory diagram showing another detection state of lead bending.

FIG. 15 is an external view showing a base member and a cover member used for inspecting lead bending of an SOP type IC device together with the IC device.

FIG. 16 is a longitudinal sectional view showing a state in which an IC device is sandwiched between a base member and a cover member.

FIG. 17 is a cross-sectional view showing a state in which an IC device is sandwiched between a base member and a cover member.

FIG. 18 is an explanatory diagram showing a state of detection of lead bending.

FIG. 19 is an explanatory diagram showing another detection state of lead bending.

[Explanation of symbols]

1 Base member 1a Recessed part 2 Cover member 2a Lead contact 5 Swing lever 6 Detection object 8 Swinging fulcrum 13 Pushing means 19 Balancer 20 Air sensor 20a Detection head 51 Base member 52 Cover member 61 Base member 62 Cover member 71 Base member 72 Cover member

Claims (3)

[Claims] Claims: 1. A base member having recesses at positions corresponding to the respective leads provided on the IC device, and positioning the IC device with the leads accommodated in the recesses; and a base member proximate to the base member. - It has a cover member that can be moved away from the base of the lead in the IC device, and one end of the swing lever is connected to the cover member, and the other end of the swing lever is connected to the cover member. At the same time as attaching the detecting body, a swinging fulcrum is provided at a position biased toward the connecting portion to the cover member from the intermediate portion thereof, and when the cover member is brought into contact with the lead of the IC device, the detecting body 1. A lead bending inspection apparatus for an IC device, characterized in that the presence or absence of lead bending of the IC device is detected by detecting the position of the IC device with a position detecting means. 2. The lead bending inspection device according to claim 1, wherein said position detecting means comprises an air sensor. 3. The lead bending inspection device according to claim 1, further comprising a structure in which a weight body serving as a balancer is attached between the swinging fulcrum of the swinging lever and the detecting body.