JPH0330442A - Transfer of chip component - Google Patents

Abstract

PURPOSE:To weaken the adhesion of an adhesive sheet even if the adhesion is strong, to thrust up properly a chip component by a thrusting-up needle and to make it possible to suck correctly the component by a suction pin by a method wherein in a state that heat is applied to the sheet by a heat generation source, the thrusting-pin needle is thrusted up and the chip component is made to separate from the adhesive tape. CONSTITUTION:In a state that an adhesive sheet 2 mounted with a chip component 3 is heated with heat from a heat generation source, a thrusting-up pin 5 is moved from the lower part of the component 3 toward the upper part of the component 3 and the component 3 is made to separate from the sheet 2. For example, a thrusting-up pin 5 given heat by heaters 7 is positioned at the lower part of a chip component 3 which is transferred, heat is transmitted to a thrusting-up needle 4 as well through the pin 5 and the air between the pin 5 and an adhesive sheet 2 is also warmed by radiant heat from the heaters 7. Moreover, the adhesion of the sheet 2 is weakened by the heat and the component 3 is under a state that it is easy to peel from the sheet 2. Therefore, when the pin 5 is made to move to the upper part of the component 3, the component 3 is peeled from the sheet 2 and is correctly thrusted up as holding a horizontal state.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for transferring chip components in a chip bonding apparatus and a chip taping apparatus for forming electronic circuits.

BACKGROUND OF THE INVENTION Conventionally, this type of chip component has been transferred using a configuration as shown in FIG. 2, for example.

That is, after removing the chip component 10 from the adhesive sheet 9 by pushing up the chip component 1o on the adhesive sheet 9 attached to the frame 8 from below with the push-up pin 12 to which the push-up needle 11 is attached, The chip component 1o is suctioned and held by suction pins 13 located above the chip component 10, and the chip component is transferred to a predetermined position.

Problems to be Solved by the Invention However, with such a structure, since the adhesive sheet 9 has a strong adhesive force, when transferring the chip component 1o from the adhesive sheet 9 to the suction pin 13, there may be a transfer error or chip component failure. There was a problem that 10 pieces of damage occurred.

This is due to the following reasons.

In other words, because the adhesive force of the adhesive sheet 9 is strong, as shown in FIG. Situations occur that cannot be avoided. Therefore, the suction pin 13
Even if you try to suction the chip component 1Q with air, etc., you will not be able to suction it and will end up with a suction error.In addition, in the case shown in Figure 3, when the push-up needle 11
And the load applied to the chip component 1o is also large, and the push-up needle 1
This may cause premature wear and tear or damage to the chip component 10.

Furthermore, another reason will be explained with reference to FIG.

As shown in FIG.
In addition, when the chip component 10 is adhered to the adhesive sheet 9, there is a difference in the adhesive strength between the left and right sides of the chip component 10, so only the fabric part of the chip component 10 lifts up, and the left part is attached to the adhesive sheet. It happens that you end up stuck to 9. In this case, even if you lower the suction pin 13 and try to suction the chip component 10 with air or the like,
This resulted in the product not being able to be adsorbed in the correct conditions.

Therefore, even if the adhesive force of the adhesive sheet is strong, the present invention weakens the adhesive force so that the component can be correctly pushed up with the push-up needle and accurately attracted with the suction pin.

Means for Solving the Problems The technical means of the present invention for solving the above problems are as follows:
A heat generating source that applies heat to the adhesive sheet is provided, and a push-up needle is pushed up while the adhesive sheet is heated to separate the chip component from the adhesive tape.

For production The effect of this technical means is as follows.

In other words, since the adhesive sheet is heated by a heat generating source,
When pushing up a chip component, the adhesive strength of the tape is weakened by heat, so the chip component and the push-up needle will not be damaged during pushing up. Moreover, the chip component can be pushed up reliably.

Embodiment Hereinafter, one embodiment of the present invention will be described based on the accompanying drawings.

In FIG. 1, reference numeral 1 denotes a frame, from which an adhesive sheet 2 has been removed, and a chip component 3 is attached to the upper part of the frame. There is a push-up needle 4 below the chip component 3, which is movable up and down and is attached to a push-up pin 6 to which a heater is attached.

Further, above the chip component 3 corresponding to the push-up needle 4, there is a suction pin 6 which can be moved up and down and can be suctioned by air or the like.

Next, the operation of the configuration of this embodiment will be explained. When transferring the chip component 3, the chip component 3 to be transferred
The push-up pin 5 is heated by the heater 7 below the
is located. At this time, heat is also transferred to the push-up needle 4 via the push-up pin 6. Furthermore, the air between the push-up pin 6 and the adhesive sheet 2 is also warmed by the radiant heat from the heater 7.

Next, when the push-up pin 6 is raised, the push-up needle 4 comes into contact with the adhesive sheet 2. At this time, the adhesive force of the adhesive sheet 2 is weakened by the radiant heat transmitted through the air from the heater 7 and the heat directly applied by the push-up needles 4, and the chip component 3 and the adhesive sheet 2 are in a state of being easy to peel off. Furthermore, by moving the push-up pin 6 upward, the chip component 3 is peeled off from the adhesive sheet 2 and is pushed up accurately while maintaining a horizontal state.

After that, by lowering the suction pin e above the chip component 3, adsorbing it with air, etc., and moving the suction pin e upward,
The chip component 3 can be accurately transferred to the suction pin 6.

As a result, when pushing up the part 3, the part 3 and the pushing up needle 40
The load generated between them is reduced, and the push-up needle 4 and chip component 3 are no longer damaged or suction errors occur as in the conventional case.

Further, in this embodiment, the heater 7 as a heat generation source is provided on the push-up pin 6, but it may be provided on other parts as well.
A similar effect can be obtained if heat is transferred to.

Effects of the Invention As described above, the present invention heats the adhesive sheet when transferring chip components, so that the adhesive strength does not weaken and damage the push-up needles and chip components, and transfer errors do not occur. disappears.

[Brief explanation of drawings]

FIG. 1 is a diagram showing a method for transferring chip components according to an embodiment of the present invention, FIG. 2 is a diagram showing a conventional method for transferring chip components, and FIGS. 3 and 4 are diagrams showing a method for transferring chip components. It is a figure showing a transfer mistake at the time of transfer. 2... Adhesive sheet, 3... Chip parts, 4... Push-up needle, 6... Push-up pin, 7... Heater .

Claims (1)

[Claims] A chip characterized in that the adhesive sheet to which the chip component is attached is heated by heat from a heat generation source, and a push-up pin is moved upward from below the chip component to separate the chip component from the adhesive sheet. How to transfer parts.