JPH0239452A - Separator device for semiconductor chip - Google Patents
Separator device for semiconductor chipInfo
- Publication number
- JPH0239452A JPH0239452A JP63189363A JP18936388A JPH0239452A JP H0239452 A JPH0239452 A JP H0239452A JP 63189363 A JP63189363 A JP 63189363A JP 18936388 A JP18936388 A JP 18936388A JP H0239452 A JPH0239452 A JP H0239452A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- adhesive sheet
- heating block
- holder
- movable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 65
- 239000000853 adhesive Substances 0.000 claims abstract description 50
- 230000001070 adhesive effect Effects 0.000 claims abstract description 50
- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 230000002093 peripheral effect Effects 0.000 claims abstract description 4
- 238000000926 separation method Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は、粘着性シートの面上に貼付けられた、特に大
型の半導体チップをチップマウント工程で剥離するのに
使用して最適な半導体チップの剥離装置に関する。[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention is used to peel off a particularly large semiconductor chip stuck on the surface of an adhesive sheet in a chip mounting process. The present invention relates to an optimal semiconductor chip peeling apparatus.
（従来の技術）
一般に半導体チップは、第６図に示すように、半導体ウ
ェハ１の状態でウェハリング２に伸長された粘着性シー
ト３の上面に張付けられ、ダイシング工程で各半導体チ
ップ４に分割される。(Prior art) Generally, as shown in FIG. 6, semiconductor chips are pasted on the upper surface of an adhesive sheet 3 stretched into a wafer ring 2 in the state of a semiconductor wafer 1, and are divided into individual semiconductor chips 4 in a dicing process. be done.
そして、従来この半導体チップ４の粘着性シート３から
の剥離装置としては、一般に剥離する半導体チップの上
下に配置した吸着ノズルと上下動自在で上面に複数の突
上げピンを突設したホルダとを備え、先ずホルダを上昇
させてこの上面に備えた突上げピンで粘着性シートを突
き破って半導体チップを持ち上げ、次に吸着ノズルを真
空吸引することにより半導体チップを吸着した後、ホル
ダを下降させることにより半導体チップを粘着性シート
から剥離するようにしたものが知られている。Conventionally, this peeling device for semiconductor chips 4 from the adhesive sheet 3 generally includes a suction nozzle placed above and below the semiconductor chip to be peeled, and a holder that is movable up and down and has a plurality of push-up pins protruding from the top surface. In preparation, first raise the holder and lift the semiconductor chip by piercing the adhesive sheet with the push-up pin provided on the upper surface, then suck the semiconductor chip by vacuum suction with the suction nozzle, and then lower the holder. A device is known in which a semiconductor chip is peeled from an adhesive sheet by using the following method.
（発明が解決しようとする課題）
しかしながら、上記従来例においては、半導体チップの
大型化に伴い、半導体チップもこの接着面積に比例した
粘着性をもって粘着性シートに貼付けられているため、
粘着性シートから半導体チップを剥離する場合に、上記
突上げビンによって粘着性シートを突き破ることができ
ず、半導体チップを剥離することができない場合がある
。これを防止するため、強い力で突上げピンを押し上げ
ると、半導体チップの割れや欠は等のダメージによる不
良発生の要因となるばかりでなく、半導体チップの剥離
作業の作業性が著しく低下してしまうといった問題点が
あった。(Problem to be Solved by the Invention) However, in the above conventional example, as semiconductor chips become larger, semiconductor chips are also attached to adhesive sheets with adhesiveness proportional to the adhesive area.
When peeling a semiconductor chip from an adhesive sheet, the push-up pin may not be able to break through the adhesive sheet and the semiconductor chip may not be peeled off. To prevent this, pushing up the push-up pin with strong force not only causes defects due to damage such as cracks and chips in the semiconductor chip, but also significantly reduces the workability of peeling off the semiconductor chip. There was a problem with it getting stuck.
本発明は上記に鑑み、特に大型の半導体チップでも確実
に粘着性シートから半導体チップを剥離することができ
るものを提供することを目的とする。In view of the above, an object of the present invention is to provide a device that can reliably peel a semiconductor chip from an adhesive sheet, even if the semiconductor chip is particularly large.
（課題を解決するための手段）
上記目的を達成するため、本発明における半導体チップ
の剥離装置は、粘着性シートの面上に貼付けられた半導
体チップを剥離する剥離装置において、上下動自在で上
記粘着性シートの下方に配置したホルダの内部に、上下
動自在で上端面を剥離する半導体チップの外形より小さ
く形成するとともに、必要に応じて内部に加熱ヒータを
内蔵した加熱ブロックを上方に突出させて収容するとと
もに、上記ホルダの上端面に上記加熱ブロックの外方に
位置して上記半導体チップの周縁部に当接する突上げピ
ンを突設したものである。(Means for Solving the Problems) In order to achieve the above object, the semiconductor chip peeling device of the present invention is a peeling device that peels off a semiconductor chip stuck on the surface of an adhesive sheet, and is capable of vertically movable as described above. Inside the holder placed below the adhesive sheet, a heating block is formed that is vertically movable and smaller than the external shape of the semiconductor chip whose upper end surface is to be peeled off, and if necessary, a heating block with a built-in heater is protruded upward. At the same time, a push-up pin is provided on the upper end surface of the holder to protrude from the upper end surface of the holder so as to be located outside of the heating block and abut against the peripheral edge of the semiconductor chip.
（作 用）
上記のように構成した本発明によれば、先ず加熱ブロッ
クを上昇させて剥離すべき半導体チップの下面に接触さ
せ、この加熱ブロックにより粘着性シートを、例えば摂
氏数十塵に加熱することにより、粘着性シートの基材に
影響を与えることなくこの粘着力を低下させ、しかる後
にホルダを上昇させることにより、この上面に設けた突
上げビンにより、接着性シートを突き破り、これによっ
て例え大型であっても半導体チップを接着性シートから
確実に剥離させることができる。(Function) According to the present invention configured as described above, the heating block is first raised and brought into contact with the lower surface of the semiconductor chip to be peeled, and the adhesive sheet is heated by this heating block to, for example, several tens of degrees Celsius. By doing so, the adhesive force is reduced without affecting the base material of the adhesive sheet, and then by raising the holder, the push-up pin provided on the upper surface of the holder breaks through the adhesive sheet. Even if the semiconductor chip is large, it can be reliably peeled off from the adhesive sheet.
（実施例）
以下、本発明の一実施例を図面に基づいて詳細に説明す
る。(Example) Hereinafter, an example of the present invention will be described in detail based on the drawings.
半導体チップ４は、第６図に示すように半導体ウェハ１
の状態でウェハリング２に伸長された粘着性シート３の
上面に張付けられ、ダイシング工程で各半導体チップ４
に分割される。The semiconductor chip 4 is mounted on a semiconductor wafer 1 as shown in FIG.
In this state, each semiconductor chip 4 is pasted on the upper surface of the adhesive sheet 3 stretched on the wafer ring 2, and in the dicing process.
divided into.
そして、この各半導体チップ７を粘着性シート３から剥
離するのであるが、この剥離装置には、剥離すべき半導
体チップ７の下方に位置して円筒状のホルダ５が備えら
れている。このホルダ５の内部には、上下動自在で、上
端面の形状を半導体チップ７の外形より小さくした加熱
ブロック６がその上端を外部に露出した状態で収容され
、この加熱ブロック６の内部には、これを加熱するため
のカーソリッジタイプの加熱用ヒータ７が内蔵されてい
る。Each semiconductor chip 7 is then peeled off from the adhesive sheet 3, and this peeling device is equipped with a cylindrical holder 5 located below the semiconductor chip 7 to be peeled. Inside this holder 5, there is housed a heating block 6 which is vertically movable and whose upper end face is smaller than the external shape of the semiconductor chip 7, with its upper end exposed to the outside. , a cartridge-type heater 7 for heating this is built-in.
この加熱用ヒータ７は、温度制御電源（図示せず）に接
続されているとともに、上記加熱ブロック６には感熱素
子（図示せず）が取付けられ、これにより加熱用ヒータ
７の温度を制御して、所定温度に保持するよう構成され
ている。This heating heater 7 is connected to a temperature control power source (not shown), and a heat sensitive element (not shown) is attached to the heating block 6, thereby controlling the temperature of the heating heater 7. The temperature is maintained at a predetermined temperature.
上記加熱ブロック６は、半導体チップ４を粘着性シート
３から剥離する際に、上昇して粘着性シト３の裏面に当
接し、この粘着性シート３を加熱することにより、この
粘着性を低下させるためのものであり、この基材に影響
を与えることなく、しかも粘着性シート３の粘着力を低
下させるのに必要な、例えば摂氏数十塵に粘着性シート
３を加熱する。When the semiconductor chip 4 is peeled off from the adhesive sheet 3, the heating block 6 rises and comes into contact with the back surface of the adhesive sheet 3, and heats the adhesive sheet 3 to reduce its adhesiveness. The pressure-sensitive adhesive sheet 3 is heated to a temperature of, for example, several tens of degrees Celsius, which is necessary to reduce the adhesive strength of the pressure-sensitive adhesive sheet 3 without affecting the base material.
即ち、一般に粘着性シート３は、塩化ビニール樹脂系の
基材が多く使われており、加熱ブロック６の設定温度は
、この粘着性シート３の基材の溶融温度以下とすること
が望ましいが、加熱時間が短い条件下においては、この
溶融温度以上に加熱しても良く、要は使用する粘着性シ
ート３の種類に合うよう加熱ブロック６の加熱温度を設
定する必要がある。That is, in general, the adhesive sheet 3 is often made of a vinyl chloride resin base material, and it is desirable that the set temperature of the heating block 6 is below the melting temperature of the base material of the adhesive sheet 3. Under conditions where the heating time is short, heating may be performed above this melting temperature, and in short, it is necessary to set the heating temperature of the heating block 6 to match the type of adhesive sheet 3 to be used.
また、上記ホルダラの上端面には、上記加熱ブロック６
の外方に位置して、先端が半導体チップ４の周縁部に当
接する上記合計４本の突上げピン８が突設されている。Further, the heating block 6 is provided on the upper end surface of the holder.
A total of four push-up pins 8, whose tips abut against the peripheral edge of the semiconductor chip 4, are provided so as to protrude outwardly from the semiconductor chip 4.
この突上げピン８は、半導体チップ４の粘着性シート３
からの剥離の際に、上昇して粘着性シート３を突き破り
、半導体チップ４を持ち上げるためのものであり、この
押上げ動作は、上記加熱ブロック６と連動する駆動機構
（図示せず）によりに行われるよう構成されている。This push-up pin 8 is attached to the adhesive sheet 3 of the semiconductor chip 4.
This is to rise and break through the adhesive sheet 3 and lift the semiconductor chip 4 when it is peeled off from the substrate. is configured to take place.
更に、上記ホルダらの直上に位置して、剥離する半導体
チップ４を真空吸着するための吸着ノズル９が備えられ
ている。Furthermore, a suction nozzle 9 is provided, located directly above the holders, for vacuum suctioning the semiconductor chip 4 to be peeled off.
次に上記実施例の使用例を説明する。Next, an example of use of the above embodiment will be explained.
先ず、剥離する半導体チップ４をホルダ５の直上で吸着
ノズル９の直下に位置するよう配置する。First, the semiconductor chip 4 to be peeled is placed directly above the holder 5 and directly below the suction nozzle 9.
この状態で、粘着性シート３の粘着力を低下させる、例
えば摂氏数十塵に加熱用ヒータ７を介して加熱保持され
た加熱ブロック６を、第２図に示すように粘着性シート
３の裏面に当接させ半導体チップ４を僅かに持ち上げる
所定高さまで上昇させる。この時、粘着性シート３は、
加熱ブロック６からの熱伝導で加熱され、この粘着力が
低下することになる。In this state, the heating block 6 heated and held via the heater 7 at a temperature of several tens of degrees Celsius, for example, is placed on the back side of the adhesive sheet 3 as shown in FIG. The semiconductor chip 4 is slightly raised to a predetermined height. At this time, the adhesive sheet 3 is
It is heated by heat conduction from the heating block 6, and this adhesive force decreases.
しかる後、第３図に示すように、ホルダ５を上記加熱ブ
ロック５の押上げを行う駆動機構と連動して上昇させ、
この上端面に設けた突上げピン８で粘着性ソート３を突
き破り、半導体チップ４を持ち上げつつ剥離する。同時
に、この上方に備えた吸着ノズル９の下面に半導体チッ
プ４の上面を当接させ、真空圧を作動させて真空吸引に
よりこれを吸着保持する。Thereafter, as shown in FIG. 3, the holder 5 is raised in conjunction with the drive mechanism that pushes up the heating block 5.
A push-up pin 8 provided on the upper end surface breaks through the adhesive sort 3 and lifts up the semiconductor chip 4 while peeling it off. At the same time, the upper surface of the semiconductor chip 4 is brought into contact with the lower surface of the suction nozzle 9 provided above, the vacuum pressure is activated, and the semiconductor chip 4 is suctioned and held by vacuum suction.
次に、第４図に示すように、ホルダ５及び加熱ブロック
６を駆動機構を介して一体に下降させてるで初期位置で
停止させ、これにより一つの半導体チップ４の剥離作業
を終了するのである。Next, as shown in FIG. 4, the holder 5 and heating block 6 are lowered together via a drive mechanism and stopped at the initial position, thereby completing the peeling operation of one semiconductor chip 4. .
なお、半導体チップ７を剥離するため、剥離する半導体
チップ７の周囲の粘着性シート３を真空後前することに
より、この粘着性シート３の浮き上がりを防止して、突
上げピン８が突き抜は易くしたものにも適応するように
することができる。In addition, in order to peel off the semiconductor chip 7, the adhesive sheet 3 around the semiconductor chip 7 to be peeled is moved back and forth after being vacuumed, thereby preventing the adhesive sheet 3 from lifting up and preventing the push-up pins 8 from punching out. It can also be adapted to be made easier.
また、上記実施例においては、加熱ブロック６による熱
伝導を用いて粘着性シート３を加熱するようにしている
が、外部で温度制御された熱風を加熱ブロックの内部に
設けたノズルから吹き出させて粘着性シート３を加熱す
るようにすることもできる。Further, in the above embodiment, the adhesive sheet 3 is heated using heat conduction by the heating block 6, but hot air whose temperature is controlled externally is blown out from a nozzle provided inside the heating block. The adhesive sheet 3 can also be heated.
本発明は上記のような構成であるので、半導体チップの
大型化に伴い、半導体チップもこの接着面積に比例した
粘着性をもって粘着性シートに貼付けられていても、こ
の粘着性シートの粘着力を低下させて確実に半導体チッ
プを剥離することができる。Since the present invention has the above-described structure, as semiconductor chips become larger, even if the semiconductor chip is attached to an adhesive sheet with adhesiveness proportional to the adhesive area, the adhesive force of the adhesive sheet can be reduced. The semiconductor chip can be reliably peeled off by lowering the temperature.
しかも、強い力で突上げピンを押し上げる必要がないの
で、半導体チップの割れや欠は等のダメージによる不良
発生の要因となってしまことがないばかりでなく、半導
体チップの剥離作業の作業性が低下してしまうこともな
い。Moreover, since there is no need to push up the push-up pin with strong force, not only is there no chance of defects due to damage such as cracks or chips in the semiconductor chip, but the workability of peeling off the semiconductor chip is also improved. It will never drop.
更に、従来の装置をそのまま使用に、これに改良を加え
ることにより、容易に製作することができるといった効
果がある。Furthermore, the present invention has the advantage that it can be easily manufactured by using the conventional device as it is and by adding improvements thereto.
第１図乃至第４図は本発明の一実施例を工程順に示す断
面図、第５図はホルダの平面図、第６図は半導体ウェハ
を保持した状態を示す斜視図である。
１・・・半導体ウェハ、３・・・粘着性シート、４・・
・半導体チップ、５・・・ホルダ、６・・・加熱ブロッ
ク、７・・・加熱用ヒータ、８・・・突上げピン、９・
・・吸着ノズル。
出願人代理人 佐 藤 −雄1 to 4 are cross-sectional views showing an embodiment of the present invention in the order of steps, FIG. 5 is a plan view of the holder, and FIG. 6 is a perspective view showing a state in which a semiconductor wafer is held. 1... Semiconductor wafer, 3... Adhesive sheet, 4...
- Semiconductor chip, 5... Holder, 6... Heating block, 7... Heating heater, 8... Push-up pin, 9...
...Suction nozzle. Applicant's agent Mr. Sato
Claims (1)
剥離する剥離装置において、上下動自在で上記粘着性シ
ートの下方に配置したホルダの内部に、上下動自在で上
端面を剥離する半導体チップの外形より小さく形成した
加熱ブロックを上方に突出させて収容するとともに、上
記ホルダの上端面に上記加熱ブロックの外方に位置して
上記半導体チップの周縁部に当接する突上げピンを突設
したことを特徴とする半導体チップの剥離装置。 ２、上記加熱ブロックの内部に、加熱用ヒータを装着し
たことを特徴とする請求項１記載の半導体チップの剥離
装置。[Scope of Claims] 1. In a peeling device that peels off a semiconductor chip stuck on the surface of an adhesive sheet, a holder that is movable up and down and placed below the adhesive sheet has a holder that is movable up and down and located below the adhesive sheet. A heating block formed to be smaller than the external shape of the semiconductor chip whose end surface is to be peeled is protruded upward and housed therein, and a protrusion located outside the heating block and abutting the peripheral edge of the semiconductor chip is provided on the upper end surface of the holder. A semiconductor chip peeling device characterized by a protruding raising pin. 2. The semiconductor chip peeling apparatus according to claim 1, further comprising a heating heater installed inside the heating block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18936388A JPH067571B2 (en) | 1988-07-28 | 1988-07-28 | Semiconductor chip peeling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18936388A JPH067571B2 (en) | 1988-07-28 | 1988-07-28 | Semiconductor chip peeling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0239452A true JPH0239452A (en) | 1990-02-08 |
| JPH067571B2 JPH067571B2 (en) | 1994-01-26 |
Family
ID=16240069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18936388A Expired - Lifetime JPH067571B2 (en) | 1988-07-28 | 1988-07-28 | Semiconductor chip peeling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH067571B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168064A (en) * | 1999-12-09 | 2001-06-22 | Disco Abrasive Syst Ltd | Member for pushing up pellet and apparatus for picking up pellet |
| DE10117880A1 (en) * | 2001-04-10 | 2002-10-24 | Muehlbauer Ag | Method of isolating electronic components from composite structure e.g. for removing chips from wafer, involves selectively deactivating adhesive in corresponding region prior to removing component |
| US6709543B2 (en) * | 2000-12-11 | 2004-03-23 | Kabushiki Kaisha Toshiba | Semiconductor chip pickup device and pickup method |
| JP2005322724A (en) * | 2004-05-07 | 2005-11-17 | Nitto Denko Corp | Method and apparatus for heating and peeling adherend |
| CN113436988A (en) * | 2020-03-23 | 2021-09-24 | 捷进科技有限公司 | Chip mounting device, peeling jig, and method for manufacturing semiconductor device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0856801A (en) * | 1994-08-18 | 1996-03-05 | Takemori Toyonaga | Knife/spoon |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS592340A (en) * | 1982-06-29 | 1984-01-07 | Fujitsu Ltd | Chip handling method |
-
1988
- 1988-07-28 JP JP18936388A patent/JPH067571B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS592340A (en) * | 1982-06-29 | 1984-01-07 | Fujitsu Ltd | Chip handling method |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168064A (en) * | 1999-12-09 | 2001-06-22 | Disco Abrasive Syst Ltd | Member for pushing up pellet and apparatus for picking up pellet |
| US6709543B2 (en) * | 2000-12-11 | 2004-03-23 | Kabushiki Kaisha Toshiba | Semiconductor chip pickup device and pickup method |
| DE10117880A1 (en) * | 2001-04-10 | 2002-10-24 | Muehlbauer Ag | Method of isolating electronic components from composite structure e.g. for removing chips from wafer, involves selectively deactivating adhesive in corresponding region prior to removing component |
| WO2002089176A3 (en) * | 2001-04-10 | 2004-03-11 | Muehlbauer Ag | Method for separating electronic components from a composite |
| DE10117880B4 (en) * | 2001-04-10 | 2009-01-29 | Mühlbauer Ag | Method for separating electronic components from a composite |
| JP2005322724A (en) * | 2004-05-07 | 2005-11-17 | Nitto Denko Corp | Method and apparatus for heating and peeling adherend |
| CN113436988A (en) * | 2020-03-23 | 2021-09-24 | 捷进科技有限公司 | Chip mounting device, peeling jig, and method for manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH067571B2 (en) | 1994-01-26 |
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