JP2001127490A - Method and device for peeling component from adhesive plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a device for peeling component by which a component is peeled automatically from an adhesive layer. SOLUTION: Under the condition where many components 3 are bonded onto the adhesive layer 2 that is pasted onto a plate 1, the adhesive layer 2 by each component is pushed by a pusher 18, and further the component is sucked by a suction chuck 17 to peel it off, and then it moves to a prescribed position and release the component.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for peeling a chip-type electronic component, such as a ceramic oscillator, a ceramic filter, a chip capacitor, etc., from an adhesive plate, and an apparatus for peeling the chip-type electronic component.

[0002]

2. Description of the Related Art In the process of manufacturing chip-type electronic components such as a ceramic oscillator and a ceramic filter,
Usually, an elastic sticky substance such as silicon rubber is stuck on a plate made of a metal plate such as SUS, and each step is moved by aligning each component on the plate with a weak adhesive state. When a predetermined process is completed, these components are peeled off from the adhesive layer by a jig and transferred to the next process. For example, when the next step is an inspection step, the parts peeled off from the adhesive layer are moved to a parts feeder, where they are aligned in a certain direction and moved to an inspection machine via a linear feeder.

Conventionally, in the above-mentioned process, in order to peel off the components adhered to the adhesive layer, each component has been manually peeled off using a squeegee as shown in FIG. In the figure, 1 is a plate made of SUS, 2 is an adhesive layer made of silicone rubber, 3 is a component, and 4 is a squeegee.
As shown in the figure, if the tip of the squeegee 4 is pressed against the adhesive layer 2 and moved in the direction of the arrow in the figure, the part 3 in a weakly adhered state is peeled off the adhesive layer 2 and falls downward. become.

[0004]

However, according to the above-mentioned method, since the operation of the squeegee 4 itself is manual, the workability is poor, and the parts 3 that have fallen downward are disjointed. For example, it has to be manually set in the next step, for example, in the parts feeder, and the directionality is also different, so that re-alignment is required. Furthermore, since the component 3 falls downward, there is a problem that the component 3 is damaged or defective due to an impact at the time of dropping.

[0005] It is an object of the present invention to provide a method and an apparatus for peeling a part, which can automatically peel the part from the adhesive layer.

[0006]

The present invention has the following arrangement to solve the above-mentioned problems.

(1) With a large number of components adhered on the elastic adhesive layer attached to the plate, the adhesive layer near each component is pushed in with a pusher such as a pin, and further from above. It is characterized in that the component is sucked off by a suction nozzle and peeled off.

In the present invention, instead of using a squeegee as shown in FIG. 6 to drop components, attention is paid to the fact that each component is adhered to the adhesive layer in a weak adhesive state, and this component is pushed using a pusher. Each component is sucked from above by the suction nozzle by weakening the bonding state. Here, the condition is that the suction force by the suction nozzle is larger than the adhesive force that is reduced by being pushed by the pusher.

As described above, the components are peeled off from the adhesive layer with an adsorbing force exceeding the adhesive force that is alleviated by pushing the adhesive layer with a pusher such as a pin, so that each component can be separated from the adhesive layer without using a squeegee. Can be peeled off. In this case, since the component is sucked to the tip of the suction nozzle, the component peeling can be automated, and the component can be accurately moved to an arbitrary position by moving the suction nozzle. Is shortened, and since there is no dropping of parts, damage and failure due to impact can be eliminated.

(2) With a large number of components adhered on the elastic adhesive layer attached to the plate, a force is applied to each component in the lateral direction with a pusher such as a pin.
Next, the pusher is rotated, and the component is suctioned from above by a suction nozzle and peeled off.

In the above method (1), the relaxation of the adhesive force by pushing the pusher is used. In the present invention, the pusher is moved in the lateral direction so that the adhesive portion between the component and the adhesive layer is moved in the lateral direction. A shear stress is generated so that the component is easily peeled off from the adhesive layer, and then, by rotating the pusher, a moment force is generated to reduce the adhesive force between the component and the adhesive layer. When the component is sucked from above by the suction nozzle in this state, the component is sucked by the suction nozzle because the adhesive force is reduced.

(3) One operation of the pusher and the suction nozzle is performed for one row of components.

[0013] By performing one operation of the pusher according to the above (1) and (2) in units of a row of components, the components can be peeled off from the adhesive layer at once while maintaining the alignment of the components. As a result, it is possible to hold and pass the aligned state to the next step.

[0014]

FIG. 1 is a schematic structural view of a component peeling apparatus according to an embodiment of the present invention.

A tray 4 to which a number of components are adhered is disposed below the component peeling device.

As shown in FIG. 6, the tray 4
An adhesive layer 2 made of silicon rubber is uniformly attached on a plate 1 made of US, and components 3 are adhered at regular intervals on this. Unlike the conventional method of FIG.
In this device, the tray 4 is arranged upward, and the component 3 and the device are arranged so as to face each other.

In the component peeling device, the moving body 10 is capable of moving the X-axis frame 11 in the lateral direction (the direction of the arrow A or B in the figure), and is controlled by a control unit 12 (not shown).
Is performed in the X direction.

The moving body 10 includes a cylinder base 13,
Cylinders 15 and 16 are attached to these cylinder bases 13 and 14, respectively, and can be driven in the vertical direction. The cylinder 15 is L-shaped, and a suction chuck 17 is attached to the tip of the cylinder 15. A pusher 18 is attached to the tip of the cylinder 16. Each of the suction chuck 17 and the pusher 18 is in the form of a substantially flat plate extending in a direction perpendicular to the plane of the drawing, and has a width substantially equal to the width of the tray 4 in a direction perpendicular to the plane of the drawing.

In the above configuration, each component on the tray 4 is peeled off from the adhesive layer 2 by repeating the following steps (1) to (5).

(1) The control unit 12 controls the position of the moving body 10 so that the suction chuck 17 is located on the upper surface of the component 3 located on the rightmost side on the tray 4. In the direction perpendicular to the X-axis frame 11 (Z direction) and the direction perpendicular to the paper surface (Y direction), the positional relationship between the tray 4 and the apparatus is determined by a positioning unit (not shown). Numeral 12 positions the moving body 10 only in the X direction.

(2) Suction chuck 1 by cylinder 15
7 is lowered to bring its tip into contact with the upper surface of the component 3.
FIG. 2A shows the state at this time. Note that part 3
The mounting position of the pusher 18 is determined such that the distance between the pusher 18 and the pusher 18 is about 0.1 to 0.5 mm.

(3) Subsequently, the pusher 18 is lowered,
The adhesive layer 2 is pushed in at the tip. At the same time, the suction chuck 17 is evacuated by a device (not shown) to suck the component 3.
At this time, since the pressure-sensitive adhesive layer 2 is pushed in by the pusher 18, the pressure-sensitive adhesive layer 2 on the side of the component 3 becomes concave, and the bonding start surface of the component 3 is released. As a result, the adhesive force for adhering the parts 3 is reduced, so that the suction chuck 1
7 is greater than the adhesive force. FIG.
(B) shows this state.

(4) Subsequently, while the pusher 18 is pushed in, the suction chuck 17 is moved by the cylinder 15.
To rise. Since the suction force of the suction chuck 17 at this time exceeds the reduced adhesive force, the component 3 rises in the suction state by the lifting of the suction chuck 17. FIG. 2C shows the state at this time.

(5) Next, the pusher 18 is raised. FIG. 2D shows the state at this time.

The above-described steps (1) to (5) are performed as one operation of the apparatus for each row in the X direction. Since a plurality of components 3 are arranged in the column direction, all of the components in the column direction can be peeled off from the adhesive layer 2 at one time by performing the above-described one operation. After completing the step (5),
The moving body 10 moves in the X direction to a predetermined position, and the suction chuck 17 that has sucked the component 3 is lowered to place each component at the predetermined position. At this time, since the positional relationship between the components 3 in the row direction holds the positional relationship arranged on the tray 4, it is not necessary to perform the positioning again. of course,
It is also possible to perform the above-described operation in units of one component, instead of units in one row.

Since the adhesive force of the component 3 when the pusher 18 is pushed in varies depending on the position of the pusher 18 with respect to the suction chuck 17 in the X direction, the mounting position of the pusher 18 in the X direction can be finely adjusted. With this configuration, it is possible to set the optimal position of the pusher 18 without failing to remove the component.

FIG. 3 is an enlarged perspective view showing the state shown in FIG. In the region indicated by P in the figure, peeling has occurred between the bottom surface of the component 3 and the adhesive layer 2, whereby the adhesive force of the component 3 is reduced.

FIG. 4 shows a component peeling apparatus according to another embodiment of the present invention.

In this apparatus, a force is applied to the component by a pusher in the lateral direction, then the pusher is turned to exert a moment, and the component is sucked from above by a suction nozzle and peeled off.

The moving body 10 which is controlled to move in the A or B direction on the X-axis frame 11 by the control unit 12 is provided with three cylinders 23 to 25. These cylinders 23 to 25 are attached to cylinder bases 20 to 22, respectively.

The cylinder 23 has an L-shape, and a suction chuck 26 is provided at the tip thereof. Cylinder 2
A turning plate 27 is rotatably attached to the tip of the rotary plate 4, and a pusher 28 is integrally provided at the tip of the turning plate 27. The tip of the cylinder 25 is in contact with the free end of the rotating plate 27.

With the above arrangement, the suction chuck 26 is raised or lowered by the vertical movement of the cylinder 23, and the pusher 28 is raised or lowered by the vertical movement of the cylinder 24. The rotation plate 2 is moved by the vertical movement of the cylinder 25.
7 rotates, whereby the pusher 28 rotates.

The above apparatus repeats the following steps (1) to (4) as a set of operations. (1) The control unit 12 moves the moving body 10 to an appropriate position in the X direction. As in the embodiment shown in FIG. 1, the tray 4 is aligned with the apparatus in the Z direction and the Y direction perpendicular to the paper surface.

(2) Pusher 2 by cylinder 24
8 is lowered so that its tip faces the side surface of the component 3. FIG. 5A shows the state at this time.

(3) The control unit 12 controls the moving body 10
The shaft 3 is moved in the direction B, and the side of the component 3 is pressed by the tip of the pusher 28. As a result, a lateral shear stress is generated on the contact surface of the component 3 with the adhesive layer 2.

(4) The suction chuck 26 is lowered by the cylinder 23, and the tip of the suction chuck 26 contacts the upper surface of the component 3. As a result, the component 3 is suctioned by the suction chuck 26. FIG. 5C shows a state immediately before the suction state.

(5) Pusher 2 by cylinder 25
8 is rotated several degrees to several tens degrees clockwise. Thereby, a bending moment force acts on the component 3, and the adhesive force of the component 3 to the adhesive layer 2 is reduced. If the suction force of the suction chuck 26 exceeds the relaxed adhesive force, the part 3 becomes the adhesive layer 2.
It is in a state where it is peeled off from. FIG. 5D shows the state at this time.

Thereafter, the suction chuck 26 is raised (at this time, the part 3 is also suctioned and raised), and the pusher 28 is returned to the initial state (by raising the cylinder 25, the spring is not shown). The pusher 28 rotates counterclockwise and is raised by the cylinder 24). As in the embodiment shown in FIG. 1, the suction chuck 26 and the pusher 28
Therefore, the peeling operation is performed on all the components in one row at a time by the above-mentioned one operation. When the stripping operation of one row of components is completed, the moving body 10
To the position of the next row of parts, and again
Repeat the operation. It is appropriate that the distance the pusher 28 moves in the direction B in the step (3) is about 0.5 to 1 mm. If it is more than this, the part 3 is
There is a possibility that the film may be peeled off and moved to the left (in the direction B) before the suction by 6. To prevent this, first, the suction chuck 26 may be lowered to suck the component 3, and the pusher 28 may be moved to the left in this state.

[0039]

According to the present invention, since the component can be automatically peeled off from the adhesive layer, the conventional manual operation is not required. In addition, since the peeled component can be moved to a predetermined position and released while being sucked by the suction nozzle, all the operations up to the next step can be automated. In addition, since the components do not drop as in the related art, even components that are vulnerable to impact can be handled without damage or failure. Furthermore, since the processing can be performed as a unit of one row of components, it is possible to take the next process without breaking the alignment between the components. Thereby, it is possible to reduce both the process time and the cost.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a component peeling apparatus according to a first embodiment of the present invention.

FIG. 2 shows the operation of the apparatus.

FIG. 3 is a perspective view of the apparatus during operation.

FIG. 4 is a schematic configuration diagram of a component peeling device according to a second embodiment of the present invention.

FIG. 5 is a diagram showing the operation of the apparatus.

FIG. 6 is a diagram showing a conventional method of peeling parts.

[Explanation of symbols]

 1-plate 2-adhesive layer 3-parts 4-tray 17-suction chuck 18-pusher

Claims (6)

[Claims] In a state in which a large number of components are adhered to an elastic adhesive layer attached to a plate, an adhesive layer near each component is pushed in with a pusher such as a pin, and further pressed from above. A method of peeling a component from an adhesive plate, wherein the component is sucked and peeled off by a suction nozzle. 2. With a large number of components adhered on an elastic adhesive layer attached to a plate, a force is applied laterally to each component with a pusher such as a pin. A method of peeling a component from an adhesive plate, comprising rotating the component and sucking the component from above with a suction nozzle. 3. The method for peeling a component from an adhesive plate according to claim 1, wherein one operation of the pusher and the suction nozzle is performed for one row of components. 4. An apparatus for peeling off each component in a state where many components are adhered on an elastic adhesive layer attached to a plate, wherein a pusher such as a pin for pushing an adhesive layer near each component is provided. And a suction nozzle for sucking and peeling off a component having a reduced adhesive force by being pushed in from above, thereby removing the component from the adhesive plate. 5. An apparatus for peeling off each part in a state where many parts are adhered on an elastic adhesive layer stuck on a plate, applying a force in a lateral direction of each part, and then rotating. A component peeling device from an adhesive plate, comprising: a pusher such as a pin to be rotated; and a suction nozzle that sucks and peels a component to be turned up by rotation from above. 6. The pusher and the suction nozzle,
The device for peeling parts from an adhesive plate according to claim 4 or 5, wherein the apparatus has a width which can be processed at a time in units of parts in a row.